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Memory giants hold US$38 billion in cash collateral as buyer leverage may return in 2029

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Fudan researchers unveil room-temperature single-electron memory using 2D materials

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SiS to transfer production to 0.13-micron process in 3Q

Charles Chou, Taipei

Jun 27, 2002, 17:11 0

Chipset designer Silicon Integrated Systems (SiS) announced that it will start transferring to the 0.13-micron process at its 8-inch fab in the third quarter...

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EDOM Accelerates Edge AI Deployment with NVIDIA Technologies

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