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Hynix launches FBGA CSP DRAM

Compiled from outside sources by Hsu Chia-hui, Research Center; Noah Sauve, DIGITIMES Asia 0

Hynix Semiconductor announced the launch of its small-scale DRAM packaged with FBGA (frame ball-grid array) CSP (chip-scale package) technology. The company has already completed the set-up of operations for volume production of 2.5-volt, 128Mbit DRAM...

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