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Back-end semiconductor businesses looking far into the future for profits

Carol C.Y. Hsu, Hsinchu; Ken Dawson, DIGITIMES Asia Thursday 14 June 2001 0

Prices for back-end semiconductor BGA substrate material supplies, packaging and testing have been dropping through the second quarter of 2001. The price of BGA substrates is down 15-20%, packaging 10% and testing 20-30%. When added to the problems...

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