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HKDEA's "Future Animation - AI-Assisted Animation Production Pilot Scheme" Presents original animations at Annecy International Animation Film Festival and MIFA
Kantar BrandZ 2024 Rankings: Haier Leads for the Sixth Consecutive Year as Premier IoT Ecosystem Brand
iSHANG and PSC Insurance Collaborate on Web3 "Proof of Coverage" Insurance Solution under Cyberport Web3 Proof-of-Concept Subsidy Scheme
Hon Hai Technology Group (Foxconn) Strengthens Sustainability With Independent Audits At 8 Manufacturing Sites
Milestone Achieved: World's Largest Offshore Wind Turbine Successfully Grid-Connected
Huawei: #3 in Thai IaaS Market by revenue in 2023, One of the Fastest-Growing Clouds Globally
Mnemonic Electronic Debuts at COMPUTEX 2024, Embracing the Era of High-Capacity SSDs
The Third Hong Kong Science Fair Gathers Creative Technologies of the Next Generation
Leading the Way to a Greener Future: Shanghai Electric Unveils Advanced Renewable Energy Solutions at Carbon Neutrality Expo
Tobii launches Glasses Explore - making human behavioral insights more accessible
Emdoor DIGI participated in Taipei Computex, and its cutting-edge technology products attracted much attention
Biwin Unveils New Consumer Brand at Computex 2024
Trend Micro Launches World's First Security Solutions for Consumer AI PCs
Linq's AI Retrieval Model Achieves the Top Spot on the HuggingFace MTEB Leaderboard
Optoma AZU517ST offers a new experience for golf and home entertainment
TYAN Presents AMD EPYC Server Platforms Optimized for Data Center Compute Performance and Large-Scale AI/HPC Infrastructure at COMPUTEX 2024
ViewSonic Showcases Innovations for Future Workplace and Classroom at its Visual Solution Forum
Next-Gen Computing: MiTAC and TYAN Launch IntelR XeonR 6 Processor-Based Servers for AI, HPC, Cloud, and Enterprise Workloads at COMPUTEX 2024
Patriot Memory Pushes Performance Boundaries at Computex 2024
State Grid Shandong Yucheng Power Supply Company: supporting Green, Low Carbon, and High Quality Development to Reach a New Speed
ICP Pioneering the Future of Decentralized AI Development
ASRock Rack Launches New Servers Supporting the NVIDIA Blackwell Architecture at COMPUTEX 2024
Singapore Launches Project Moonshot - a Generative Artificial Intelligence Testing Toolkit to address LLM safety and security challenges
Trane Technologies Accelerates Growth through Leading Sustainability Performance
P&C Solution to Participate in AWE USA 2024 with XR Glasses Powered by Snapdragon
Singapore Invests Close to S$300 million in National Quantum Strategy and Announces Green Data Centre Roadmap for Sustainable Growth
Aetina Showcases Next-Gen Edge AI Solutions at COMPUTEX 2024
Getac Announces World's First AI-Ready Rugged Laptop
Sinopec Releases Reports Offering Outlooks of China's Energy, Hydrogen and Chemical Development
ZOTAC to Debut Limit-Pushing Handheld Gaming PC and Showcase AI-Centric Computing Solutions at COMPUTEX 2024
GIGABYTE Pioneers AI PC Market with AI Innovations and Leading Silicon Partnerships
Philippines DITO Hits Major Milestone: Phase One of 5G SA Core Network Self-Owned Data Center Relocation Successfully Completed
European Journalists to Explore Industry-Transforming Innovation at World's Top EV Laboratory
FSP Group to Showcase Edge AI, Network Communication and USB PD Power Solutions at Computex 2024
PolyU research finds improving AI large language models helps better align with human brain activity
European Journalists to Explore Industry-Transforming Innovation at World's Top EV Laboratory
AVPN and Google.org Announces USD 15-Million AI Opportunity Fund: Asia-Pacific to Empower Workers in APAC for the AI-Driven Future
NEC Thailand Partners with AIRA Factoring to Enhance Digital Supply Chain Finance Services
Unlock the Future of Innovation: Taiwan's Premier Hardware Expo Hits the Global Stage This October
OutSystems Appoints Luis Blando as Chief Product and Technology Officer
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TSMC locks in 3-6% wafer out price hikes for 2027
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GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
Nvidia's Rubin expected to use mostly 12-layer HBM4 despite reported 8-layer shift
Korean memory makers accept ASML parts price hike, leaving TSMC as the open question
Applied Materials tracks 100-plus fabs as cleanroom capacity limits equipment growth
Lite-On unveils 800 VDC power and liquid cooling for AI data centers
GlobalFoundries wins US$21 billion US-Japan deal to build, operate two New York fabs
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