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Linq's AI Retrieval Model Achieves the Top Spot on the HuggingFace MTEB Leaderboard
Optoma AZU517ST offers a new experience for golf and home entertainment
TYAN Presents AMD EPYC Server Platforms Optimized for Data Center Compute Performance and Large-Scale AI/HPC Infrastructure at COMPUTEX 2024
ViewSonic Showcases Innovations for Future Workplace and Classroom at its Visual Solution Forum
Next-Gen Computing: MiTAC and TYAN Launch IntelR XeonR 6 Processor-Based Servers for AI, HPC, Cloud, and Enterprise Workloads at COMPUTEX 2024
Patriot Memory Pushes Performance Boundaries at Computex 2024
State Grid Shandong Yucheng Power Supply Company: supporting Green, Low Carbon, and High Quality Development to Reach a New Speed
ICP Pioneering the Future of Decentralized AI Development
ASRock Rack Launches New Servers Supporting the NVIDIA Blackwell Architecture at COMPUTEX 2024
Singapore Launches Project Moonshot - a Generative Artificial Intelligence Testing Toolkit to address LLM safety and security challenges
Trane Technologies Accelerates Growth through Leading Sustainability Performance
P&C Solution to Participate in AWE USA 2024 with XR Glasses Powered by Snapdragon
Singapore Invests Close to S$300 million in National Quantum Strategy and Announces Green Data Centre Roadmap for Sustainable Growth
Aetina Showcases Next-Gen Edge AI Solutions at COMPUTEX 2024
Getac Announces World's First AI-Ready Rugged Laptop
Sinopec Releases Reports Offering Outlooks of China's Energy, Hydrogen and Chemical Development
ZOTAC to Debut Limit-Pushing Handheld Gaming PC and Showcase AI-Centric Computing Solutions at COMPUTEX 2024
GIGABYTE Pioneers AI PC Market with AI Innovations and Leading Silicon Partnerships
Philippines DITO Hits Major Milestone: Phase One of 5G SA Core Network Self-Owned Data Center Relocation Successfully Completed
European Journalists to Explore Industry-Transforming Innovation at World's Top EV Laboratory
FSP Group to Showcase Edge AI, Network Communication and USB PD Power Solutions at Computex 2024
PolyU research finds improving AI large language models helps better align with human brain activity
European Journalists to Explore Industry-Transforming Innovation at World's Top EV Laboratory
AVPN and Google.org Announces USD 15-Million AI Opportunity Fund: Asia-Pacific to Empower Workers in APAC for the AI-Driven Future
NEC Thailand Partners with AIRA Factoring to Enhance Digital Supply Chain Finance Services
Unlock the Future of Innovation: Taiwan's Premier Hardware Expo Hits the Global Stage This October
OutSystems Appoints Luis Blando as Chief Product and Technology Officer
Global Innovators Gather at BEYOND Expo 2024 Opening Ceremony to Discuss the Future of Technology
Lion Group Holding Plans to Use GPT-4o to Enhance Products and Services
Timekettle Pushes Boundaries at AI Expo Tokyo, Showcasing Products and Solutions for Cross-Language Communication
ASML's secret sauce for semiconductor success amid challenges in the Angstrom Era
Trinasolar protects global biodiversity with solar energy
South Korea's leading AI startup, Crowdworks AI, participates in 'VIVATECH 2024'KTarget the European AI Market
Mitsui Bussan Secure Directions, Inc. launches Blackpanda IR Retainer, a cyber incident emergency response retainer service
TotalMedia Debuts Groundbreaking "Ultra HD + AI" Video Encoder Series at Broadcast Asia in Singapore
Microsoft collaborates with Enterprise Singapore, AI Singapore, and the Infocomm Media Development Authority to accelerate AI transformation for SMEs with AI Pinnacle Program
Volkswagen Kicks Off High-Speed EV Charging Network in Taiwan, Powered by Noodoe EV OS
JA Solar Supplies 480MW PV Modules to the Largest PV Project in Chile
ARTERY Achieved IEC-60730 Compliance for AT32 MCUs to Guarantee High Performance and Safe Operation
Charge up to 80% in just 9.8 minutes! Gotion High-tech unveiled new products and new technology.
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MULTIMEDIA
PART 2! What did CEOs read in 2025?
MOST-READ
7 DAYS NEWS
TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises
TSMC expands CoWoS capacity with Nvidia booking over half for 2026-27
Samsung and SK Hynix align 2026 DRAM strategies
Google and Microsoft prioritize speed over cost as CSPs scramble for memory
Google TPU demand remains strong, but CoWoS and memory cap 2026 production
Commentary: Nvidia's Groq deal reshapes semiconductor industry in 3 key ways
Samsung reportedly explores side-by-side chip packaging for next-gen Exynos
China capacity expansion and weakening end-market demand prompt cost reductions for 28nm process
2026 AI server demand tied to profitable AI as unmonetizable projects stall
Spirox to ship self-developed TSV inspection equipment in 1H26, easing wafer fab bottlenecks
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