Connected devices for a diversity of applications are burgeoning thanks to widespread availability of 4G communication. As these connected devices are everywhere in our daily lives, any product security vulnerability could result in data breach and comprise user privacy...
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, has revealed that its low-power, high-performance LPDDR4X DRAM technology is supporting the latest breakthrough in edge computing from Flex Logix for demanding artificial intelligence (AI) applications such as object recognition.
Digital transformation of the manufacturing sector driven by Industrial Internet of Things (IIoT) and autonomous driving enabled by Internet of Vehicles (IoV) are key focus areas of today's industrial development and they offer tremendous business opportunities...
Fibocom, a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, releases its latest 5G LGA module FG360 during the CES 2021 event. The module is based on the MediaTek chipset platform and will be available in two versions. FG360-EAU will be launched for EMEA/APAC markets, and FG360-NA will be launched for the North American market.
LitePoint, a US-based wireless test solution provider, offers turnkey over-the-air test solutions from development to production, combined with software automation that makes testing of FR2 devices easy in both characterization as well as volume manufacturing.
MSI, a world leader in gaming hardware and computing solutions, unveils an innovative lineup of gaming, creator and business products at its virtual launch event, "MSI Premiere 2021: Tech For the Future".
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that FPGA manufacturer Gowin Semiconductor has embedded a Winbond 64Mb HyperRAM fast memory device in its new GoAI 2.0 machine learning platform.
Looking back through the year, smart production can be regarded as a global development trend. Covid-19 outbreak has hit the global manufacturing supply chain...
In 2021, there's opportunity for growth in many markets, especially automotive, 5G and IoT, and new component releases hitting the market. However, challenges lie ahead.
Orbotech, a KLA company, has announced two new roll-to-roll (R2R) manufacturing solutions for flexible printed circuit (FPCs), enabling the design and mass production of new generations of electronic devices, including 5G smartphones, advanced automotive and medical devices.
