Chenbro (TWSE: 8210), a pioneer in the design and manufacturing of own-brand rackmount systems, is thrilled to unveil the SR215 tower server chassis, meticulously designed to meet diverse market needs in artificial intelligence (AI), machine learning (ML), and data processing. With the product launch of SR215, Chenbro has completed its SR series of AI tower server enclosures, including the SR113 and SR115, and is now fully equipped to address evolving customer and market demands.Global AI Server Demand SurgesWith the growing demand for AI workstations, applications such as data science, rendering, and visual design have become indispensable for AI servers. These applications encompass developing AI/ML models, 3D simulation, advanced visual development, rendering, data science, professional visualization, and high-quality video streaming. In response to these trends, Chenbro's 4U AI server chassis product portfolio offers developers and small-to-medium-sized businesses (SMBs) enhanced computing capabilities through IT architecture designed to handle extensive datasets efficiently.Chenbro's first 4U rackable tower server chassis, the SR113, was introduced in 2021 to address the needs of AI and machine learning applications with its powerful multi-GPGPU and storage configurations. It supports up to five double-width GPGPU cards, making it ideal for high-performance computing tasks. Following this, the SR115 and SR115LCooling solutions were launched, expanding Chenbro's 4U rackable tower server lineup to cater to a range of needs from general AI workloads to high-performance data processing, with enhanced cooling options.Now, Chenbro introduces the SR215 pedestal server enclosure, a cost-effective tower server chassis designed for workstations and small enterprise environments. The SR215 offers flexible storage configurations and comprehensive security features, making it a versatile solution for various IT needs. All of Chenbro's AI tower server chassis, including the SR215, support the SK628 2.5" NVMe hot-swap storage kit for expanded storage options. Additionally, Chenbro provides various hot-swap backplane solutions supporting Gen3 NVMe, SAS-SATA, and Gen5 NVMe.The entry-level workstation of AI servers: SR215 tower server chassis The SR215 is a versatile 20" short-depth tower server chassis designed to be a cost-effective yet capable solution for various applications, from enterprise to edge AI deployments. It supports mATX and ATX motherboards and offers options for a 1200W ATX PSU or an 800W 1+1 CRPS. The SR215 includes two replaceable 5.25" drive bays, one 3.5" drive bay, and cooling solutions featuring two 8025 fans at the rear and two 8038 fans at the front, ensuring optimal thermal performance across various configurations.Aligned with the SR113 and SR115 design, the SR215 incorporates comprehensive security features, including key locks, intrusion switches, and Kensington security slots, to safeguard IT assets. This chassis suits SMBs and enterprises seeking a reliable and adaptable IT solution.The mainstream option of AI servers: SR115 rackable tower server chassisThe SR115 is designed as a general-purpose workstation chassis, catering to a wide range of workload demands from low to high, making it ideal for small-to-mid-size enterprises. It supports EEB, ATX, and mATX motherboards and offers options for a single ATX PSU and redundant CRPS. The SR115 features eight PCIe slots, accommodating double-width GPU cards, and provides flexible storage solutions with internal and external 2.5" and 3.5" drive bays, ensuring high storage capacity for data-intensive and AI applications.The SR115LCooling variant includes a liquid cooling system that manages high-end GPUs within a tower form factor. An optional 12cm liquid cooling module enhances the CPU's thermal management, improving performance.SR113 and SR115 offer versatile deployment options, including rackmount and pedestal designs. This flexibility ensures that the SR115 is suitable not only for SMEs and developers with immediate needs but also for medium-to-large enterprises requiring future scalability. Its adaptable design facilitates easy installation in data centers or IDC server rooms without wasting valuable cabinet space.The top choice of AI servers: SR113 rackable tower server chassis The SR113 is an excellent choice for AI and machine learning applications, accommodating up to five double-width GPGPU cards. It supports CRPS and ATX PSUs (EEB SKU), making it ideal for deep learning tasks requiring substantial computing power.The SR113 is renowned for its exceptional flexibility and compatibility, featuring proprietary motherboard support with an 11-slot SKU for up to five GPGPU cards. For users employing standard ATX motherboards, the chassis can also support four GPGPU cards. Additionally, it supports SSI EEB motherboards and allows for installing up to eight full-height PCIe expansion cards.To ensure stable operation, the SR113 is equipped with four hot-swap fans located centrally, with optional additional fans providing enhanced cooling for maximum expansion card configurations. This design supports optimal system thermal performance across various setups. The chassis also features two 5.25" media bays, one 3.5" drive bay, and options for two 4-bay 3.5" hot-swap SAS/SATA drives and an optional eight 2.5" SAS/SATA drives, offering significant configuration flexibility.Powering the scale of artificial intelligenceChenbro's 4U AI tower server chassis product line offers diverse solutions for enterprises engaged in HPC/AI training, deep learning, machine learning, 3D simulation and animation, scientific analysis, and big data environments. Chenbro's comprehensive Reference Motherboard Program ensures broad motherboard compatibility. Please get in touch with Chenbro's regional sales team or your local channel partner for business inquiries. For more information, please visit http://www.chenbro.com.

Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence (AI), and high-performance computing (HPC).Taipei, Taiwan – August 28, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, shares its expertise on the impact materials have on sustainable lithography processes. Additionally, Brewer Science presents the role innovative materials have in the critical advanced packaging markets, including artificial intelligence (AI) and high-performance computing. Brewer Science's presentations and exhibition will be at SEMICON Taiwan, from September 4 - 6, 2024.Material Efforts Towards Sustainable ProcessesDr. Douglas Guerrero, Brewer Science's Senior Technologist, presents "Material Efforts Towards Sustainable Processes" addressing the industry's most critical questions when it comes to balancing technology innovation with environmental stewardship, including:How can the semiconductor industry enhance sustainability while meeting growing consumer demands for eco-friendly practices? What innovative solutions are available to reduce energy consumption in EUV lithography processes? Can transitioning from thermal baking to UV curing improve energy efficiency and lithographic performance? What are the benefits of optical crosslinking in semiconductor manufacturing, and how does it optimize material design, process efficiency, and tool throughput?With 30 years of R&D experience in patterning materials and processes, over 20 patents, and 60 publications, Dr. Guerrero combines material expertise and industry leadership to present how sustainable processes can lead to energy savings, while improving tool throughput and maintaining lithographic performance. Attend Dr. Guerrero's presentation on September 6 at 2:20 pm in 401, 4F at SEMICON Taiwan, as part of the IC Forum - Advanced Chip Technology and Manufacturing.The Role of Cutting-edge Materials in Advanced Packaging in AI and High-Performance ComputingMr. Alexander Smith, Brewer Science's Executive Director of the Semiconductor Materials Business Unit, presents "The Role of Cutting-edge Materials in Advanced Packaging in AI and High-Performance Computing," providing an insightful review of the challenges and advancements in packaging materials enabling more efficient and cost-effective flows. Mr. Smith will highlight chemical properties and customizable structures that will offer the most innovative solutions to pressing industry challenges. Attend Mr. Smith's presentation on September 6 at 12:00 pm in 701GH, 7F at SEMICON Taiwan, a part of the Heterogeneous Integration Global Summit 2024 – Day 3.Explore New Innovations in Advanced Packaging at Booth I2116Throughout the events, Brewer Science's experts will be stationed at booth I2116 in the SEMICON Taiwan Exhibit Hall and available for discussions on how Brewer Science's materials assist with advanced-node patterning and wafer thinning. A list of Brewer Science's PFAS-Free Materials is also available.Wednesday, September 4: 10:00 am–5:00 pm Thursday, September 5: 10:00 am–5:00 pm Friday, September 6: 10:00 am–4:00 pmFor those unable to attend, Brewer Science extends an open invitation to explore its Packaging Solutions and Advanced Lithography webpages. You can also request datasheets or schedule expert-led consultations on Brewer Science's website. www.brewerscience.com.About Brewer ScienceBrewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we've expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at www.brewerscience.com.Company Contact Information:Nathan AyresTel: (US) +1.573.364.0300, ext. 1923Email: nayres@brewerscience.comView this announcement on our website.

Global leading single-crystal diamond technology enters the CMP process application marketTaiwan - As the semiconductor industry continues to advance, the demand for precision processing becomes increasingly critical.Dr. Song, a global leader in the development of semiconductor process consumables, recently announced the launch of a revolutionary product—a new generation of single-crystal diamond disks. This product is poised to transform the technical standards of Chemical Mechanical Planarization (CMP) processes. The new generation of diamond disks surpasses existing products in performance and marks the first global application of single-crystal diamond technology in CMP process consumables, heralding a new chapter in CMP technology.Technical breakthrough: Single-crystal diamond laser-cut pyramid tipsThe birth of the new generation of single-crystal diamond disks is attributed to cutting-edge single-crystal diamond manufacturing technology. Traditional CMP consumable products largely rely on polycrystalline synthetic diamonds.However, the newly launched single-crystal diamond disk achieves an extreme pyramid tip structure through precise laser-cutting technology. This structure not only enhances the disk's durability and wear resistance but also provides more stable cutting forces during processing, significantly improving the accuracy and efficiency of the CMP process.The single-crystal diamond laser-cutting technology is key to this breakthrough. This technology ensures that the height, angle, and spacing characteristics of each diamond apex are entirely stable and controllable. Additionally, it allows for customized design and manufacturing according to specific customer requirements, providing optimal solutions for various CMP processes.Customized design and manufacturing to meet diverse process needsThe new generation of single-crystal diamond disks excels in standardized products and offers a high degree of customization in design and manufacturing. This product can be tailored and optimized for various CMP process needs, ensuring that every process step achieves optimal results. This highly flexible design capability enhances the product's market adaptability and provides more options for enterprises of different scales.Currently, the new generation of single-crystal diamond disks has entered the trial phase with several semiconductor process manufacturers. The disks exhibit high precision and stability in grinding effects, based on characteristics such as apex height, angle, and spacing uniformity, and have received initial positive feedback. In the future, this product is expected to be further promoted in the global semiconductor process application market, providing strong support for technological upgrades in the global semiconductor industry.( https://www.morglory.com.tw/en/homepage.php )Morglory launches new single-crystal diamond disks. Credit: Morglory

In a significant leap forward for semiconductor manufacturing, ifm, a global leader in sensor technology, exhibited a comprehensive suite of smart sensing solutions at SEMICON Taiwan 2024. These innovations underscore ifm's formidable expertise in enhancing productivity and optimizing quality in semiconductor processes.According to Wan-Rou Ma, Key Industry Sales Manager at ifm, the showcased solutions including a digital chemical supply system, equipment condition monitoring, assembly inspection applications, and cooling solutions, mark a shift from isolated monitoring to holistic smart management. Leveraging IO-Link technology, AI-driven predictive maintenance, and cutting-edge cooling fluid quality monitoring, ifm is enabling semiconductor manufacturers worldwide to realize their smart manufacturing ambitions.The products featured this year are all equipped with IO-Link capabilities, offering enriched system diagnostics that streamline configuration and maintenance while enhancing data transmission reliability and flexibility. One of the highlights includes the Auto Teach feature within the digital chemical systems, enabling batch configuration of capacitive sensors with a single click, significantly reducing human error and enhancing fab efficiency.Moreover, ifm's non-contact continuous level monitoring technology uses capacitive sensing to detect levels through non-metallic container walls, ensuring sensor longevity by avoiding direct contact with corrosive acids or bases. This not only extends sensor life but also preserves the purity of chemicals.In terms of semiconductor back-end packaging and testing, ifm's solutions focus on two main applications: all-in-one vision systems and wafer inspection. For all-in-one vision systems, the O2I series multi-code reader features 1D and 2D barcode reading, character recognition, and font identification. It maintains high recognition stability in complex environments such as metal interference, external light sources, or reflective surfaces, significantly improving production line efficiency and accuracy.For wafer placement inspection, the O2U5 series dual-function vision sensor accurately detects wafer tilt in narrow, low-light environments, effectively preventing wafer misalignment caused by lift pin operation anomalies. ifm application engineer Chien-chung Chen mentioned that this system can simultaneously inspect the surface and contour of the object under test, perform quality checks, and track wafer position in real time, enhancing process stability and yield. This brings multiple values to semiconductor customers, including increased production efficiency, enhanced quality control, and reduced loss rates.Regarding the recent industry-focused server cooling applications, ifm showcased a complete solution including flow, temperature, pressure, and level. Semiconductor industry and Northern Region application engineer Chi-yang Shih stated that the company's solution is optimized for commonly used fluorinated liquids and mineral oils, ensuring high accuracy and stability. Its features include monitoring the basic state of the coolant and detecting water content and impurities in the oil, providing in-depth analysis of coolant quality.All ifm products come with a five-year global warranty, which is particularly important for liquid cooling systems with high maintenance costs and long downtime. Additionally, as a major sensor manufacturer, ifm's global service support can act as a customer backup, providing immediate, local technical support worldwide.SEMICON Taiwan 2024 provided a platform for ifm to not only display these solutions but also to engage with industry professionals through expert-led sessions. These sessions highlighted ifm's innovative IIoT platform features, which facilitate easy monitoring of equipment conditions and predict future trends, further solidifying ifm's role as a key player in pushing the boundaries of semiconductor manufacturing.ifm Managing Director Chien-hung Liu articulated the company's integral role in the semiconductor industry, emphasizing its commitment to energy conservation, carbon reduction, and the implementation of big data solutions. Marketing Specialist Hao-Han Kang invited all interested parties to visit booth S7635 at Nangang Exhibition Center, Hall 2, Floor 4, to explore these transformative technologies firsthand.Automation made in Germany. Credit: ifm electronic ltd.

SK Hynix announced today that it has developed the industry's first 16Gb DDR5 built using its 1c node, the sixth generation of the 10nm process.The success marks the beginning of the extreme scaling to the level closer to 10nm in the memory process technology.The degree of difficulty in advancing the shrinking process of the 10nm-range DRAM technology has grown over generations, but SK Hynix has become the first in the industry to overcome the technological limitations by raising the level of completion in design, thanks to its industry-leading technology of the 1b, the fifth generation of the 10nm process.SK Hynix said it will be ready for mass production of the 1c DDR5 within the year to start volume shipment next year.In order to reduce potential errors stemming from the procedure of advancing the process and transfer the advantage of the 1b, which is widely applauded for its best-performing DRAM, in the most efficient way, the company extended the platform of the 1b DRAM for development of 1c.The new product comes with an improvement in cost competitiveness compared with the previous generation by adopting a new material in certain extreme ultraviolet (EUV) processes while optimizing the EUV application process of total. SK Hynix also enhanced productivity by more than 30% through technological innovation in design.The operating speed of the 1c DDR5, expected to be adopted for high-performance data centers, reached 8Gbps, an 11% improvement from the previous generation. With power efficiency also improved by more than 9%, SK Hynix expects the adoption of 1c DRAM to help data centers reduce electricity costs by as much as 30% at a time when the advancement of the AI era is leading to an increase in power consumption."We are committed to providing differentiated values to customers by applying the 1c technology equipped with the best performance and cost competitiveness to our major next-generation products including HBM, LPDDR6, and GDDR7," said Head of DRAM Development Kim Jonghwan. "We will continue to work towards maintaining the leadership in the DRAM space and position as the most trusted AI memory solution provider."*HBM(High Bandwidth Memory): a high-value, high-performance memory that vertically interconnects multiple DRAM chips and dramatically increases data processing speed in comparison to conventional DRAM products. Since the introduction of the first HBM, the generation has shifted to HBM2, HBM2E, HBM3, HBM3E, HBM4 and HBM4E. *LPDDR: low power DRAM for mobile devices, including smartphones and tablets, which aims to minimize power consumption and features low voltage operation. The latest specifications are for the 7th generation, succeeding the series that ends with 1, 2, 3, 4, 4X, 5, and 5X. *GDDR(Graphics DDR): a standard specification of graphics DRAM defined by the Joint Electron Device Engineering Council (JEDEC) and specialized for processing graphics more quickly. Its generation has shifted from GDDR3, GDDR5, GDDR5X, GDDR6 to GDDR7. With the newer generation promising faster speed and higher power efficiency, GDDR has now become one of the most popular memory chips for AI. About SK Hynix Inc.SK hynix Inc., headquartered in Korea, is the world's top-tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM"), flash memory chips ("NAND flash"), and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company's shares are traded on the Korean Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK Hynix is available at www.skhynix.com, news.skhynix.com.Media ContactSK Hynix Inc.Global Public RelationsTechnical LeaderKanga KongE-Mail: global_newsroom@skhynix.comTechnical LeaderSooyeon LeeE-Mail: global_newsroom@skhynix.com

Under the theme of "3S Open Lab Platform," 3S will present its achievements and advancements at SEMICON Taiwan 2024, showcasing the unique capabilities of the 3S Open Lab Platform.From September 4th to 6th, 3S Silicon Tech will be at Booth S7640 at Hall 2, Nangang Exhibition Center, introducing the cutting-edge developments of its Open Lab Platform tailored for power devices and power module assembly. The platform is designed to bridge the gap between innovative ideas and market-ready products, having already proven successful with global FABS, Fabless companies, OSATS, EMS, and leading IDM enterprises.3S Open Lab Platform: Turning smart ideas into tangible productsThe 3S Open Lab Platform is a pioneering initiative that offers a collaborative environment where opportunities and knowledge converge. Visitors will have the chance to explore how the platform supports the entire journey from concept to production, ensuring time-to-volume, time-to-market, and time-to-investment return for power chip and power module designers. Through a series of rigorous Design of Experiments (DOE), 3S Silicon Tech has mastered the transition from uncertainty to clarity, providing clients with the tools to overcome challenges and succeed in the competitive semiconductor landscape.Meet-the-Expert Session: Showcasing success stories in process optimizationAs part of SEMICON Taiwan's Smart Manufacturing Expo, 3S Silicon Tech will participate in the "Meet-the-Expert" event at the "Smart Manufacturing Arena." During this session, the team will share inspiring success stories from the Open Lab's continuous process optimization efforts and provide insights into the company's commitment to driving innovation through AI tools and data science to empower smart manufacturing.Join us at SEMICON Taiwan 20243S Silicon Tech cordially invites industry professionals to visit Booth S7640 to engage in insightful discussions on the latest technological advancements and explore collaborative opportunities. This event marks a significant milestone for 3S Silicon Tech as it continues to lead in providing cutting-edge solutions that drive the semiconductor industry forward.We look forward to welcoming you to our booth and sharing our journey of innovation and success.3S Silicon Tech Official Website: https://www.sss-tech.com.tw/

In today's fast-growing industry, the accuracy and stability of gas equipment are indispensable to semiconductor manufacturing. As an integrator in the gas field, Reliya Tech. has been vigorously promoting its own brand and has also introduced three leading brands, ASDevices, Simpure, and Tiger Optics, to the local market.In SEMICON 2024, Reliya will display a full range of products together with its technological innovation and top customer service. We sincerely expect a grand expo in the company of other established leaders in the semiconductor industry in Taiwan.During this year's Semiconductor Expo, which will be held from September 4th to 6th, we are glad to display the gas chromatograph Ka8000 and the intelligent gas calibration system (iGCS) of AS Devices, Purifier 7NG, 9NP003, and 9NP050 series of Cipro, as well as the micro oxygen analyzer of Tiger Optics. In addition, our gas particle counter, independently developed by Reliya's lab, will also be presented at the exhibition.Our gas particle counter has been well received by the industry since its launch, with sales in over 80 countries, including Taiwan, China, and Singapore. Besides, Reliya Technology has just acquired the certification of ISO 9001:2015 and ISO 45001:2018 this year, ensuring our accordance with high quality and industrial standard in manufacturing, installation, gas piping design, and construction of the instrument. Our gas particle counter will soon see its overseas sales in cooperation with companies in Europe and the United States.Innovation and Excellence in fechnologyEquipped with advanced sensors and a control system, ASDevices Ka8000 as a top GC solution is capable of regulating the gas flow with a high degree of accuracy to ensure control of each step in the manufacturing process. Also, the iGCS dilution device can operate in different environments with great stability, which endeavors to provide a stabilized gas supply and ensure its continuity and consistency.In a low-temperature setting, Simpure's purifiers allow the removal of impurities of H2 and He down to the ppt level with the feature of purging not only conventional impurities such as H2O, O2, CO, CO2, NMHC but also other impurities such as Ar, N2, CH4, etc. The purifiers are available in different flow rates and pressure ranges, which are trusted by leading gas companies and 12-inch semiconductor wafer factories. Among them, the 9N 120Nm3/h H2 purifier has performed well in a 12-inch semiconductor wafer fab, passing a comprehensive impurity test with all the criteria met. We can therefore proudly say that we definitely meet our client's requirements.Quality Customer SupportRelyea Technology not only provides top-end products but also values our instant and complete support for our customers. We aspire to take the lead in both technology and services to satisfy our customers' needs and assist them in their business goals.Tailor-made Solutions: Our team provides gas supply solutions tailored to each customer's needs. Prioritizing our clients' interests, we provide the best advice and solutions to different requests such as building a whole new plant and upgrading an existing system.Prompt Technical Support: Our team provides timely customer services at any time and in any place. Our technical professionals are dedicated to troubleshooting in the shortest time to ensure that our client's production is not interrupted.Comprehensive Training Program: Covering basic operation to advanced maintenance, we offer a comprehensive training program to assist our clients in maximizing the benefits of our products, which includes all the core knowledge and skills needed to attain the highest productivity.We cordially invite you to visit our booth and learn more about our products and commitment.Exhibition DetailsLocation: Taipei Nangang Exhibition Center, Hall 2, First floor, Booth Q5252Visiting hours: 10:00-17:00 4-6 September (Wed. - Fri)Contact: sales@reliya.com.twUp to date with the most advanced technology and the latest trends, we aim to deepen our exploration and contributions in gas purification equipment and gas analyzers. We are looking forward to your visit on-site.

Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications. Loctite Eccobond UF 9000AE protects large die within flip-chip BGA (FCBGA), high-density fan-out (HD-FO), and 2.5-D advanced packaging devices.HD-FO and 2.5-D wafer-level packaging techniques have seen significant progress in the last ten years, having achieved dramatic increases in I/O, efficiency, and performance, making them a key enabler of AI growth in the data center and at the edge. With high-density thin, large die (>40 mm x 40 mm) and substantial package body sizes (>100 mm x 100 mm), emerging AI and HPC devices for certain applications can contain more than 2,000 fine-pitch (~100 µm), low gap height (~50 µm) interconnects per die. Bump protection and warpage control are critical for device functionality and optimized package performance. However, achieving thorough bump encapsulation at flow rates that deliver coverage efficiency can be challenging, given the cutting-edge architectural complexity.Henkel has developed a brand-new capillary underfill formulation that meets the dimensional demands of highly integrated package designs. Loctite Eccobond UF 9000AE completely envelops fine-pitch, low gap height die interconnects for rigid protection against stress to deliver good electrical, moisture, and thermal reliability performance for high production yields. The material's low shrinkage and toughness provide die and underfill crack resistance, while its low coefficient of thermal expansion (CTE) protects against warpage. Loctite Eccobond UF 9000AE also has low resin bleed out (RBO) and forms narrow fillets, allowing the dense die integration inherent in advanced packaging techniques.Henkel Global Market Segment Head for Semiconductor Packaging Materials, Ramachandran (Ram) Trichur, acknowledges that while thorough, rugged bump protection against thermal cycling strain and mechanical damage is the highest underfill priority, processability is critical to achieving throughput and yield objectives."Loctite Eccobond UF 9000AE delivers no-voiding bump encapsulation of flip-chip BGA, Cu pillar, and other high-density interconnects, which is fundamental to preserving the value and function of these high-performance devices," Trichur says. "Notably, however, this material does so faster than our prior generation underfills, allowing for greater flow efficiency, which is an important feature for complete interconnect coverage and encapsulation across large surface areas."In internal testing versus previous generation capillary underfills, Loctite Eccobond UF 9000AE demonstrated 20% faster flow* on a 40 mm x 40 mm die, indicating that this material is compatible with even larger die sizes. Its edge-to-edge capillary flow efficiency ensures interconnect encapsulation before any material gelation, eliminating the risk of exposed bumps. So far, Loctite Eccobond UF 9000AE's performance has been validated on die as large as 50 mm x 50 mm and within packages up to 110 mm x 110 mm."The rise of AI underscores semiconductor packaging ingenuity and its ability to drive remarkable levels of computing power and cost-effective scaling alternatives to Moore's Law," Trichur says, citing the well-publicized growth of 2.5-D chip-on-wafer and 3-D advanced packages. "Henkel has been at the forefront of enabling these devices with novel semiconductor materials, and our new underfill further demonstrates our contributions to this dynamic market space."Learn more about Henkel's advanced semiconductor packaging materials at www.henkel-adheisves.com.LOCTITE® is a registered trademark of Henkel and/or its affiliates in the USA, Germany, and elsewhere.*Die size dependent. About HenkelWith its brands, innovations, and technologies, Henkel holds leading market positions worldwide in the industrial and consumer businesses. The business unit Adhesive Technologies is the global leader in the market for adhesives, sealants, and functional coatings. With Consumer Brands, the company holds leading positions especially in laundry & home care, and hair in many markets and categories around the world. The company's three strongest brands are Loctite, Persil, and Schwarzkopf. In fiscal 2023, Henkel reported sales of more than 21.5 billion euros and adjusted operating profit of around 2.6 billion euros. Henkel's preferred shares are listed in the German stock index DAX. Sustainability has a long tradition at Henkel, and the company has a clear sustainability strategy with specific targets. Henkel was founded in 1876 and today employs a diverse team of about 48,000 people worldwide – united by a strong corporate culture, shared values, and a common purpose: "Pioneers at heart for the good of generations." More information at www.henkel.comPhoto material is available at www.henkel.com/pressContact Sebastian HinzPhone +49 211 797-85 94Email sebastian.hinz@henkel.comHenkel AG & Co. KGaA

ASUS VivoWatch is a series of smart wearable devices that serve as a comprehensive personal health management platform for users through precise physiological monitoring.In response to the needs of users, a new model in the series, the VivoWatch 6, was released in 2024, offering enhanced features. According to ASUS, the new VivoWatch continues the company's tradition of smart health watches equipped with two sets of medical-grade electrical and optical PPG sensors. The watch allows users to measure their blood pressure and ECG anytime and anywhere with just their fingertips.The device can integrate and analyze various physiological and lifestyle data and provide personalized suggestions to improve health based on AI algorithms. In addition, the watch's hardware and software functions have also been improved to meet users' long-term health management needs.Harnessing the power of technology to manage physical health has become a major trend for people and medical institutions around the world. A recent in-depth market study conducted by ASUS with nearly 1,300 users revealed that the group of people who are actively interested in their health is gradually expanding from the middle and upper age groups in the past to the lower age groups.Today, users expect wearable devices to consistently and accurately record physiological data and provide insights about their health that integrate information from their entire lives. The survey also showed that wearable devices are gaining popularity among all types of users. Even if they already own traditional devices such as blood pressure monitors, more than 80% of people are willing to opt for wearable devices that can collect physiological data at any time to get a comprehensive overview of their body condition.To meet the needs of users, the VivoWatch 6 has introduced a range of innovative functions. Firstly, body composition analysis has been added, which uses bioimpedance technology to accurately measure indicators such as body fat, water, and muscle percentage, providing more comprehensive data support for body health management.In terms of sports monitoring, the VivoWatch 6 is equipped with a high-precision dual-frequency GPS that allows outdoor sports enthusiasts to determine their position faster and more accurately, making sports records more complete and reliable. The dual-frequency GPS can also be used to track the elderly and ensure their safety.Family members can use the watch's GPS data to find out where the wearer is. In addition, the built-in fall detection function automatically sends alerts and location information to the predefined emergency contact as soon as it detects a fall so that medical assistance can be provided in the critical moments after the accident.In terms of hardware, the VivoWatch 6 has a high-resolution AMOLED display that offers an excellent viewing experience. A new physical shortcut button on the side of the watch allows users to set and access frequently used functions with a single press.At the same time, the VivoWatch 6 offers a battery life of up to 7 days with a variety of health monitoring functions turned on, which can be extended to up to 14 days in power-saving mode to ensure that users can keep an eye on the condition of their body. It is also worth mentioning that the blood pressure and ECG application software developed by ASUS has passed the TFDA medical software certification, earning users' confidence in their professional functionality.Powered by proprietary hardware and software, the VivoWatch 6 demonstrates strong potential for cloud integration. Not only can the watch support industry players in the fields of healthcare management, clinical drug research, and occupational health and safety, but the data it collects can also be seamlessly uploaded to cloud platforms, offering a wide range of applications for healthcare providers and academic research institutions.For example, medical teams can integrate the data from the VivoWatch 6 into their hospital's system to gain real-time insights into the health of their patients. In clinical pharmaceutical studies, the watch can be used to track long-term physical changes in test subjects before and after the administration of medication.In the field of occupational health and safety, the VivoWatch 6 can help management objectively assess employee fatigue and prevent occupational safety accidents. These applications fully demonstrate the potential of the VivoWatch series on the commercial market.Through intensive cooperation with various industries, the VivoWatch 6 is expected to become an important vehicle for innovative business models. For example, insurance companies can develop premium discount plans based on the personal health data provided by the watch, while health management service providers can use the device to deliver remote and customized health services, improving management efficiency and service quality.In addition, ASUS has announced that its AI Coaching Platform, which will be officially launched in October this year, will be able to integrate users' physiological data and daily life information collected by the VivoWatch 6 to build a comprehensive and in-depth database of health data. The platform will use AI algorithms to analyze users' health patterns and potential health risks and make recommendations to improve their health, taking care of users' health in every way.According to ASUS, the VivoWatch series has already shown promising results in overseas markets. In Southeast Asia, ASUS has joined hands with Thailand's renowned high-end health examination centers and elderly care providers to build an innovative model for digital healthcare services.The health examination centers use the VivoWatch to collect long-term health data of the elderly to develop personalized health management plans and use the data to promote remote care. In Spain, ASUS has partnered with local healthcare organizations to integrate the VivoWatch into a medical metaverse blueprint. Physicians can use VivoWatch's remote health monitoring capabilities to fully track changes in patients' daily physical condition and enable more accurate diagnosis and treatment.The VivoWatch 6 demonstrates ASUS' technological capabilities and innovative thinking in using technology for health management. In the future, ASUS will continue to work with partners in various fields to accelerate the implementation of the VivoWatch series into the smart healthcare ecosystem and bring more benefits to the health of the public.In terms of hardware, the VivoWatch 6 has a high-resolution AMOLED display that offers an excellent viewing experience. Credit: Asus

WebX2024 is a global Web3 conference organized and managed by CoinPost, Japan's largest cryptocurrency and Web3 media outlet.Two days opening the door to Web3 industry utilizationGiven the development of regulation, the Japanese government and major corporations attempting Web3 expansion will participate in large numbers. Centered on the theme of Web3's industrial expansion, drawing participants from around the world to gather.With approximately 180 exhibiting companies, about 250 speakers (50/50 ratio of Japanese to international sessions), and around 130 media partners, becoming the largest conference in Asia.Many major companies from globally renowned Japanese industries such as anime and gaming will be among the exhibitors, providing opportunities for interaction with global attendees.Well known DJ Steve Aoki will participate in the opening party to Kick-off WebX 2024.Well known DJ Steve Aoki will participate in the opening party to Kick-off WebX 2024Seeing the future of Web3 mass adoption in Japan- Date: August 28-29, 2024- Location: Tokyo, Japan - THE PRINCE PARK TOWER TOKYO- Organized by: CoinPost - Japan's largest Web3 and cryptocurrency mediaWith the focus on "Accelerating the Adoption and Social Implementation of Web3 Technologies," will offer opportunities for acquiring business ideas and forging connections, thereby contributing to the advancement of Web3 technologies.Why attend in person- Exclusive on-site speaker sessions: Prominent speakers from around the world, with recorded sessions available for ticket holders- Access to exhibition areas of over 180 companies outside the Web3 industry- Participation in IP and Gaming areas: Companies like Kodansha, Capcom, Toho, Square Enix, etc. will participate- Access to networking areas and events (available for Business ticket holders and above)- Participation in over 100 associated side events: complimentary taxi service to side event venues during WebXASIA TOUR and TOKYO blockchain weekASIA TOUR and TOKYO Blockchain Week1. DAO TOKYO2024 (TOKYO / JAPAN)August 21 (Wed.) - 22 (Thu.), 20242. Coinfest Asia 2024 (BALI / INDONESIA)August 22 (Thu.) - 23 (Fri.), 20243. ETHTokyo'24 (TOKYO / JAPAN)August 23 (Fri.) - 26 (Mon.), 20244. WebX2024 (TOKYO / JAPAN)August 28 (Wed.) - 29 (Thu.), 20245. Korea Blockchain Week 2024 (SEOUL / KOREA)September 1 (Sun.) - 7 (Sat.), 2024WebX featured speakers- Fumio Kishida (Japan / Prime Minister)- Masaaki TAIRA (Member of House of Representatives / Head, web3 Project Team, LDP)- Yuriko Koike (Tokyo Metropolitan Government / Governor of Tokyo)- Richard Teng (Binance / CEO)- Audrey Tang (Plurality / Taiwan's First Digital Minister, Co-founder)- Naohiko UENO (TOYOTA Blockchain Lab)- Ken Kanetomo (Konami Digital)- Kosuke Hamasaki (Sanrio - famously known for Hello Kitty)Status of the eventExclusive Discount CodeWe are offering a 20% discount code exclusively for those who have seen this release.20% Discount Link: https://events.bizzabo.com/570958/page/3518018/registration?promo=WebX_hfyrksu7[View WebX Homepage]