Acer has announced the Liquid Jade Z featuring an IPS display with the Zero Air Gap technology to help reduce reflections and Corning's Gorilla Glass 3. The smartphone also supports 4G LTE (Cat. 4) connectivity and a 64-bit quad-core Mediatek processor.The smartphone is equipped with a voice-activated 13-megapixel rear camera with F1.8 aperture and a 5-megapixel F2.2 front camera.The smartphone has several Acer designed innovations such as AcerExtend, which will allow users to take full control of their smartphones via cable or wirelessly using their Windows-based PCs and AcerNAV, a free offline navigation software powered by TomTom and utilizing TripAdvisor POI.The Liquid Jade Z is 7.9mm thin and weighs 110g. The smartphone will become available in March through selected EMEA retailers at a starting price of EUR199 (US$222.23).Acer Liquid Jade Z smartphonePhoto: Company
GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards, today announced one of its most rewarding overclocking competition as of yet with the GIGABYTE Z97 - X99 BIG XTU Challenge, its latest contest hosted on HWBOT.org.The GIGABYTE Z97 - X99 BIG XTU Challenge gives the overclocking community a chance to tweak their systems on for a single benchmark, Intel's XTU. By submitting scores to hit a secret target, overclockers cumulate points and run the chance to win not only cash prizes and hardware, but also a trip to Taipei, Taiwan to attend the Computex 2015 IT trade show with GIGABYTE. Skills will be on display on both Z97 and X99 platforms to be able to submit as many scores within a limited window. A lot is on the line; a total of USD $4,000 in cash, 4 GIGABYTE motherboards and an EPIC grand prize!Do you feel up to the challenge? Each of the 4 rounds will have 10 secret target scores which will be revealed only after their submission period. But to guide you, a target range will be announced in advance. Your goal is to submit as many scores within that range during a 3 days period and try to hit the secret score. Participants who hit the secret target score will cumulate a point and have a chance at winning the Grand Prize or cash prize! Good luck to all!For complete contest rules, scoring and more details, please visit the contest page hosted on HWBOT.org:http://oc-esports.io/#!/round/gbt_z97x99_xtuchallenge
Intel CEO Brian Krzanich has announced a series of mobile platforms including the company's new low-cost system-on-chip (SoC) for phones, phablets and tablets, a global LTE solution, new personal computing experiences, and a range of customers for mobile device and network infrastructure offerings.The announcements include the Intel Atom x3 processor series, Intel's first integrated communications SoC solution for the growing value and entry device markets, and the five-mode Intel XMM 7360 LTE Advanced solution, designed for performance and worldwide coverage. In addition, Krzanich highlighted joint efforts with Alcatel-Lucent, Ericsson and Huawei to address the demand for new telecommunications, cloud and data center services, improve network efficiencies, and accelerate the industry's move toward a software-defined infrastructure.Krzanich also reiterated that Samsung Galaxy S6 and S6 Edge users will have the latest anti-malware solution from McAfee VirusScan Mobile technology built into and activated on their devices.Intel introduced the Intel Atom x3 processor series (formerly codenamed SoFIA), Intel's first integrated communications platform for entry and value tablets, phablets and smartphones. Combining 64-bit multi-core Intel Atom processors together with 3G or 4G LTE connectivity, the integrated communications SoC combines the applications processor, image sensor processor, graphics, audio, connectivity and power management components in a single system chipset. This integration allows device manufacturers to deliver full-featured tablets, phablets and smartphones at affordable price points for the rapidly growing entry and value market segments.Intel said its is bringing the benefits of integrated Intel architecture and wireless communications to customers, including the China technology ecosystem, with greater velocity. Twenty companies, including Asustek Computer and Jolla, have committed to delivering Intel Atom x3 designs.Rounding out its mobile portfolio that scales from the entry to performance segments, Intel also introduced its first 14nm Intel Atom SoC, the Intel Atom x5 and x7 processor series (formally codenamed Cherry Trail) for next-generation tablets and small-screen 2-in-1s. Offering 64-bit support for Windows and Android, Intel Gen 8 graphics, and an option to pair with next-generation LTE Advanced connectivity, the Intel Atom x5 and x7 processor series will power a range of mainstream to premium devices.Customers, including Acer, Asustek, Dell, Hewlett-Packard (HP), Lenovo and Toshiba, have already committed to deliver devices on this platform. The first devices are expected to be in the market in the first half of this year.Intel also announced its third-generation five-mode, LTE Advanced Category 10 modem. The Intel XMM 7360 supports 3x carrier aggregation and download speeds up to 450Mbps. Its compact size and power efficiency enable the Intel XMM 7360 to accommodate a wide range of form factors, from smartphones and phablets to tablets and PCs. It also expands Intel's portfolio of LTE solutions, giving device manufacturers a competitive option to quickly design and launch LTE devices in various market segments and geographies. At Mobile World Congress (MWC) 2015, the company also demonstrated a pre-5G concept system that combines LTE with 802.11ad to deliver speeds of more than 1Gbps using Intel technology end-to-end.In addition to working with Samsung to help protect Galaxy S6 and S6 Edge devices, Krzanich said Intel Security is also collaborating with LG Electronics to help secure personal data. LG Electronics will make McAfee Mobile Security from Intel Security available on the LG Watch Urbane LTE, delivering anti-theft capabilities that allow the owner to lock, locate and wipe the device, if needed. LG Android device users are already protected with McAfee Mobile Security on their devices.Krzanich announced new customers including Brightstar, Deutsche Telekom and Prestigio for the company's True Key technology, a cross-platform application to address the pain point of passwords by using personal factors like facial identification and fingerprints to make logging in easier and safer. Deutsche Telekom will preinstall the True Key product for its customers in Europe. Prestigio will be one of the first mobile device manufacturers to launch the True Key application in Russia and across Europe, making the application available across all of its Android tablets and smartphones by the end of 2015.Krzanich outlined how Intel is working with industry leaders to transform network infrastructure with standardized hardware and software, and helping to accelerate the industry's move toward a flexible, agile software-defined infrastructure. This enables both telco and cloud service providers to improve network efficiencies and accelerate the delivery of new services and capabilities for consumers and businesses.Alcatel-Lucent introduced its virtual radio access network (vRAN) solution, comprised of a virtualized baseband unit that uses general purpose servers with Intel Xeon processors to enable cost savings and increased network performance. The vRAN will be in customer trials this year and commercially available in 2016.Ericsson announced a new generation of data center platforms for the Ericsson Cloud System that enable telecom and cloud service providers to lower their total cost of ownership (TCO) and realize more flexibility and efficiency in their data centers. The company is using Intel Rack Scale architecture, together with management and orchestration software, to optimize and scale cloud resources across private, public, enterprise and telco cloud domains, enabling improved services agility. Ericsson also announced it is working with Intel Security on mobile security for 4G networks.Huawei and Intel are collaborating to deliver robust cloud solutions that will enable telecommunications service providers to transform their data centers. The companies will develop the next generation of Huawei's FusionSphere based on Intel architecture, and will use the Data Plane Development Kit and Open vSwitch to increase network virtualization performance of FusionSphere. These solutions aim to enhance performance that is optimized to minimize TCO for cloud workloads in a scalable and secure manner.Intel Atom x3 processorPhoto: CompanyIntel XMM 7360 LTE Advanced solutionPhoto: Company
Enova, the leading cryptographic ASIC engineering company, introduces X-Wall MX+, SATA-to-SATA (Gen 3, 2 & 1) Real-Time Cryptographic ASIC Protecting "Data-in-Transit" and "Data-at-Rest" with AES ECB/CBC/XTS 256-bit Strength.The X-Wall MX+, the 10th generation of patented X-Wall Technology, is engineered specifically to encrypt/decrypt entire SATA disk drive including boot sector, temp files and operating system with SATA Gen 3 speed at 6Gbps. The X-Wall MX+ enhances both security and performance of its predecessor MX and is progressing for FIPS 140-2 level 2/3 certification.How does it work?The X-Wall MX+ sits between the host SATA adapter and the device SATA controller, encrypting the attached SATA drive with 256-bit AES ECB, CBC or XTS.System performance with X-Wall MX+ engaged is unaffected. X-Wall MX+ is OS independent including embedded OS. Once authenticated, its operation is transparent to all users.Full Disk Encryption, or FDEThe X-Wall MX+ default is to perform full disk encryption protecting entire Data-at-Rest. The FDE solution is OS independent as no extra software component including driver is needed.File/Folder Encryption, or FFEWith add-on software components, the X-Wall MX+ can be configured to protect Data-in-Transit such that confidential files stored in the Cloud remain MX+ hardware encrypted. Only the right secret key can successfully decrypt those encrypted files. The solution is OS dependent as it requires loading extra software component or driver.Enhanced Security for AuthenticationThe X-Wall MX+ has equipped with HMAC, SHA256, RSA 2048, and DRBG, all in hardware. Secure authentication through these cryptographic components is possible. Key management can be versatile, which includes PIN/Password through Pre-boot authentication, TPM, Smartcard, Fingerprint, Single Sign On, or USB type external key token. One or more factor authentications are applicable.As the entire SATA disk drive is encrypted, there is no secret being left unprotected, including PIN and "Secret Key." In an X-Wall MX+ protected system, there is no way to read the data without the right "Secret Key." The X-Wall MX+ technology is compatible with all system designs incorporating standard SATA drive technologies. A limited amount of sample chips will be made available for qualified customers for testing and evaluation.Key Take AwayThe X-Wall MX+ performs full disk encryption with NIST certified AES hardware at SATA Gen 3 speed with conserved power consumption and small foot print. It can also be configured to adapt to securing cloud. It is OS independent and allows secure authentication through built-in HMAC, SHA256, DRBG and RSA2048 cryptographic components.For more information, please contact info@enovatech.net or visit our website http://www.enovatech.com/.MX+ Block Diagram
Indium Corporation was presented with CIRCUITS ASSEMBLY's NPI Award for its LV1000 flux coating for solder preforms at the IPC APEX Expo on Feb. 24 in San Diego, Calif.Sponsored by CIRCUITS ASSEMBLY, the NPI Awards program recognizes the electronics assembly industry's leading new products. Awards are selected by an independent panel of practicing industry engineers.LV1000is a series of flux coatings that offers low voiding, especially in situations where the component footprint will not allow for proper outgassing of volatized flux. Its glossy, even coating is durable, so it can be used in automated assembly processes.LV1000 is halide-free, meeting ROL0 requirements, and passes Telcordia GR-78 testing in the unactivated state. The coating's tolerances are well-controlled, down to 0.5% by weight, to ensure no additional flux is required. LV1000 is versatile, allowing for the coating of unique geometries and sizes.LV1000 is not only a formulation, but a process which produces flux-coated solder preforms that meet the tightest of flatness tolerances, ensuring that electronic components solder correctly, thereby minimizing defects.For more information about LV1000, visit www.indium.com/LV1000. For more information on flux-coated solder preforms, visit www.indium.com/flux-and-epoxy/flux-coated-preforms.For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts From One Engineer To Another® (#FOETA) at www.facebook.com/indium or https://twitter.com/IndiumCorp.
Acer has unveiled the Liquid M220 smartphone, its first Liquid smartphone to run on the Windows Phone 8.1 operating system, featuring a 4-inch 233ppi display.The Liquid M220 features a 5-megapixel auto-focus back-end and a 2-megapixel front-end camera. The back-end camera also sports an 89-degree wide-angle lens for better photo shot.Both the Liquid Leap and Liquid Leap+ smart active bands are compatible with Windows Phone 8.1, making them the ideal companions of the Liquid M220 for users with healthcare demandThe Liquid M220 will also have optional accessories ranging from matching color flip covers to matching color protective cases.The Liquid M220 will become available in April through selected EMEA retailers, starting EUR79 (US$88.42).Acer Liquid M220 smartphonePhoto: Company
Samsung Electronics has announced that it is now mass producing 128GB ultra-fast embedded memory based on the Universal Flash Storage (UFS) 2.0 standard for smartphones. The new embedded memory's UFS 2.0 interface is the most advanced JEDEC-compliant, next-generation flash memory storage specification in the world, the company claimed.UFS memory utilizes "Command Queue," a technology that accelerates the speed of command execution in SSDs through a serial interface, significantly increasing data processing speeds compared to the 8-bit parallel-interface-based eMMC standard, Samsung indicated. Its new UFS embedded memory conducts 19,000 IOPS for random reading, which is 2.7 times faster than eMMC 5.0, the company said.Samsung's UFS memory also delivers a sequential read and write performance boost up to SSD levels, in addition to a 50% decrease in energy consumption. In addition, the random read speed is 12 times faster than that of a typical high-speed memory card (which runs at 1,500 IOPS).In the future, Samsung anticipates that UFS will support high-end mobile market needs, while eMMC solutions remain viable for the mid-market and value segments.For random writing of data to storage, Samsung's UFS embedded memory operates at 14,000 IOPS and is 28 times as fast as a conventional external memory card, making it capable of supporting seamless Ultra HD video playback and smooth multitasking functions at the same time, the company said.Samsung's new UFS embedded memory comes in 128GB, 64GB and 32GB versions, which are twice the capacity of its eMMC line-up, the company disclosed.Samsung's UFS embedded memory package, a new ePoP (embedded package on package) solution, can be stacked directly on top of a logic chip, taking approximately 50% less space, the company noted."With our mass production of ultra-fast UFS memory of the industry's highest capacity, we are making a significant contribution to enable a more advanced mobile experience for consumers," said Jee-ho Baek, senior VP of Samsung's memory marketing. "In the future, we will increase the proportion of high-capacity memory solutions, in leading the continued growth of the premium memory market."Samsung UFS embedded memoryPhoto: Company
Indium Corporation will introduce Indium10.5HF, a new halogen-free, Pb-free solder paste at the IPC APEX Expo Feb. 24-26 in San Diego, Calif.Indium10.5HF is a no-clean solder paste designed to improve ICT first-pass yields. It is specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry.Indium10.5HF solder paste has a soft, pliable, non-tacky residue that minimizes build-up on probes during in-circuit testing and increases first-pass ICT yields. Indium10.5HF offers unprecedented stencil print transfer efficiency, making this solder paste suitable in the broadest range of processes. It also provides excellent head-in-pillow performance. Indium10.5HF solder paste saves time and increases output for companies that require ICT as part of their normal production."This solder paste is ideal for customers in a wide range of markets, including automotive, medical, computing, communications, and aerospace/military," Glen Thomas, product manager, PCB solder paste said. "Additionally, many of our customers have reported improved wetting and solderability for their applications, especially for RF shield-attach."For more information about Indium10.5HF or Indium Corporation's complete Pb-free Solder Paste series, visit us at APEX in booth #1027, online at www.indium.com/APEX-2015, or email askus@indium.com.Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts From One Engineer To Another (#FOETA) at www.facebook.com/indium or @IndiumCorp.Indium10.5HF is a no-clean, halogen-free, Pb-free solder paste
With eCommerce capturing a booming share of sales, physical retailers are challenged but not doomed because they provide irreplaceable touch-and-feel experience for brick-and-mortar consumers. To reinvent shopping experience and rebuild brand values, many physical retailers are building "responsive stores" to merge the advantages of online and offline shops.Responsive stores cover all aspects of shopping experience from entrance to exit. They can be divided into digital shopping carts, digital shelf management system, in-store intelligent video system, virtual fitting room, and experience centers.Responsive Stores: Win-wins for Retailers & CustomersDigital shopping carts are computerized shopping carts with tablets. They provide personal shopping services such as style advice, product search, and wine recommendations. "When customers have questions, these carts show detailed product information with augmented reality technologies or connect to customer service centers," said Steven Wu, GM of Multi-Media Solutions Business Unit, NEXCOM. Also, they automatically scan and check out items in carts, shortening customers' queue time.Regarding digital shelf management system, Wu suggests that retailers can use electronic shelf labels to keep product and price information up to minute based on price comparison information. The system also connects to enterprise resource planning software (ERP) and replenish automatically. When shelves run low, products can be automatically restocked without interrupting customers, thus delivering a comfortable environment.Informative and Thorough Shopping ExperienceIntegrated with cameras and sensors, the in-store intelligent video system performs various features and interactive scenarios. For instance, the system collects customers' eye movement, traffic flow, and shopping behaviors for further analysis. With the system, retailers can identify hot shelf zones and eye-gazed product features for improved shelf layout and product design. Also, the system can greet visitors, identify customer groups, and deliver advertisements relevant to customers.Virtual fitting rooms enable customers to try on clothes virtually. With 3D scanning, depth-sensing, and virtual reality, latest virtual fitting rooms convert the 2D front view into unprecedented 3D experiences. Customers can even upload these fitting photos for peer feedback via social network. This 360-degree perspective can also be applied to furniture stores and car dealers for previewing interior design.Last but not least, retailers can remodel store layout to boost customer satisfaction by establishing service and experience centers between checkout counters and the exit. The digital-signage-enabled space can bring premium interactions to reinforce brand image and perform customer satisfaction analysis.Integrates Bricks with ClicksRecently, eCommerce brands are establishing physical stores and experience centers to strengthen competitiveness. In addition to providing a wide selection of products, abundant product information, and fast checkout, online shops still need the final piece of the puzzle to create physical interactions between customers and products.On the other hand, traditional retailers are also bringing eCommerce advantages into physical stores. Some retailers in Europe and North America are adopting emerging technologies to turn brinks into gold. This migration is accelerating in APAC. As responsive stores continue evolving with technological advancement and customer-behavior changes, the future of retail relies on retailers and system providers. With decades of experience in retail digital signage and responsive store solutions, NEXCOM certainly plays key roles for retail innovation and renovation.For more information about NEXCOM, please visit http://www.nexcom.com/Responsive stores cover all aspects of shopping experience from entrance to exit
The Internet of Things (IoT) is transforming product companies into service businesses. These companies are discovering that launching, managing, and expanding an IoT service comes with unique challenges. The adoption of cloud, analytics, Big Data, mobile, and social technologies compels solution providers and their partners to deliver increased business value. This pace of change shifts the landscape in terms of technology sales and implementation. Partner organizations that fail to maintain and enhance their employees' technical and sales skills will be unable to successfully apply the best technologies to match the evolving business requirements.During a recent DIGITIMES organized Embedded Technology Forum, Tony Tsao, CEO of Global Channel Resource Corporation, said that with cloud services and different mobile apps, opportunities lie in the creation of new business designs by blurring the digital and physical worlds. As the technological revolution accelerates, consumers have completely changed how they shop, how they make purchasing decisions, and what they expect from product distributors. Differentiation between purchasing channels is introducing a series of changes.The current channel maintains the flow from product vendors, distributors, system integrators and telecom services providers, before finally handing over to the customer. But Tsao remarked that in the future, the role of distributor will be shortened to form a path from product vendors and system integrators straight to a Managed Service Provider/Telecom operator and then to the customer. Tsao dubbed this model Channel 3.0. Managed service providers will play a notable role in the ecosystem by improving operations and cutting expenses by outsourcing day-to-day management responsibilities and functions. This can include outsourcing human resource activities, production support, and lifecycle management activities, which speed up the process flow and improve efficiency.The Channel 3.0 concept will enable progressive changes in IoT service business models. Solution providers deliver applications from single to integrated solutions, or even massively migrate to collaborative solutions. And the system platform has been transformed from Machine-to-Machine (M2M), focusing on serving individual machines with better quality, and aggregating systems to remove redundant information already transmitted by other machines. New service models will emerge by adapting complex applications driven by open collaboration architectures, Tsao said.GCR is a company which offers a cloud-based service platform and online marketplace to help SaaS, ISV and pre-integrated IoT solutions deploy services worldwide. GCR's solutions and services create a platform that ties up with a regional and local business operations to reduce the physical demand gap between worldwide ICT channel partners and global buyers, said Tsao.Tony Tsao, CEO of Global Channel Resource CorporationPhoto: Digitimes
