According to Accenture, 95% of manufacturing firms worldwide intend to initiate IIoT-based operations in the next three years, in hopes of automating production monitoring to replace conventional process and implement preventive maintenance. 73% of the companies polled, however, admit that their IIoT plans have yet to make any progress.Commonly, once a manufacturer has managed to allot a budget, accommodate physical installation demands, overcome wiring and other fitting issues, deploy ready-made equipment monitoring systems (comprising IPC and DAQ modules and signal conditioning circuits), and eventually start acquiring data, the absence of resources and capability to follow up with meaningful data analysis and visualization actually prevents development of a prototype for evaluation.According to Zake Lin, ADLINK IST's Product Manager for Connected Equipment, even the best-planned IIoT implementations often end up languishing, since operators, even after struggling to meet significant requirements or investment in labor, resources, technology, and operating capital, find themselves stuck in a long unproductive evaluation period, unable to make any further progress.ADLINK DXS IoT Digital Experiments as-a-Service enables smooth transition to IIoT function and valuable data access with minimum upfront investmentUnlike most available solutions pieced together from disparate standalone elements, ADLINK's MCM-100 provides an all-in-one solution that can directly connect with an accelerometer or other sensor to acquire machine status data, perform real-time analysis of the gathered data, upload the results to data centers, and connect to upper level ERP/MES systems for further data management. Moreover, ADLINK provides cloud-based solutions enabling web dashboard, warning issuance, information security, and OT/IT conversion capabilities cooperating with the MCM-100 to take complete advantage of valuable data.As well, to break through bottlenecks and fully achieve IIoT-based objectives, ADLINK has evolved beyond conventional product sales models by, first, attaining a clear understanding of user needs and then combining system integrator (SI) resources in concert with the MCM-100, defining implementation details and expected results. Next, an ADLINK DXS package is formulated and a pilot run launched to establish the MCM-100's efficient acquisition of equipment behavior data and machining parameters, for real-time analysis. Generation of warnings and other notifications can also be configured. Once the evaluation results are available, the user can precisely calculate ROI, and work with ADLINK to assemble the ideal solution and inaugurate large-scale deployment.ADLINK's planning expertise enables machine makers and factory equipment management and service operators to reap the full benefits of the MCM-100. In one example, a major electronics assembler relies heavily on CNC cutting tools for production. Consequently, any failure of the tools represents considerable downtime with accompanying drop in throughput., The assembler wished to incorporate ADLINK's MCM-100 solution to prevent unexpected cutting tool failure from generating machining defects. A DXS-based pilot run was implemented, with an accelerometer delivering detailed machine behavior data, in this case vibration measurement, to the system. The MCM-100 performed detailed analysis of the acquired data, and was able to, based on the results, predict upcoming tool failure. The operator was then able to perform preventative maintenance, replacing the CNC cutters before costly downtime occurred. The test system was thus able to obtain effective, meaningful results with a minimum of expense and risk. Upon evaluation of the results, large-scale deployment was undertaken, and the operator was able to successfully build up its cutting tool monitoring system. As a final confirmation of effectiveness, zero machining defects have arisen since the system has been up and running.Five key approaches to perfect IIoT project implementationIn sum, Lin concluded that for an IIoT project to achieve success, five key elements are necessary.- Think big: Manufacturers can start by considering problems to be solved, then ramp up to determining processes to be changed and the benefits they hope to achieve, in order to generate the maximum business value possible.- Start small: Operators can, with minimal up-front investment, take advantage of digital experimentation to verify that valuable information can be obtained by collecting and analyzing data and whether the projected outcomes, such as improved production quality and reduced labor costs, can actually be achieved.- Keep trying: Users should become comfortable with the idea of making mistakes, get accustomed to learning from them, and develop the resilience to keep trying.- Build an ecosystem: The IIoT value chain encompasses protocols and connections, security, data streaming, equipment management, power control, data transfer, machine learning/deep learning, edge analysis, cloud computing and many other complex links. Without a complete ecosystem, an individual supplier will not be able to manage everything on its own.- Recognize the facts: The ultimate goal of IIoT implementation is to explore data and identify valuable information, rather than simply perform technological experiments.ADLINK DXS IoT Digital Experiments as-a-Service enables smooth transition to IIoT function

Indium Corporation will feature Indium11.8HF-SPR solder paste - a new no-clean, Pb-free solder paste designed to meet the current and future fine feature printing requirements of mobile manufacturers - at Productronica India 2018, Sept. 26-28 in Bengaluru, India.Indium11.8HF-SPR specifically addresses customers' needs for a high performance solder paste with Type 5 powder. This new solder paste delivers unprecedented stencil print transfer efficiency on the broadest range of processes, while maintaining industry-leading reflow performance.Indium11.8HF-SPR benefits:*Halogen-free per IEC 61249-2-21 test method EN14582*High-transfer efficiency through small apertures (≤ 0.66AR)*Long stencil life (>12 hours)*Eliminates hot and cold slump to inhibit bridging and solder beading defects*Avoids the potential for HIP and graping defects with a unique oxidation barrier*Reflows in both air and nitrogenIndium Corporation and MEL Systems and Services Ltd (MELSS) will share a booth in Hall 3, Booth PA15.For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

Indium Corporation will feature its suite of void-reducing, no-clean solder pastes to help customers Avoid the Void at SMTA International from October 14-18 in Rosemont, Illinois.Indium Corporation's suite of solder pastes, including Indium8.9HF and Indium10.1, are specially formulated to deliver ultra low-voiding, plus enhanced benefits such as improved response-to-pause, stability, head-in-pillow (HIP) minimization, reliable in-circuit testing, and enhanced SIR performance.Indium Corporation's versatile high-performance solder pastes are designed to accommodate a variety of processing temperatures and industry requirements with lead-free, halogen-free, no-clean options.For more information about Indium Corporation's suite of low-voiding solder pastes, visit www.indium.com/avoidthevoid or find us at booth #523.Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.Indium Corporation to showcase low-voiding solder pastes at SMTA International 2018

Clientron Corp., a world-leading provider of thin client, POS and embedded systems, unveils its brand new economic thin client S-Cube Pi 3 B+, running on the latest Raspberry Pi 3 B+ platform, specifically designed for high performance and economic desktop virtualization solution for the education, SMB, finance, healthcare and enterprise markets.Optimized for major virtualization software brokersThe S-Cube Pi3 B+ is designed to run virtual sessions from various workspace environments. It supports virtualization software brokers including Citrix XenDesktop, Microsoft RDS, and VMware Horizon with secure Linux operating system.High performance 64-bit Quad-Core processorPowered by the Cortex-A53 (ARMv8) Quad-Core 1.4GHz processor, it provides an economic solution for most demanding functions including WiFi & Bluetooth 4.2 wireless connection, one Gigabit LAN, one HDMI display output and one internal micro SD card expansion.Power-efficient and cost-effective benefitsWith power-efficient and cost-effective benefits, it features ultra-compact credit card size form factor, and offers cost effective endpoints of desktop virtualization solution for customers. Featuring PC-like working experience, it can be used in different market segments to optimize your working environments.Key Features of the S-Cube Pi 3 B+ including:- Only 0.18L credit card size- Energy-efficient design with integrated power board for true power on/off function- Fanless and noise-free design- 4 x USB 2.0 high-speed ports- Built-in 1Gigabit Ethernet, 2.4GHz and 5GHz Wi-Fi (802.11 b/g/n/ac) and Bluetooth 4.2- Support 1GB RAM and internal Micro SD- Less than 5W power consumption- Support most demanding VDI protocols- Support Kensington lock- Optional VESA mount kitThe S-Cube Pi 3 B+ is not only for thin client solutions, but also could be used for digital signage and smart retail applications. The S-Cube Pi 3 B+ thin client is available now. For more details, please visit our website www.clientron.comClientron debuts its first cost-effective thin client with Raspberry Pi 3 B+ platform

Leading semiconductor test equipment supplier Advantest Corporation will showcase three of its advanced test systems, have technologists in its booth to address leading-edge testing topics, and sponsor two major events at Semicon Taiwan 2018 on September 5-7 at the Taipei Nangang Exhibition Center."In our inaugural exhibit at Semicon Taiwan, we will present our latest test solutions for the Taiwanese market, including the debut of our new MPT3000 system for testing advanced solid-state drives," said Judy Davies, Advantest's vice president of global marketing communications. "Advantest has all of the products and technologies needed to help chip makers, foundries and OSATs (outsourced semiconductor assembly and test suppliers) meet their customers' needs."Product ExhibitsIn booth #K2682 in the Testing Pavilion, Advantest will display its MPT3000 platform for system-level testing of SATA, SAS, and PCIe solid-state drives (SSDs); its small-footprint M4171 handler, designed to boost the efficiency of product development labs while offering the capability of remote operation from anywhere around the globe; and its EVA100 measurement system for high-volume testing of digital, analog and mixed-signal ICs.In addition, the booth will feature kiosks staffed by company experts to answer questions covering all high-growth technology areas including power-supply solutions for charging, automotive and industrial applications; optimizing test-floor intelligence; and scalable testing for the Internet of Things (IoT), 5G communications, next-generation memories, display drivers and integrated power devices.Event SponsorshipsThis year, Advantest is a gold sponsor of the annual Smart Automotive Summit in the Grande Luxe Banquet Hall on September 4, the day before exhibits open. The day-long conference will feature technical and business presentations addressing automotive components and systems shaping the future of mobile connectivity and smart vehicles.Advantest also is a silver sponsor of the show's leadership gala dinner on September 5 at the Grand Hyatt Taipei.Social MediaKeep up to date on the very latest information from the leader in test equipment on Twitter @Advantest_ATE. More information about Advantest is available at www.advantest.com.

Sudden power failure or unstable electricity supply, even just for one minute, can result in damage to expensive production machinery. As such, uninterruptible power supplies (UPS) have become standard industrial equipment. In response to the need, Arbor, a leader in industrial PC (IPC) and industrial IoT (IIoT) solutions, has recently introduced SCP CUBE - a UPS system that uses supercapacitors and does a lot more than ensuring reliable power supply.Integrated with LoRa communication technology and sensors, SCP CUBE serves not only as a UPS but also as an IIoT sensor node. It can further wok with central gateways and cloud servers to form a total IIoT solution.Supercapacitors provide compelling safety featuresCompared to bulky battery-powered UPS that can supply electricity for hours, Arbor's supercapacitor-based UPS - SCP CUBE - provides backup power for three to five minutes. Its main purpose is to allow the system to have enough time for a standard shutdown so as to guard against damage to hardware and software of built-in equipment.UPS using supercapacitors have multiple advantages, including higher conversion efficiency and shorter charging time. Furthermore, conventional batteries are prone to failure in high or low temperature environments while supercapacitors can maintain normal operation under a wide temperature range (-20 degrees C to 70 degrees C), outperforming lead-acid batteries and lithium-ion batteries. Moreover, supercapacitors can last for unlimited charge-discharge cycles in theory and are essentially maintenance-free. These are all supercapacitors' advantages that conventional batteries cannot match."It should be noted that we cannot overlook the risk of battery explosion especially in operating environments where there may be oil and gas. Supercapacitors pose no safety risk so they don't need to get certified for air transport," said Lin Yang-cheng, associate manager, industry automation division, Arbor. As a matter of fact, an international chemical company based in Italy has chosen to use Arbor SCP CUBE mainly for its explosion-proof and safety features.Supercapacitors are environmentally friendly and safe and operate in a wide temperature range. Exploiting their inherent advantages, Arbor has designed SCP CUBE, which not only guarantees uninterruptible power supply but also enables customizable editing, data monitoring and data analysis. For example, customers can configure a shutdown timer based on the number of software programs running on their IPC.Total solution for IIoT deploymentArbor SCP CUBE further combines the company's internally-developed LoRa communication module, enabling it to collect data from sensor nodes deployed on production machinery, such as CPU load, temperature, current, voltage and power input, and send the data to the central gateway. This way, one central gateway can monitor data sent from hundreds of sensor nodes and respond to abnormality by initiating a system reset or other actions.Lin remarked, "For manufacturers looking to migrate to smart factories, SCP CUBE's innovative design truly enables the connection of everything. Manufacturers will be able to implement all-round IIoT monitoring and control with an extremely cost-effective approach." Furthermore, the gateway can forward the collected data to cloud servers via Wi-Fi/3G/4G network connection for more advanced data management and analysis. Arbor also provides internally-developed apps allowing users to stay on top of machinery conditions at all times and receive alert messages in the case of any abnormality on their smartphones through the cloud so that they can make timely responses. "Arbor is building up cloud servers and planning to offer customers machinery monitoring and data analysis services on a month-to-month subscription basis." In addition, as a modular standalone device, SCP CUBE is compatible with all types and brands of production machinery, enabling quick and easy IIoT deployment.According to industry sources, there are only two suppliers of supercapacitor-based UPS in the world - Arbor and a foreign firm. But, Arbor is the world's first and only supplier to introduce an all-in-one device combining a supercapacitor board, charging board, UPS, LoRa, sensors and user interface (UI). ‎SCP CUBE with NB-IoT technology will be next on Arbor's product roadmap.NB-IoT modules coming up to flexibly accommodate customer needsIn addition to long-range transmission, LoRa also achieves low-power, low-cost and bi-directional communication. Arbor thinks LoRa is a particularly suitable LPWAN technology for IIoT deployment so it began its LoRa product R&D two years ago. By providing communication modules, Arbor aims to eliminate network communication problems for manufacturers looking to incorporate IIoT platforms. Another IoT network communication technology that Arbor is actively working on is NB-IoT, which can also be integrated with SCP CUBE through a modular design to more flexibly accommodate customers' specific IIoT needs.SCP CUBE serves as a fundamental element in Arbor's IIoT roadmap. By introducing SCP CUBE, combining supercapacitor-based UPS, LoRa, sensors and edge computing and working in connection with central gateway and cloud server, Arbor helps customers deploy IIoT platforms at a faster pace and lower cost and thereby contributes to the advances of smart manufacturing and Industry 4.0.SCP Cube: The industry's first 2-in-1 supercapacitor power and environmental monitoring solution

Indium Corporation will feature its flip-chip flux WS-446HF and ball attach flux WS-823 at Semicon Taiwan 2018 from September 5-7.Indium Corporation's WS-446HF is a water-soluble, halogen-free flip-chip dipping flux with an activator system powerful enough to promote wetting on the most demanding surfaces; from solder-on-pad (SoP) to standard and embedded trace substrates (ETS) and flip-chip on leadframe applications. WS-446HF provides uniform dipping performance over extended periods of time. It also exhibits tackiness that is suitable for holding large die in place during assembly.WS-823 is a water-soluble, halogen-free ball-attach flux designed for use in pin transfer and printing applications for ball attachment to substrates (BGA manufacturing). WS-823 has an activator system powerful enough to promote wetting on the most demanding substrate metallizations, such as copper OSP. WS-823 is cleanable with just DI water only.From water-soluble and ultra-low/near-zero residue no-clean flip-chip fluxes to system-in-package (SiP) water-soluble and no-clean solder pastes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP and Heterogeneous Integration applications.For more information on Indium Corporation's materials for SiP, visit www.indium.com/SiP or visit Indium Corporation's booth J2240.Indium to feature WS-446HF flip-chip and WS-823 ball-attach fluxes at Semicon Taiwan

EZCast is attending IFA 2018 at Berlin ExpoCenter City during August 31 to September 5. Central to its exhibit, at Hall 25, 301a, is the latest portable mini projector designed specifically for screen mirroring smartphones, EZCast Beam J2. It is the first mini projector designed to support both plug and play as well as wireless screen mirroring for iPhones and Android phones.The mini projector comes with three packs of 3000mAh batteries to charge the smartphones, and can last through a 2-hour movie on a single charge. EZCast Beam J2 uses Texas Instruments' latest DLP technology to create the brightest mini projector in its class at 150 Lumens. EZCast Beam has never been showcased in Europe, and the company has designed a special Experience Zone for visitors to try out the projector in person.The Experience Zone offers IFA 2018 attendees hands-on training and exposure to products and engagement opportunities.

Indium Corporation will feature its Indium3.2HF solder paste at Semicon Taiwan 2018 from September 5-7.Indium Corporation's Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste. Indium3.2HF formulated with Indium Corporation's Type 6SG powder is ideal for fine feature printing applications.Indium3.2HF offers consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:- Good response-to-pause- A wide reflow profile window- Outstanding slump resistance- Excellent wetting capability- Superior fine-pitch soldering abilityFrom water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.For more information on Indium Corporation's materials for SiP or Indium3.2HF solder paste, visit www.indium.com/SiP or visit Indium Corporation's booth J2240.For more information about Indium Corporation, visit www.indium.com.Indium3.2HF solder paste

Digi-Key Electronics, a global electronic components distributor, continues to strengthen their offering of industrial automation (IA) components, enhancing design and project capabilities in countless IA applications. The company has added over 14,000 IA part numbers to their portfolio in categories such as sensors, cables, safety devices, control monitors, relays, timers, switches, lighting, and controllers, among others.Aside from the product lines from Digi-Key's traditional suppliers such as Omron, TE, Panasonic, Molex, and others, the company has added 15 new lines, including products from Altech, SICK, IDEC, Carlo Gavazzi, and Belden."Digi-Key aims to be the industry leader and single source for IA products and solutions for customers all over the world," said Eric Wendt, director, Strategic Program Development, Industrial Automation at Digi-Key. "Industrial automation is a vast industry that complements our current offering and plays a critical part in building automation, factories, Industry 4.0, and more. We want to partner with designers and purchasers in these application areas to help enable the innovation and functionality of their systems, processes, and machinery."Digi-Key also recently updated their industrial automation landing page, offering more graphical links and adds the ability to find related parts. The page is also more mobile-friendly, catering to users who need parts in the moment or on the go.For more information, please visit the Industrial Automation page on the Digi-Key website.