The results of the 31st "Taiwan Excellence Award" were released recently. The Smart Virtual Onboard Unit developed by Clientron stood out among 1109 products, and won the favor of the judges and the award. The honor of winning the "Taiwan Excellence Award" this time affirms that Clientron has actively invested in the research and development of automotive electronic technology for the past years.The Taiwan Excellence Awards are like the Oscars of the industry, which strictly selects high-quality and innovative products of the highest standard. This is the belief of Taiwanese enterprises to choose high-quality products. In 2022, it emphasizes the spirit of "only innovation can improve life", echoing this award-winning product.The Smart Virtual Onboard Unit is designed with modularized, highly diversified integration characteristics, and integrates some of the cockpit systems with it. It has a simple design to fit different packages of vehicles, and is easy to maintain. It also passes the automobile testing and validation requirements for EMC/EMI and others to ensure reliability, functionality, safety, etc.Because of the modularized design, it's smart and easy to connect various systems, such as cameras, sensors, and e-shifter, and also integrate 8 ADAS's warning features: driving recorder, alcohol lock, fatigue driving, surround view, FCW (forward collision warning), LDW (lane departure warning), BSD(blind spot detection), and TPMS(Tire pressure monitoring system ) for driving safety. Moreover, it provides an infotainment system as well as smart driving services.Kelly Wu, president & CEO of Clientron, said that with standardization, modularization, intelligence, and networking as the core, Clientron integrates all domains of Taiwan's industrial resources, and implements domestic electric vehicle manufacturing through leading domestic electric vehicle technology. This award is an affirmation of Clientron's efforts over the years, and it is also a demonstration of the achievements of Clientron's efforts in the electric vehicle market. Clientron will continue to integrate the domestic electric vehicle supply chain with years of its own accumulated system integration technology and experience, strive to create an advanced and safe smart e-cockpit, and work closely together with partners to move into the global electric vehicle market.Clientron Smart Virtual Onboard Unit won the 31st Taiwan Excellence Award

ADATA Technology, a leading manufacturer of industrial-grade DRAM modules and NAND Flash products, is pleased to announce that it will be at SIDO Paris 2022, the leading European solutions and technologies event for IoT, artificial intelligence, robotics and XR. The show will be held in Paris from November 8 – 9, 2022. At the show, ADATA will be demonstrating its 112-layer (BiCS5) 3D TLC flash storage products, including NVMe/SATA III solid state drives, memory cards, and high-capacity and high-performance DDR5 DRAM modules developed for IoT, AI and robotics applications. Visit ADATA at Palais des Congrès, Paris, booth F27. At ADATA's booth visitors will be able to see its comprehensive line-up of 112-layer (BiCS5) 3D TLC NAND flash storage products equipped with KIOXIA and WDC ICs and come with various form factors, including 2.5-inch, M.2 2280/2242 solid state drives, as well as CFast and microSD memory cards. In addition to SATA III SSDs, ADATA will showcase two PCIe Gen4x4 M.2 2280 SSDs with stunning read/write performance up to 7000/6500 MB/s, high capacities up to 4TB, and 3K P/E cycle ratings for greater product longevity. To ensure greater durability, ADATA's BiCS5 SSDs and memory cards undergo wide-temperature testing (-40°C to 85°C). Additionally, ADATA also provides multiple value-added customization services, such as A+ SLC to elevate the product durability and reliability to SLC grade, and Power Loss Protection (PLP) to ensure data integrity by adding power-retaining Tantalum polymer capacitors.With the growing demands of big data analytics, artificial intelligence, and IoT, ADATA offers high-capacity and high-performance DDR5 DRAM modules with low latency, which are essential to these applications. The DDR5 series include U-DIMM, SO-DIMM, R-DIMM, ECC U-DIMM and ECC SO-DIMM variants, featuring high speeds of up to 4800 MT/s, Power Management IC (PMIC), and on-die ECC technology. They utilize SAMSUNG ICs, offer capacities of up to 32GB, and operate at 1.1V for improved energy efficiency over DDR4. For servers and data centers, the DDR5 R-DIMM and ECC series employ 30µ PCB gold plating for improved signal transmission and come with optional features such as Anti-Sulfuration Protection and Conformal Coating for resilience against pollutants, dust, and humidity.To better understand ADATA's new products and technologies, welcome to visit SIDO Paris 2022 at Palais des Congrès, Paris, from November 8 - 9, booth F27. Please contact ADATA representatives to schedule a guided tour of the ADATA booth.For more details, please visit:ADATA's website: https://industrial.adata.com/en/edm/SIDO_PARIS_2022 ADATA's Profile Page at SIDO Paris: https://www.sido-paris.com/en/exhibitor/29928/adata-industrial/ADATA will showcase its IoT Solutions at SIDO Paris

Kasten by Veeam, the market leader for Kubernetes backup and disaster recovery, today announced the NEW Kasten by Veeam K10 V5.5 Kubernetes data management platform. Kubernetes applications are growing at a rapid pace. However, operations teams with the required skill sets to meet these demands are not able to keep up, which has made scaling simplicity of operations imperative. Purpose-built for Kubernetes, the latest release of Kasten by Veeam K10 V5.5 bridges this skills gap by introducing powerful new capabilities around autonomous operations and cloud native expansion. As a complement to the suite of modern data protection and recovery solutions offered by Veeam to protect all data assets across virtual, cloud-native, SaaS, Kubernetes and physical workloads, these advancements will address the challenges historically found in Kubernetes around operational complexity at scale, especially due to the diversity of deployment environments."Organizations need to not only transition to a new, modern cloud native development technology and workflow but also require operations at scale without having an army of Certified Kubernetes Administrators," said Gaurav Rishi, Vice President of Product and Partnerships at Kasten by Veeam. "This is where Kasten K10 shines – by scaling simplicity. Our latest release augments an organization's workforce so that the enterprise can realize cloud-native technology and operational benefits by automating several data management tasks."Backing up and protecting Kubernetes environments on top of designing and maintaining cloud-native deployments is a compounding issue for an already short-staffed workforce. Yet at the same time, the percentage of enterprises investing in Kubernetes and containerization in production continues to grow, making it critical for organizations to optimize and de-risk their large Kubernetes investments. Enabling intelligence and automation while broadening technology partnerships and business agreements ensures enterprises have wide access to the most up-to-date advancements across a spectrum of technologies in the backup and recovery process for scaling simplicity.New capabilities of Kasten K10 V5.5 include:Intelligent Policies: Kasten K10 capabilities for intelligent decisions that simplify data protection at scale. Users can now factor in the application's non-peak usage hours and specify a backup window accordingly. Kasten K10 will not only honor the backup windows but will further automate the sequencing of the underlying backup jobs. This optimizes the utilization of the underlying infrastructure and automatically handles conflict resolution when multiple policies are scheduled.Boosted ease of deployment and scale: Kasten K10 further eases onboarding by providing an intuitive graphical wizard to generate the most suitable install manifests that can be visualized and repeated for multiple installs. Kasten K10 also features IPv6 support to resolve IP exhaustion problems and address growing edge deployments with support for Amazon EKS with IPv6 inter-Pod communication, and GitOps workflow integrations offering scalable workflows for efficient app deployment as well as backup/restore.Expanded cloud-native ecosystems: Ensures customers have access to the most up-to-date advancements across increasing workload types, geographic regions, storage types, and security. Kasten K10 now supports RedHat OpenShift Virtualization enables you to run and manage Virtual Machine (VM) and container workloads side by side on Red Hat OpenShift. Additionally, Kasten K10 adds support for OCP 4.10, Kubernetes 1.23, Azure Files as a backup target and Azure Managed identity, along with additional regions for AWS (Jakarta) and GCP (Milan)."Kubernetes adoption and containerization are increasingly becoming mainstream across enterprises, but current manual steps, constant oversight and ever-present cyberattacks continue to inject complexity in the Kubernetes backup environment, hampering DevOps teams' ability to scale," said Danny Allan, CTO and Senior Vice President of Product Strategy at Veeam. "With Kasten by Veeam K10 V5.5, customers can ensure adequate data protection in Kubernetes environments by offering autonomous operations that support cloud native expansion goals. What's more, Kasten by Veeam's membership with The Open Source Security Foundation strongly underlines the company's commitment to contributing to security best practices and education for both Kasten and Veeam customers, as well as the industry at large."General availability of the new Kasten K10 V5.5 is expected later this quarter. To learn more about Kasten and see Kasten K10 V5.5 in action, visit Kasten by Veeam at KubeCon and CloudNativeCon North America.For more information, please visit www.kasten.io or try K10 for FREE.Kasten K10 V5.5 new features and capabilities aim at scaling simplicity to mitigate operational complexity and help cloud native environments reach their full potential.Photo: Kasten by Veeam

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced that GLink 2.3LL (GUC's die-to-die Link) interface IP for TSMC CoWoS and InFO chiplets integration platforms passed silicon validation and was showcased at the TSMC 2022 Open Innovation Platform (OIP) Ecosystem Forum in Santa Clara Convention Center on Oct 26, 2022.Die edge is the scarcest resource and GLink 2.3LL allows the most efficient use of it by transferring 2.5 Tbps of full-duplex user traffic per every mm of die edge. With end-to-end latency of 5 ns and measured power consumption of 0.27 pJ/bit, this is the most efficient chiplet interface on the market. GLink 2.3LL supports InFO_oS and all CoWoS types (both silicon –S and organic interposers -R). Leading AI, CPU, and automotive customers have adopted it for their next-generation products.GLink 2.0 and GLink 2.3LL specificationsGUC provides full AXI, CXS or CHI bus bridges with configurable parameters (bus width and other properties) using a GLink 2.3LL physical interface. Integrated TX and RX Clock Domain Crossing (CDC) FIFOs allow independent clock frequencies for interconnecting dies, which can be changed on the fly without any data traffic interruption. The GLink 2.3LL IP includes a Link Training hardware state machine and automatic tracking of voltage-temperature changes during normal operation, so that the user software is not involved in interface control. The training and tracking are done entirely on the RX side without any die-to-die interaction, meeting strict Automotive Functional Safety requirements. The GLink 2.3LL I/Os' high cross-talk tolerance allows CoWoS/InFO unshielded routing, effectively doubling the number of signal traces for the interposer or RDL. GLink 2.3LL has redundant lanes that replace faulty ones during production tests or in the field. The proteanTecs interconnect monitoring system is integrated into the PHY. It can be used to monitor the signal quality of every physical lane during normal operation in order to observe lane degradation due to TSMC CoWoS or InFO_oS physical effects. This supports decisions to replace marginal quality lanes with redundant ones to prevent system failures and extend the product's life cycle.The version of GLink 2.3LL for TSMC N3E will be available in Q1, 2023 and the GLink automotive version on TSMC N5A process will be ready in 2024. GUC's implementation of UCIe takes advantage of our expertise with many silicon-proven generations of GLink IPs, making our path to UCIe low risk."Chiplet-based architectures using CoWoS and InFO have become mainstream for infrastructure products and GUC is uniquely positioned with its long experience of developing HBM and GLink IPs and high-volume manufacturing CoWoS products. With the new GLink 2.3LL silicon validation, GUC demonstrates its long-term commitment to providing the most competitive 2.5D total solution, including a first-in-the-industry silicon-proven HBM3 PHY & Controller, GLink 2.5D and 3D chiplet interfaces, electrical and thermal simulations, package design, DFT and production tests, CoWoS and InFO manufacturing expertise," explains Sean Tai, president of GUC."We are designing our IPs for error-free operation in >1000W multi-chiplet ASICs. We test their immunity to high power noise, temperature and voltage cycling, with months of error-free operation in very harsh conditions. We leverage our ASIC production experience to define a comprehensive silicon validation test suite. We are committed to doubling bandwidth density every year while keeping power and latency low, enabling the CPU, GPU, DPU, AI, automotive and network processors of the future," said Igor Elkanovich, CTO of GUC.Key GLink 2.3LL highlightsLearn More about GUC's GLink IP with InFO/CoWoS Total SolutionFor more information, please contact your GUC sales representative directly or email guc_sales@guc-asic.com

Due to the trend towards net zero emissions, global supply chain operators must fulfill the requirements of environmental protection, energy saving, and sustainable operation. Measures to respond to global supply chain transfer as a result of this green revolution have become a priority issue for Taiwan's electronics manufacturing industry. James Hwang, Chairman and President of Getac Holdings Corporation, was invited to deliver the keynote speech at the 2022 DIGITIMES Supply Chain Summit. This event, which is held annually, centered around the topic of "Building a Resilient Supply Chain" this year. James Hwang used his own work on supply chain transfers as an example, hoping to give the industry a different perspective.Getac Holdings Corporation is an umbrella organization that covers the Rugged Computer Business Group, the Mechatronic and Energy Business Group, the Plastics Business Group, and the Automotive Business Group. In October 2022, Getac Holdings Corporation officially subdivided the Rugged Computer Business Group and Mechatronic and Energy Business Group and formed two subsidiaries – GTC Solution Corporation (later renamed Getac Technology Corporation) and Atemitech Corporation. Additionally, with MPT Solution in the Plastic Business Group and Getac Precision Technology in the Automotive Business Group, Getac has built the foundations and platforms for talent management by having each individual company focus on its dedicated fields. Furthermore, with active participation in business cooperation with strategic partners, integration and development in joint ventures, and shareholding, Getac Holdings Corporation has created the springboard to build integrated platforms to improve managerial effectiveness, thereby boosting the organization's overall long-term competitiveness and international market visibility.Emerging Short-Chain Revolution in Global Supply ChainFrom Getac's point of view, the implementation of supply chain transfer plans involves continuous and long-term investment. Based on the experience of setting up factories in China and Vietnam over the last 15 years, supply chains are built up step by step to maximize profitability. When setting up factories in China, the supply chain could be operated with a long-chain service structure; however, it is not wise to copy this strategy to execute factory expansion plans in Vietnam.The follow-up effects of several supply chain disruption crises since 2020 have caused major brands in Europe and the United States to establish new plans for supply chain reorganization. The trends observed by James Hwang include (1) shortening supply chains, (2) risk diversification, with multiple manufacturing sites to achieve cross-border and cross-regional supply chain reorganization, (3) industrialized countries promoting the return of manufacturing (4) an increasing emphasis on domestic production for value industries, (5) the beginnings of smart manufacturing and automation technology upgrades, and (6) major overhauls to green/ESG supply chains. In short, in the past, supply chains were concentrated in Asia, but now it will turn into a pattern of division of work in core areas, such as the US, Europe, and Asia.The general trend of globalization, local manufacturing, and green manufacturing have forced Taiwanese businesses to tackle a series of new problems. First, the challenge of finding local suppliers for local supply. Second, green manufacturing and alternative suppliers inevitably lead to increased costs. Third, inventory being spread across multiple locations increases overall operating costs. Fourth, supply chain ESG management is difficult. Fifth, the crisis of chain disconnection caused by force majeure. With the black swan events seen over 2022, such as lockdowns, port congestion, and soaring energy prices, the uncertainty has surged.Strengthening Supply Chain Resilience is the KeyMoreover, there are global challenges involved when implementing manufacturing at multiple sites. These include (1) without increasing orders from primary customers, manufacturing at multiple sites would lead to the issue of excess production capacity, causing old factories to stand idle while new factories only operate at partial capacity, (2) technical/professional talent shortages, (3) the difficulty and complexity of multinational management, (4) increased manufacturing costs and capital expenditures, (5) the difficulties associated with resource integration, and the ensuing crises.According to James Hwang's observations, many companies are planning new factories or factory expansion in ASEAN countries due to Taiwan's New Southbound Strategy, and India, Malaysia, and Vietnam have drawn particular attention. However, different challenges have come up one after another, with language barriers and different understandings of legal interpretations leading to a great deal of wasted time and effort. These problems cannot be solved simply by passing authority to top executives or professional managers in an area and telling them to handle it. Instead, this leads to prohibitively high overall operating costs prohibitive and unpredictable results.Strengthen the Role of the Regional Operations Center at the Taiwan HeadquartersThe solution to the challenges of the southbound expansion strategy is to plan shorter supply chains and focus on looking for alternative suppliers. To reduce reliance, opportunities for returning to invest in Taiwan are also being planned. James Hwang especially pointed out that Taiwanese businesses in Xinzhuang, Shulin, and Wugu districts invested in their own production capacity strategies, and even formed cooperative investments or cross-holdings with primary suppliers to maintain close relationships with supply chain companies. This further leads to benefits from integrated supply chains. The successful implementation of this strategy can serve as a good example for strengthening the resilience of the supply chain and the expansion of overseas production.Supply chain resilience is a key issue that requires continued efforts. James Hwang listed the key strategies, including (1) assisting their OEM/ODM factories to quickly establish a short-chain supply chain, (2) reaching out to suppliers with multinational operation capabilities and improving logistics visibility, (3) developing and identifying local suppliers with qualifications and execution capabilities, and (4) building an in-house supply chain to strengthen the company's capability to respond to challenges internally and to have the ability to manage risk and overcome difficulties in the event of supply chain disruptions.Improved digital transformation is the foundation of a high-resilience supply chain, the key element of which is the application of digital technology. Currently, the focus is on smart factories, the Internet of Machines, and smart manufacturing, as well as smart centralized control analysis and response. Getac is collaborating with large technology companies such as Microsoft to develop AI machine vision inspection in automated equipment, which will replace manual inspection processes with AI and lessen the burden of direct labor. This, in turn, will also reduce the indirect labor requirements of factory management, which will lead to significant improvements in the operation efficiency of human resources. The use of these digital tools can also be customized for local conditions. The successful establishment of such automated production systems, and the good reputations they have earned, means they can be implemented with immediate results when new factories are established in Southeast Asia. Investment in smart factories can produce satisfyingly good value especially when there is a shortage of manpower and orders are not coming in with regularity.In addition, Getac's development center in China has implemented a strategy of remote collaboration to enable key process equipment to activate remote control mechanisms, including remote monitoring, remote assistance, and smart analysis. This has created a series of significant benefits, including remote machinery adjustment and trial production, remote product defect review, remote operation guidance, remote troubleshooting, and other feasible and highly effective methods. These are methods Getac is currently pursuing for the establishment of short-chain supply chains and the strategies of the head office's regional operations center, so that the benefits of building a supply chain can be maximized, thereby enhancing the company's competitiveness and ensuring that future growth opportunities can be benefited from.James Hwang, Chairman of Getac Holdings Corporation, was invited to share his experience in building a resilient supply chain at DIGITIMES.

United Microelectronics Corporation (UMC), a leading semiconductor foundry, announced today that UMC was named "Best Silicon Foundry (CMOS)" by Infineon Technologies, recognizing UMC's dedication to manufacturing excellence and strong commitment to support customers amid recent supply chain disruptions. The award was presented to UMC during Infineon's 2022 Global Supplier Day, which took place in Kuala Lumpur on October 13."Infineon highly appreciates UMC's commitment and extra capacity support amid unprecedented supply chain disruptions over the past two years. UMC has been a reliable manufacturing partner for Infineon for more than two decades, and I'm pleased to further leverage our synergistic relationship and deepen collaboration across several market segments," said Rutger Wijburg, chief operating officer of Infineon."It is a great honor to receive this recognition from Infineon, a technology leader in automotive electronics and a longtime partner of UMC. We strive to earn trust from customers by providing consistent quality, dependable capacity, and relevant technologies that align with their product roadmaps," said Steven Liu, vice president of Europe and Japan sales at UMC. "We are excited to grow together with Infineon as we pursue high growth markets benefiting from the ongoing transformation in the automotive industry as well as the rise in 5G and AIoT."UMC's vice president of Europe and Japan sales (second from left), and Alexander Qu, general manager of UMC BV Europe (second from right), were presented with "Best Silicon Foundry (CMOS)" award at Infineon's 2022 Global Supplier Day.

As global economic downturn affects consumer markets, and cryptocurrency itself goes through some major changes, a new crash in demand is once again influencing electronic component supply. As crypto continues to shift availability and pricing of components, companies should track its movements to secure their own supply chains.How Has Cryptocurrency Influenced the Semiconductor Industry?The crypto market is intricately woven into supply and demand for the semiconductor industry, and crypto's fluctuating value has shown the effect it can have.In 2017, crypto miners stockpiled supply of Nvidia's GTX 10 series and AMD's RX 500 series graphic cards and consequently drove them into a shortage. Nvidia tried to discourage crypto mining customers by reducing their chips' mining efficiency by 50%, but they continued to buy the parts regardless and drove up pricing.During the COVID-19 pandemic, consumers upgraded computers for both professional and personal use. This, combined with a boom in crypto demand, caused component prices to skyrocket while supply dwindled. Manufacturers' suggested retail prices (MSRP) for GPUs tripled during periods of intense demand. Supply decreased to the point that consumers were forced to pay scalpers outrageously marked-up prices.By 2021, crypto mining comprised 35% of global consumer demand for GPUs. The number of orders for DRAM components, GPUs, plus other advanced chips and wafers overwhelmed manufacturers and once again caused a supply race.How Proof-of-Stake Changes the GameEthereum was the top consumer of high-end GPUs through 2021, but a new "proof-of-stake" mining system has eliminated the need for GPU cards. In preparation for this process, demand for GPUs fell rapidly in the beginning of 2022. The first two months of the year saw Nvidia's sales of GPU cards drop by 75% in comparison to the year prior.Additionally, proof-of-stake is predicted to reduce global electricity consumption by 0.2%. This comes just in time, as environmental policies have started to focus on crypto's excessive use of energy. Previously, bitcoin mining operations alone accounted for 2.2 GW of total energy consumption in China. China's recently announced carbon neutral policy put a target on crypto mining, making it a popular target for cutbacks in energy consumption.Environmental policies like this, combined with the drop in demand caused by global economic downturn and Ethereum's new system, have caused GPU prices to fall below MSRP, and demand has flatlined.How Your Business Can Secure SupplyWhile manufacturers and their customers don't need to understand all the ins and outs of crypto, it shouldn't be ignored as a factor in the supply chain as it has repeatedly proven its ability to introduce volatility into the semiconductor market.When crypto prices rise, the cost of components will likely follow suit. If companies are looking for cost-saving opportunities, they should take advantage of the current market and buy components now while crypto demand and pricing is low. If the crypto craze returns with a vengeance, this market won't stick around for long.What crypto volatility means for the electronic component supply chainPhoto: Fusion Worldwide

Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announced the global launch of 5G module FG370 at Broadband World Forum 2022. Powered by the newly-launched MediaTek T830 platform, FG370 is set to bring enhanced mobile broadband, low latency, and ultra-reliable 5G Fixed Wireless Access (FWA) connectivity solution for global operators.Compliant with 3GPP Release 16 (R16) standards, the 5G Sub-6GHz module FG370 enables lightning-fast 5G speed experience with up to 7.01Gbps on the downlink and 2.5Gbps on the uplink theoretically. Coming with a quad-core Arm Cortex-A55 CPU, FG370 supports 4CC CA (Carrier Aggregation) and up to 300MHz of spectrum, as well as 2CC CA and up to 200MHz of spectrum, which improve the utilization of spectrum resources and ensure an extended 5G coverage. Supporting 5G standalone network (SA) and non-standalone (NSA) network architectures, the module is also backward compatible with LTE-TDD, LTE-FDD and WCDMA network standards.In addition, FG370 supports 8 RX (Receive Antennas), enhancing downlink speed, spectral efficiency and coverage quality. The module also supports Power Class 1.5 (PC1.5) High Power User Equipment (HPUE), which allows a maximum transmit power of up to 29dBm, 6dB higher than that of PC3, and 3dB higher than that of PC2, significantly increasing uplink speed and extending uplink coverage. With enhancements in terms of uplink and downlink speed and coverage, FG370 can provide better user experience while offering seamless 5G connectivity for FWA.It is worth noting that, FG370 can support enhanced connectivity solutions, including Dual-band 2×2 Wi-Fi 7 for MiFi (BE6500) and Tri-band 4×4 Wi-Fi 7 for CPE (BE19000). These solutions feature new Wi-Fi 7 capabilities such as 160MHz/ 320MHz bandwidth, 6GHz frequency band, 4096 QAM, as well as Multi-Link Operation (MLO). The module also supports wired network deployment, allowing maximum 10Gb Ethernet, satisfying different application requirements.With a rich extension of interfaces including 10GbE USXGMII/ PCI-Express/ USB 3.2, plus PCM/SPI for connection to external SLIC for RJ11 phone ports, FG370 seamlessly enables a wide range of IoT applications, providing high-speed 5G experience for customers. The module also integrates MediaTek's 5G UltraSave technologies to optimize energy efficiency for 5G connections, especially 5G MiFi."Fibocom is pleased to work with MediaTek to contribute to the proliferation of 5G," said Simon Tao, General Manager of MBB Product Management Dept., Fibocom. "We're delighted to introduce the new generation of 5G module FG370 to the global FWA market, further boosting 5G commercialization with enhanced coverage, increased throughput as well as optimized capacity."Fibocom launched 5G module FG370 based on MediaTek T830 platform

Today at 2022 OCP Global Summit, Ingrasys, a global leading cloud IT and infrastructure provider, exhibited its fully integrated OCP solutions that empower tomorrow's computing at its booth C16. The OCP Summit is an in-person event this year, which takes place at the San Jose Convention Center from October 18-20 to gather technologists for celebrating and recognizing wonderful accomplishments.A pioneer of realizing the benefits of modular design, Ingrasys showcased an OCP-compliant, Liquid-cooling Modular Building Block during the summit, a first-of-its-kind in the industry. Its composable reusable modules – HPM, DC-SCM, OCP NIC 3.0, high-speed I/O, and chassis – echo the design concept of OCP Modular Hardware System Sub-Project to open up unlimited flexibility and possibilities. Moreover, with a sustainability focus, the Building Block incorporates liquid cooling technology to reduce the environmental impact to a minimum extent.Besides OCP server solution, Ingrasys also provided a comprehensive OCP rack-level solution, ORv3 Air-assisted Liquid Rack, which fully leverages ingrasys innovative technologies to combine powerful computing, direct-to-chip liquid cooling, centralized power, and smart management into one single rack. Featuring an all-in-one solution, the ORv3 Rack focuses on optimizing all open rack hardware to deliver the unprecedented performance and power efficiency that today's data centers require.As an active supporter of open collaboration and standards, Ingrasys is dedicated to providing more high-performance, efficient OCP solutions for data centers and beyond, and will keep growing its presence in the OCP community to empower the future with breakthrough innovations.About IngrasysIngrasys Inc., a global leading cloud infrastructure provider, leverages innovative technologies – Hyper-Converged Infrastructure (HCI), Composable Disaggregated Infrastructure (CDI), HPC, AI/Machine Learning, and Advanced Cooling – to provide worldwide customers with tailored solutions that drive their business forward. For more information about Ingrasys, visit Ingrasys website.2022 OCP Global Summit at San Jose from October 18-20Ingrasys OCP architectures open the future

In response to global warming and greenhouse effects, energy conversion has become an extremely important subject matter in the area of global environmental sustainability. The promotion and development of renewable energy has become a focal point of economic, trade and environmental policies in many countries. Among the many present renewable energy sources, solar technology development is relatively mature. According to a marketsandresearch.biz survey, the global MPPT PV Solar Energy Charge Controller market size was estimated to be 173 million USD in 2021, however it is expected to grow to a figure of 246 million USD by 2028, showing a compound annual growth rate (CAGR) of 5.2 %.Holtek Semiconductor is a professional MCU design company. With a focus on ESG environment sustainable development, it has recently launched its "MPPT solar charge controller" application solution. This solution has, at its core, an Arm Cortex-M 32-bit MCU as the main controller, giving it the ability to fully maximise available sunlight to electrical energy conversion efficiency to achieve superior energy storage effects.Present day solar photovoltaic power generation systems include solar panels, controllers, batteries and related loads. In all applications, the controller adopts an extremely critical role in its management of the entire system. One important differentiation between different charge controllers is that of PWM (Pulse Width Modulation) and MPPT (Maximum Power Point Tracking), but it is MPPT that has the higher charging conversion efficiency. MPPT technology has the ability to maximise the solar energy conversion and store the energy in batteries. It is also responsible for controlling start and stop load switching and for implementing protection functions, etc. The selection of an MPPT solar charge controller can be evaluated from three standpoints.AlgorithmsAs solar panels are affected by environmental factors such as the amount of available solar radiation and ambient temperature, the maximum output power will be dependent upon these environmental conditions. Using an MPPT algorithm to track these factors will ensure that related products operate at their maximum power point and achieve optimal energy conversion.Mainstream MPPT algorithms normally utilise an open-circuit voltage method, short-circuit current method, disturbance observation method and conductivity incremental method. After undergoing comprehensive Holtek evaluation, it was decided to utilise a Holtek Arm Cortex-M0+ HT32 MCU at the core of the design for the solar controller using the MPPT disturbance observation method. This method changes the voltage to observe the present real time power, and then compares it with changes in the recent before/after two power values to adjust the voltage magnitude of the next cycle in real time. Repeating this process will ensure that the energy conversion operates at its maximum power point to achieve optimal battery charging.This solution can achieve MPPT efficiencies in excess of 99%, reaching beyond the expectations of present market products.MCU typesHoltek has a comprehensive range of 32-bit MCUs allowing customers to choose the most cost-effective MCU device for their MPPT solar charge controller according to their product type, function and HMI requirements.The MCU includes a wide array of significant integrated peripheral IPs. For PMOS/NMOS driving, there are complementary PWM output functions, which have a programmable dead-time generator providing improved safer operation of the charging/discharging circuit. There are integrated OPAs, which can be used for noise filter circuit design and for current and voltage sampling amplification to improve measurement accuracy. Also integrated are comparator and DAC functions, which are used to implement overcurrent, overvoltage and other protection features.The HT32 MCUs have passed UL/IEC 60730-1 Class B software certification and can therefore provide relevant and complete self-test procedures.Conversion efficiency and management functionsThe MPPT solar charge controller is designed using a HT32 microcontroller which includes Constant Current and Constant Voltage charging as well as tracking transient maximum power charging.The high-frequency DC-DC conversion charging/discharging circuit can effectively reduce energy loss, greatly improve charging efficiency, being able to provide conversion efficiencies as high as 92%.The MCU main controller manages the charging/discharging process intelligently and is therefore able to reduce the risk of battery damage as well as extending battery life.As an overall evaluation, this solution includes the advantages of automatic battery voltage measurement, smart charging, high MPPT tracking efficiency and high charging conversion efficiency as well as having a comprehensive set of protection features. This range of features combine to make it highly suitable for various battery types to meet the needs of a wide range of related products.HOLTEK not only provides MPPT solar charge controller solutions using its 32-bit MCU design that can be quickly introduced into volume production, but additionally its highly experienced design team can modify and optimise the customer's MPPT charging technology applications according to the inherent characteristics of the customer's energy storage battery. If customers decide to also use the Holtek application specific Inverter MCU HT45F5V, this carries the possibility of expanding the application product's function to incorporate multi-functional solar inverter energy storage box features.HOLTEK HT32 MPPT solar energy charger solution