Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced that GLink 2.3LL (GUC's die-to-die Link) interface IP for TSMC CoWoS and InFO chiplets integration platforms passed silicon validation and was showcased at the TSMC 2022 Open Innovation Platform (OIP) Ecosystem Forum in Santa Clara Convention Center on Oct 26, 2022.Die edge is the scarcest resource and GLink 2.3LL allows the most efficient use of it by transferring 2.5 Tbps of full-duplex user traffic per every mm of die edge. With end-to-end latency of 5 ns and measured power consumption of 0.27 pJ/bit, this is the most efficient chiplet interface on the market. GLink 2.3LL supports InFO_oS and all CoWoS types (both silicon –S and organic interposers -R). Leading AI, CPU, and automotive customers have adopted it for their next-generation products.GLink 2.0 and GLink 2.3LL specificationsGUC provides full AXI, CXS or CHI bus bridges with configurable parameters (bus width and other properties) using a GLink 2.3LL physical interface. Integrated TX and RX Clock Domain Crossing (CDC) FIFOs allow independent clock frequencies for interconnecting dies, which can be changed on the fly without any data traffic interruption. The GLink 2.3LL IP includes a Link Training hardware state machine and automatic tracking of voltage-temperature changes during normal operation, so that the user software is not involved in interface control. The training and tracking are done entirely on the RX side without any die-to-die interaction, meeting strict Automotive Functional Safety requirements. The GLink 2.3LL I/Os' high cross-talk tolerance allows CoWoS/InFO unshielded routing, effectively doubling the number of signal traces for the interposer or RDL. GLink 2.3LL has redundant lanes that replace faulty ones during production tests or in the field. The proteanTecs interconnect monitoring system is integrated into the PHY. It can be used to monitor the signal quality of every physical lane during normal operation in order to observe lane degradation due to TSMC CoWoS or InFO_oS physical effects. This supports decisions to replace marginal quality lanes with redundant ones to prevent system failures and extend the product's life cycle.The version of GLink 2.3LL for TSMC N3E will be available in Q1, 2023 and the GLink automotive version on TSMC N5A process will be ready in 2024. GUC's implementation of UCIe takes advantage of our expertise with many silicon-proven generations of GLink IPs, making our path to UCIe low risk."Chiplet-based architectures using CoWoS and InFO have become mainstream for infrastructure products and GUC is uniquely positioned with its long experience of developing HBM and GLink IPs and high-volume manufacturing CoWoS products. With the new GLink 2.3LL silicon validation, GUC demonstrates its long-term commitment to providing the most competitive 2.5D total solution, including a first-in-the-industry silicon-proven HBM3 PHY & Controller, GLink 2.5D and 3D chiplet interfaces, electrical and thermal simulations, package design, DFT and production tests, CoWoS and InFO manufacturing expertise," explains Sean Tai, president of GUC."We are designing our IPs for error-free operation in >1000W multi-chiplet ASICs. We test their immunity to high power noise, temperature and voltage cycling, with months of error-free operation in very harsh conditions. We leverage our ASIC production experience to define a comprehensive silicon validation test suite. We are committed to doubling bandwidth density every year while keeping power and latency low, enabling the CPU, GPU, DPU, AI, automotive and network processors of the future," said Igor Elkanovich, CTO of GUC.Key GLink 2.3LL highlightsLearn More about GUC's GLink IP with InFO/CoWoS Total SolutionFor more information, please contact your GUC sales representative directly or email guc_sales@guc-asic.com
Due to the trend towards net zero emissions, global supply chain operators must fulfill the requirements of environmental protection, energy saving, and sustainable operation. Measures to respond to global supply chain transfer as a result of this green revolution have become a priority issue for Taiwan's electronics manufacturing industry. James Hwang, Chairman and President of Getac Holdings Corporation, was invited to deliver the keynote speech at the 2022 DIGITIMES Supply Chain Summit. This event, which is held annually, centered around the topic of "Building a Resilient Supply Chain" this year. James Hwang used his own work on supply chain transfers as an example, hoping to give the industry a different perspective.Getac Holdings Corporation is an umbrella organization that covers the Rugged Computer Business Group, the Mechatronic and Energy Business Group, the Plastics Business Group, and the Automotive Business Group. In October 2022, Getac Holdings Corporation officially subdivided the Rugged Computer Business Group and Mechatronic and Energy Business Group and formed two subsidiaries – GTC Solution Corporation (later renamed Getac Technology Corporation) and Atemitech Corporation. Additionally, with MPT Solution in the Plastic Business Group and Getac Precision Technology in the Automotive Business Group, Getac has built the foundations and platforms for talent management by having each individual company focus on its dedicated fields. Furthermore, with active participation in business cooperation with strategic partners, integration and development in joint ventures, and shareholding, Getac Holdings Corporation has created the springboard to build integrated platforms to improve managerial effectiveness, thereby boosting the organization's overall long-term competitiveness and international market visibility.Emerging Short-Chain Revolution in Global Supply ChainFrom Getac's point of view, the implementation of supply chain transfer plans involves continuous and long-term investment. Based on the experience of setting up factories in China and Vietnam over the last 15 years, supply chains are built up step by step to maximize profitability. When setting up factories in China, the supply chain could be operated with a long-chain service structure; however, it is not wise to copy this strategy to execute factory expansion plans in Vietnam.The follow-up effects of several supply chain disruption crises since 2020 have caused major brands in Europe and the United States to establish new plans for supply chain reorganization. The trends observed by James Hwang include (1) shortening supply chains, (2) risk diversification, with multiple manufacturing sites to achieve cross-border and cross-regional supply chain reorganization, (3) industrialized countries promoting the return of manufacturing (4) an increasing emphasis on domestic production for value industries, (5) the beginnings of smart manufacturing and automation technology upgrades, and (6) major overhauls to green/ESG supply chains. In short, in the past, supply chains were concentrated in Asia, but now it will turn into a pattern of division of work in core areas, such as the US, Europe, and Asia.The general trend of globalization, local manufacturing, and green manufacturing have forced Taiwanese businesses to tackle a series of new problems. First, the challenge of finding local suppliers for local supply. Second, green manufacturing and alternative suppliers inevitably lead to increased costs. Third, inventory being spread across multiple locations increases overall operating costs. Fourth, supply chain ESG management is difficult. Fifth, the crisis of chain disconnection caused by force majeure. With the black swan events seen over 2022, such as lockdowns, port congestion, and soaring energy prices, the uncertainty has surged.Strengthening Supply Chain Resilience is the KeyMoreover, there are global challenges involved when implementing manufacturing at multiple sites. These include (1) without increasing orders from primary customers, manufacturing at multiple sites would lead to the issue of excess production capacity, causing old factories to stand idle while new factories only operate at partial capacity, (2) technical/professional talent shortages, (3) the difficulty and complexity of multinational management, (4) increased manufacturing costs and capital expenditures, (5) the difficulties associated with resource integration, and the ensuing crises.According to James Hwang's observations, many companies are planning new factories or factory expansion in ASEAN countries due to Taiwan's New Southbound Strategy, and India, Malaysia, and Vietnam have drawn particular attention. However, different challenges have come up one after another, with language barriers and different understandings of legal interpretations leading to a great deal of wasted time and effort. These problems cannot be solved simply by passing authority to top executives or professional managers in an area and telling them to handle it. Instead, this leads to prohibitively high overall operating costs prohibitive and unpredictable results.Strengthen the Role of the Regional Operations Center at the Taiwan HeadquartersThe solution to the challenges of the southbound expansion strategy is to plan shorter supply chains and focus on looking for alternative suppliers. To reduce reliance, opportunities for returning to invest in Taiwan are also being planned. James Hwang especially pointed out that Taiwanese businesses in Xinzhuang, Shulin, and Wugu districts invested in their own production capacity strategies, and even formed cooperative investments or cross-holdings with primary suppliers to maintain close relationships with supply chain companies. This further leads to benefits from integrated supply chains. The successful implementation of this strategy can serve as a good example for strengthening the resilience of the supply chain and the expansion of overseas production.Supply chain resilience is a key issue that requires continued efforts. James Hwang listed the key strategies, including (1) assisting their OEM/ODM factories to quickly establish a short-chain supply chain, (2) reaching out to suppliers with multinational operation capabilities and improving logistics visibility, (3) developing and identifying local suppliers with qualifications and execution capabilities, and (4) building an in-house supply chain to strengthen the company's capability to respond to challenges internally and to have the ability to manage risk and overcome difficulties in the event of supply chain disruptions.Improved digital transformation is the foundation of a high-resilience supply chain, the key element of which is the application of digital technology. Currently, the focus is on smart factories, the Internet of Machines, and smart manufacturing, as well as smart centralized control analysis and response. Getac is collaborating with large technology companies such as Microsoft to develop AI machine vision inspection in automated equipment, which will replace manual inspection processes with AI and lessen the burden of direct labor. This, in turn, will also reduce the indirect labor requirements of factory management, which will lead to significant improvements in the operation efficiency of human resources. The use of these digital tools can also be customized for local conditions. The successful establishment of such automated production systems, and the good reputations they have earned, means they can be implemented with immediate results when new factories are established in Southeast Asia. Investment in smart factories can produce satisfyingly good value especially when there is a shortage of manpower and orders are not coming in with regularity.In addition, Getac's development center in China has implemented a strategy of remote collaboration to enable key process equipment to activate remote control mechanisms, including remote monitoring, remote assistance, and smart analysis. This has created a series of significant benefits, including remote machinery adjustment and trial production, remote product defect review, remote operation guidance, remote troubleshooting, and other feasible and highly effective methods. These are methods Getac is currently pursuing for the establishment of short-chain supply chains and the strategies of the head office's regional operations center, so that the benefits of building a supply chain can be maximized, thereby enhancing the company's competitiveness and ensuring that future growth opportunities can be benefited from.James Hwang, Chairman of Getac Holdings Corporation, was invited to share his experience in building a resilient supply chain at DIGITIMES.
United Microelectronics Corporation (UMC), a leading semiconductor foundry, announced today that UMC was named "Best Silicon Foundry (CMOS)" by Infineon Technologies, recognizing UMC's dedication to manufacturing excellence and strong commitment to support customers amid recent supply chain disruptions. The award was presented to UMC during Infineon's 2022 Global Supplier Day, which took place in Kuala Lumpur on October 13."Infineon highly appreciates UMC's commitment and extra capacity support amid unprecedented supply chain disruptions over the past two years. UMC has been a reliable manufacturing partner for Infineon for more than two decades, and I'm pleased to further leverage our synergistic relationship and deepen collaboration across several market segments," said Rutger Wijburg, chief operating officer of Infineon."It is a great honor to receive this recognition from Infineon, a technology leader in automotive electronics and a longtime partner of UMC. We strive to earn trust from customers by providing consistent quality, dependable capacity, and relevant technologies that align with their product roadmaps," said Steven Liu, vice president of Europe and Japan sales at UMC. "We are excited to grow together with Infineon as we pursue high growth markets benefiting from the ongoing transformation in the automotive industry as well as the rise in 5G and AIoT."UMC's vice president of Europe and Japan sales (second from left), and Alexander Qu, general manager of UMC BV Europe (second from right), were presented with "Best Silicon Foundry (CMOS)" award at Infineon's 2022 Global Supplier Day.
As global economic downturn affects consumer markets, and cryptocurrency itself goes through some major changes, a new crash in demand is once again influencing electronic component supply. As crypto continues to shift availability and pricing of components, companies should track its movements to secure their own supply chains.How Has Cryptocurrency Influenced the Semiconductor Industry?The crypto market is intricately woven into supply and demand for the semiconductor industry, and crypto's fluctuating value has shown the effect it can have.In 2017, crypto miners stockpiled supply of Nvidia's GTX 10 series and AMD's RX 500 series graphic cards and consequently drove them into a shortage. Nvidia tried to discourage crypto mining customers by reducing their chips' mining efficiency by 50%, but they continued to buy the parts regardless and drove up pricing.During the COVID-19 pandemic, consumers upgraded computers for both professional and personal use. This, combined with a boom in crypto demand, caused component prices to skyrocket while supply dwindled. Manufacturers' suggested retail prices (MSRP) for GPUs tripled during periods of intense demand. Supply decreased to the point that consumers were forced to pay scalpers outrageously marked-up prices.By 2021, crypto mining comprised 35% of global consumer demand for GPUs. The number of orders for DRAM components, GPUs, plus other advanced chips and wafers overwhelmed manufacturers and once again caused a supply race.How Proof-of-Stake Changes the GameEthereum was the top consumer of high-end GPUs through 2021, but a new "proof-of-stake" mining system has eliminated the need for GPU cards. In preparation for this process, demand for GPUs fell rapidly in the beginning of 2022. The first two months of the year saw Nvidia's sales of GPU cards drop by 75% in comparison to the year prior.Additionally, proof-of-stake is predicted to reduce global electricity consumption by 0.2%. This comes just in time, as environmental policies have started to focus on crypto's excessive use of energy. Previously, bitcoin mining operations alone accounted for 2.2 GW of total energy consumption in China. China's recently announced carbon neutral policy put a target on crypto mining, making it a popular target for cutbacks in energy consumption.Environmental policies like this, combined with the drop in demand caused by global economic downturn and Ethereum's new system, have caused GPU prices to fall below MSRP, and demand has flatlined.How Your Business Can Secure SupplyWhile manufacturers and their customers don't need to understand all the ins and outs of crypto, it shouldn't be ignored as a factor in the supply chain as it has repeatedly proven its ability to introduce volatility into the semiconductor market.When crypto prices rise, the cost of components will likely follow suit. If companies are looking for cost-saving opportunities, they should take advantage of the current market and buy components now while crypto demand and pricing is low. If the crypto craze returns with a vengeance, this market won't stick around for long.What crypto volatility means for the electronic component supply chainPhoto: Fusion Worldwide
Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announced the global launch of 5G module FG370 at Broadband World Forum 2022. Powered by the newly-launched MediaTek T830 platform, FG370 is set to bring enhanced mobile broadband, low latency, and ultra-reliable 5G Fixed Wireless Access (FWA) connectivity solution for global operators.Compliant with 3GPP Release 16 (R16) standards, the 5G Sub-6GHz module FG370 enables lightning-fast 5G speed experience with up to 7.01Gbps on the downlink and 2.5Gbps on the uplink theoretically. Coming with a quad-core Arm Cortex-A55 CPU, FG370 supports 4CC CA (Carrier Aggregation) and up to 300MHz of spectrum, as well as 2CC CA and up to 200MHz of spectrum, which improve the utilization of spectrum resources and ensure an extended 5G coverage. Supporting 5G standalone network (SA) and non-standalone (NSA) network architectures, the module is also backward compatible with LTE-TDD, LTE-FDD and WCDMA network standards.In addition, FG370 supports 8 RX (Receive Antennas), enhancing downlink speed, spectral efficiency and coverage quality. The module also supports Power Class 1.5 (PC1.5) High Power User Equipment (HPUE), which allows a maximum transmit power of up to 29dBm, 6dB higher than that of PC3, and 3dB higher than that of PC2, significantly increasing uplink speed and extending uplink coverage. With enhancements in terms of uplink and downlink speed and coverage, FG370 can provide better user experience while offering seamless 5G connectivity for FWA.It is worth noting that, FG370 can support enhanced connectivity solutions, including Dual-band 2×2 Wi-Fi 7 for MiFi (BE6500) and Tri-band 4×4 Wi-Fi 7 for CPE (BE19000). These solutions feature new Wi-Fi 7 capabilities such as 160MHz/ 320MHz bandwidth, 6GHz frequency band, 4096 QAM, as well as Multi-Link Operation (MLO). The module also supports wired network deployment, allowing maximum 10Gb Ethernet, satisfying different application requirements.With a rich extension of interfaces including 10GbE USXGMII/ PCI-Express/ USB 3.2, plus PCM/SPI for connection to external SLIC for RJ11 phone ports, FG370 seamlessly enables a wide range of IoT applications, providing high-speed 5G experience for customers. The module also integrates MediaTek's 5G UltraSave technologies to optimize energy efficiency for 5G connections, especially 5G MiFi."Fibocom is pleased to work with MediaTek to contribute to the proliferation of 5G," said Simon Tao, General Manager of MBB Product Management Dept., Fibocom. "We're delighted to introduce the new generation of 5G module FG370 to the global FWA market, further boosting 5G commercialization with enhanced coverage, increased throughput as well as optimized capacity."Fibocom launched 5G module FG370 based on MediaTek T830 platform
Today at 2022 OCP Global Summit, Ingrasys, a global leading cloud IT and infrastructure provider, exhibited its fully integrated OCP solutions that empower tomorrow's computing at its booth C16. The OCP Summit is an in-person event this year, which takes place at the San Jose Convention Center from October 18-20 to gather technologists for celebrating and recognizing wonderful accomplishments.A pioneer of realizing the benefits of modular design, Ingrasys showcased an OCP-compliant, Liquid-cooling Modular Building Block during the summit, a first-of-its-kind in the industry. Its composable reusable modules – HPM, DC-SCM, OCP NIC 3.0, high-speed I/O, and chassis – echo the design concept of OCP Modular Hardware System Sub-Project to open up unlimited flexibility and possibilities. Moreover, with a sustainability focus, the Building Block incorporates liquid cooling technology to reduce the environmental impact to a minimum extent.Besides OCP server solution, Ingrasys also provided a comprehensive OCP rack-level solution, ORv3 Air-assisted Liquid Rack, which fully leverages ingrasys innovative technologies to combine powerful computing, direct-to-chip liquid cooling, centralized power, and smart management into one single rack. Featuring an all-in-one solution, the ORv3 Rack focuses on optimizing all open rack hardware to deliver the unprecedented performance and power efficiency that today's data centers require.As an active supporter of open collaboration and standards, Ingrasys is dedicated to providing more high-performance, efficient OCP solutions for data centers and beyond, and will keep growing its presence in the OCP community to empower the future with breakthrough innovations.About IngrasysIngrasys Inc., a global leading cloud infrastructure provider, leverages innovative technologies – Hyper-Converged Infrastructure (HCI), Composable Disaggregated Infrastructure (CDI), HPC, AI/Machine Learning, and Advanced Cooling – to provide worldwide customers with tailored solutions that drive their business forward. For more information about Ingrasys, visit Ingrasys website.2022 OCP Global Summit at San Jose from October 18-20Ingrasys OCP architectures open the future
In response to global warming and greenhouse effects, energy conversion has become an extremely important subject matter in the area of global environmental sustainability. The promotion and development of renewable energy has become a focal point of economic, trade and environmental policies in many countries. Among the many present renewable energy sources, solar technology development is relatively mature. According to a marketsandresearch.biz survey, the global MPPT PV Solar Energy Charge Controller market size was estimated to be 173 million USD in 2021, however it is expected to grow to a figure of 246 million USD by 2028, showing a compound annual growth rate (CAGR) of 5.2 %.Holtek Semiconductor is a professional MCU design company. With a focus on ESG environment sustainable development, it has recently launched its "MPPT solar charge controller" application solution. This solution has, at its core, an Arm Cortex-M 32-bit MCU as the main controller, giving it the ability to fully maximise available sunlight to electrical energy conversion efficiency to achieve superior energy storage effects.Present day solar photovoltaic power generation systems include solar panels, controllers, batteries and related loads. In all applications, the controller adopts an extremely critical role in its management of the entire system. One important differentiation between different charge controllers is that of PWM (Pulse Width Modulation) and MPPT (Maximum Power Point Tracking), but it is MPPT that has the higher charging conversion efficiency. MPPT technology has the ability to maximise the solar energy conversion and store the energy in batteries. It is also responsible for controlling start and stop load switching and for implementing protection functions, etc. The selection of an MPPT solar charge controller can be evaluated from three standpoints.AlgorithmsAs solar panels are affected by environmental factors such as the amount of available solar radiation and ambient temperature, the maximum output power will be dependent upon these environmental conditions. Using an MPPT algorithm to track these factors will ensure that related products operate at their maximum power point and achieve optimal energy conversion.Mainstream MPPT algorithms normally utilise an open-circuit voltage method, short-circuit current method, disturbance observation method and conductivity incremental method. After undergoing comprehensive Holtek evaluation, it was decided to utilise a Holtek Arm Cortex-M0+ HT32 MCU at the core of the design for the solar controller using the MPPT disturbance observation method. This method changes the voltage to observe the present real time power, and then compares it with changes in the recent before/after two power values to adjust the voltage magnitude of the next cycle in real time. Repeating this process will ensure that the energy conversion operates at its maximum power point to achieve optimal battery charging.This solution can achieve MPPT efficiencies in excess of 99%, reaching beyond the expectations of present market products.MCU typesHoltek has a comprehensive range of 32-bit MCUs allowing customers to choose the most cost-effective MCU device for their MPPT solar charge controller according to their product type, function and HMI requirements.The MCU includes a wide array of significant integrated peripheral IPs. For PMOS/NMOS driving, there are complementary PWM output functions, which have a programmable dead-time generator providing improved safer operation of the charging/discharging circuit. There are integrated OPAs, which can be used for noise filter circuit design and for current and voltage sampling amplification to improve measurement accuracy. Also integrated are comparator and DAC functions, which are used to implement overcurrent, overvoltage and other protection features.The HT32 MCUs have passed UL/IEC 60730-1 Class B software certification and can therefore provide relevant and complete self-test procedures.Conversion efficiency and management functionsThe MPPT solar charge controller is designed using a HT32 microcontroller which includes Constant Current and Constant Voltage charging as well as tracking transient maximum power charging.The high-frequency DC-DC conversion charging/discharging circuit can effectively reduce energy loss, greatly improve charging efficiency, being able to provide conversion efficiencies as high as 92%.The MCU main controller manages the charging/discharging process intelligently and is therefore able to reduce the risk of battery damage as well as extending battery life.As an overall evaluation, this solution includes the advantages of automatic battery voltage measurement, smart charging, high MPPT tracking efficiency and high charging conversion efficiency as well as having a comprehensive set of protection features. This range of features combine to make it highly suitable for various battery types to meet the needs of a wide range of related products.HOLTEK not only provides MPPT solar charge controller solutions using its 32-bit MCU design that can be quickly introduced into volume production, but additionally its highly experienced design team can modify and optimise the customer's MPPT charging technology applications according to the inherent characteristics of the customer's energy storage battery. If customers decide to also use the Holtek application specific Inverter MCU HT45F5V, this carries the possibility of expanding the application product's function to incorporate multi-functional solar inverter energy storage box features.HOLTEK HT32 MPPT solar energy charger solution
With the COVID-19 pandemic debilitating global production for over two years, the global chip shortage has become an unprecedented crisis, making the semiconductor industry one of the most closely monitored sectors internationally. As a major site for semiconductor manufacture globally, Taiwan has shown outstanding results spanning the areas of IC design, packaging and wafer fabrication. Coming up second globally in IC design output value and first in market share for both wafer fabrication as well as packaging and testing, the country is a formidable force driving advances in the semiconductor industry.Despite limitations in material properties and increasing difficulties in realizing Moore's Law, TSMC, the indisputable leader in wafer fabrication, has been utilizing a wide range of innovative technologies to overcome hurdles in advanced processing with stunning results each and every occasion. At the 2022 North America Technology Symposium that has just taken place, TSMC also announced its latest innovative results in advanced logic technology, special technology and three-dimensional integrated circuit (3D IC) technology, and unveiled its next-gen advanced N2 process technology using nanosheet transistors as well as its exclusive FinFlex methodology supporting N3 and N3E processes.As sectors such as next-gen communication, electric cars and consumer electronics continue to flourish and environmental issues become increasingly of focus across the globe, the need for semiconductors with high frequency, high-speed computing and fast charging with be growing each year. As such, R&D in forward-looking, innovative technologies, new materials and new processes will become indispensable for companies seeking to establish solid positions in the global supply chain.All eyes on the semiconductor forum for roadmaps into the next decadeNumerous global trends forums and topic discussions will be held at 2022 Future Tech with content encompassing three major aspects: semiconductors, net-zero transition and sports technology. Leading figures from industry, government, academia and research institutes home and abroad have been invited to partake in the discussions. With Taiwan's semiconductor industry playing a crucial role in the global market, all eyes are now on the global trends forum to take place on opening day, October 13. Taking the lead in the forum entitled "Ahead of the Trend: The Global Market for Semiconductors in the Next Decade," Michael Campbell, senior vice president of engineering for Qualcomm, will be speaking on "Heterogeneous integration shaping the next pinnacle of semiconductors," while Alon Webman, co-founder & CEO at Chain Reaction, will be speaking on "Engineering Semiconductors for the Future of Privacy," and Jack Kang, senior vice president of business development, customer experience (CX), corporate marketing at SiFive will be delivering a keynote titled "The revolution: RISC-V for CPU applications."Just as governments around the world are taking strong initiatives to foster their own semiconductor industries, Taiwan has also formulated the Angstrom Semiconductor Initiative that aims to bolster the country's key competitiveness in the semiconductor industry for the next decade from the aspects of materials, processes and inspection so Taiwan remains a leading contender in the global market.2022 FUTEX goes live both as exhibitions and onlineFocusing exclusively on technology trends of the next three to 10 years, Future Tech (FUTEX) always attracts a large attendance and is hailed as one of the great tech events that warrant annual visits. This year, the National Science and Technology Council (NSTC) has joined forces with Academia Sinica, the Ministry of Education, and the Ministry of Health and Welfare in organizing 2022 FUTEX, which will be taking place both as physical exhibitions and virtually. Exhibitions will be open from October 13 to 15, 2022 at Taipei World Trade Center Exhibition Hall 1 (TWTC Hall 1), while virtual show dates will be from October 11 to 20.The focal point of this year's FUTEX will be "Global Tech and Industry Ties with Taiwan," highlighting in particular the four major technological fields of AIoT & Smart Applications, Sustainable Energy & Evolutionary Materials, Electronics & Optoelectronics and Precision Health. Key achievements from four major projects will be shown, and two major experience zones showcasing R&D in precision health and sports technology will be open to the public, coming up to a total of over 200 advanced technologies on exhibition. A total of 17 companies including Qualcomm, Merck and CES 2022 Innovation Awards winning teams will be present in the International Area, while top US accelerator Muckerlab will be leading six startups in showcasing their innovative applications and technologies.TIE Award facilitates the semiconductor industry's enlisting of global startupsTo converge and augment Taiwan's international prowess in technological R&D, special strategies have been deployed at this year's FUTEX including "Inbound: Attracting overseas talents to come to Taiwan" and "Outbound: Sending Taiwan's high-quality teams abroad" as well as the lucrative Tech Innovation Excellence Award (TIE Award) and Future Tech Award. In particular, the TIE Award Unveil and match-making session will be held on the forenoon of October 13 (Thursday) where TIE Award winning teams will be presenting their achievements onstage, thus accelerating the convergence of global indicator R&D technologies in Taiwan and creating massive opportunities for industry alliances and commercialization.The TIE Award, hosted for the first time this year, is the perfect opportunity for Taiwan's semiconductor industry to call for technology and application entries from startups, companies and research and academic institutes around the world in fields where semiconductors are researched and applied, including AI and AIoT, sensors, energy-efficiency, communications and satellite, smart manufacturing, self-driving cars, and new energy. This year's event attracted 119 technological entries from 25 countries, while a panel of judges was put together by the organizers with assistance from leading industry units such as the Taiwan Semiconductor Industry Association, SEMI, and Taiwan Semiconductor Research Institute. Scoring based on application innovation, value creation and local connection was carried out by judges representing Taiwan semiconductor leader TSMC, Realtek, members of industry and academia, and international venture capital, and 11 award-winning teams were ultimately selected to showcase their achievements at this year's FUTEX.In terms of the Future Tech Award, apart from calling for entries from local R&D teams with breakthrough and innovative technology, teams with potential for developing internationally will also be selected and given assistance to shine on the global stage. The aim of this award is to drive developments in forward-looking technology for the next three to 10 years and recruit outstanding researchers and developers with disruptive innovation for powering industry-academia collaborations and international business opportunities.For more information on forward-looking innovative technologies driving future tech, please visit the FUTEX official website. If you would like an in-depth introduction to participating teams and companies on any given show date, please make a reservation for Group Guided Tour services, and the organizers will ensure you receive a detailed tour of the technologies on show.2022 FUTEX going live from October 13 to 15 at TWTC Hall 1, virtual shows starting October 11.Photo: TCA
At today's Works With Developer Conference, the theme is all about building devices that work together in the ever-expanding Internet of Things and bridging the gaps of connectivity between different networks, protocols, ecosystems, and platforms. And while some technologies, like Matter, offer the potential to address that challenge within the home, what about connectivity beyond the four walls of a particular building? That's where Amazon Sidewalk comes in.For those unfamiliar, Amazon Sidewalk is a secure, always-on, community network underpinned by millions of Amazon Sidewalk-enabled devices already in homes, commercial buildings, and the infrastructure around us. This will help to provide enhanced connectivity that is more affordable and uses less energy than cellular and offers greater range than Wi-Fi or Bluetooth.From small, in-home services like locating a misplaced garage door opener or extending connectivity to yards and neighborhoods to big applications like early alerting for wildfires or water quality monitoring, Amazon Sidewalk is working behind the scenes to enable helpful, intelligent innovations that were never before possible. That's the promise of Amazon Sidewalk for users, and Silicon Labs is here to help developers design Sidewalk-enabled devices to fulfill that promise.Today's announcement of the Silicon Labs Pro Kit for Amazon Sidewalk, the first end-to-end Amazon Sidewalk development platform on the market, represents an easy on-ramp for developers to build Amazon Sidewalk-enabled devices. For developers and designers, Amazon Sidewalk offers:*A private, secure, and versatile connection that supports long-range use cases*A reliable and persistent network that gets stronger with each new device that joins, helping to expand coverage and enhance connectivity for endpoint devices for developers and end users *A streamlined process to get to market faster thanks to the Silicon Labs and Amazon collaborationThe new Silicon Labs Pro Kit for Amazon Sidewalk makes Silicon Labs the one-stop destination for Amazon Sidewalk developers. The Silicon Labs Pro Kit for Amazon Sidewalk comes with a pre-flashed software image, Amazon Web Services pre-registration, connectivity hardware for Bluetooth LE and sub-GHz, and Silicon Labs Secure Vault™ security. When combined with Silicon Labs Simplicity Studio, developers have everything they need to embark on their Amazon Sidewalk development journey. Silicon Labs provides developers with tools and support from start to finish so there is little need to engage Amazon support, saving developers valuable time in setup and onboarding as they advance.Amazon Sidewalk
Imaging technology advancement has been driving the adoption of cameras on automobiles, and iCatch Technology (iCatch) is at the forefront of imaging-based Advance Driver Assistance Systems (ADAS) solutions.Among all ADAS, electronic mirror is one of the fastest-growing technology that is being widely adopted in both pre-market and aftermarket for both passenger and commercial vehicles. Electronic mirror is replacing traditional rearview and side view mirrors by using cameras and displays in conjunction. The video streams captured by the camera modules installed around the vehicle are fed into multiple displays for the driver to monitor the traffic conditions. The main advantages of electronic mirror over traditional mirror are wider field of view, blind spot reduction, better low light visibility and drag reduction. Electronic mirror is starting to be offered as optional equipment by some car makers on certain car models and is expected to become a standard equipment on newly designed electric vehicles in the near future. Based on this market trend, iCatch has been investing R&D resources in electronic mirror application in the last 5 years and has readied reliable total solutions for customers to ensure driving safety and fast time-to-market.iCatch's AI Imaging SoC has already been adopted by leading dash camera brand names in Japan and Taiwan to offer Dash Cam + Electronic Mirror 2-in-1 combo solutions which entered mass production starting in 2021. These combo solutions not only replace traditional rearview mirror with electronic mirror, but also integrate video recording capability to record videos in front and behind the vehicles simultaneously. This system architecture is expected to further penetrate the dash camera market due to the enhanced visibility and convenience it offers. iCatch has also been cooperating with car makers in China to design multi-camera side view electronic mirror solution for commercial vehicles. The system incorporates two cameras with different field of view for each side to remove blind spot and cover both close and far distance visibility. The product is currently under real-world testing and is expected to enter mass production after the testing is complete.Visibility and Low Latency are two most important factors that need to be considered for electronic mirror application. iCatch AI Imaging SoC has been specially designed to address these two issues to further enhance user experience and driving safety. The proprietary image signal processor (ISP) inside the SoC can support 120dB High Dynamic Range (HDR) and LED Flicker Mitigation (LFM) to overcome the harsh lighting under high contrast environment and minimize the LED Flicker caused by the LED headlight of the vehicle behind. iCatch has also optimized the image processing pipeline inside the SoC to greatly reduce the video latency from camera to display. iCatch's SoC has been enabling electronic mirror systems with video latency of less than 50ms - which is 50% less latency when compared to the general solutions currently on the market. In other words, glass-to glass latency will give us 1.4m safety distance response time in 100km/hr speed. Furthermore, with the built-in deep learning accelerator inside the SoC, iCatch has also been developing in-house AI blind spot detection (BSD) algorithm to detect objects, such as cars, motorcycles, pedestrians, and send out warning to the driver when there is potential hazard. This extra safety feature is expected to be deployed to the market starting in 2023.As vehicle equipment start to migrate from mechanical to electronic solutions, system reliability is being considered as the top priority by the car manufactures. As electronic mirror slowly penetrates from aftermarket to pre-market, SoC reliability is being addressed and emphasized by the automotive industry since any system malfunction will put passengers' safety at risk. Therefore, iCatch Technology will continue to invest in R&D resources to enhance the SoC design in order to provide SoC with better reliability and system redundancy to meet the requirements of ISO26262 international functional safety standard.iCatch Technology driving e-mirror and ADAS advancement.
