With the rise of smart devices, applications for semiconductor components are quickly expanding. The requirements for chip size, information transmission speed, and power in network communications, automotive applications and manufacturing are also becoming more stringent. However, traditional packaging methods cannot keep up with the new market demands. Therefore, wafer level packaging and Fan Out Panel Level Packaging (FOPLP) have gradually become the focus of 5G, AIoT and high performance computing (HPC) companies when purchasing chips. Redistribution layers (RDL) is a core technology during the production of these chips, an it has also become a key area of focus of the industry in recent years. However, FOPLP demands a relatively high level of customization in its equipment. The Vice President of Sales at Manz, Adam Jian, stated that companies who intend to introduce this technology must focus on design and integration verification when selecting an equipment supplier.The Director of Technology at Manz, Dr. Eric Lee, explained the importance of RDL to semiconductors. He pointed out that the size of semiconductors is quickly decreasing. Traditional wire bonding and flip chip packaging can no longer be applied to these smaller chip sizes to improve the efficiency of electronic systems. Therefore, the company developed Fan-In WLP for packaging on wafers, achieving the goals of miniaturized packaging and lowering costs. Although Fan-In WLP possesses the advantages described above, there are still many potential problems during production. The biggest challenge is with soldering. If existing solder balls are used, the dimensions of these solder balls make it impossible to place them on miniaturized chips. On the other hand, the use of smaller solder balls would incur additional costs. In order to solve this problem, semiconductor companies began developing Fan-Out packaging.The technology is split into Fan Out Wafer Level Packaging (FOWLP) and Fan Out Panel Level Packaging (FOPLP). FOPLP has become the focus of the market due to its suitability for mass production and miniaturization and its low cost. Dr. Eric Lee stated that currently chip substrates still use organic materials. Because 10 microns is the limit for wire production and the size stability is relatively poor, producing thin circuits on the substrates is relatively difficult. Panel level RDL uses comparatively less material, therefore the thickness can be greatly reduced to between 2 to 10 microns. Alongside the large surface area glass substrate production technology, the packaging process can provide thin circuits and cover large surface areas. He compared FOWLP and FOPLP, which both use RDL technology for packaging. FOPLP can be used for 500mm x 500mm or 600mm x 600mm surface areas, which are 4 to 6 times larger than the current 300mm x 300mm wafer substrate. Therefore, it can provide cost advantages to companies with high yield rates and good integration capabilities.Regarding integration, Dr. Eric Lee also stated that it is another advantage of FOPLP. Currently, chips that use RDL for integration include power chips, radio frequency chips, base band chips and application processors with high pin counts in mobile phones. Additionally, in order to provide compact sizes and high efficiency, the applications of System in a Package (SIP) are quickly increasing, and the thin circuits and large surface area of FOPLP can satisfy the needs of SIP. He mentioned that the constantly miniaturizing semiconductor production process is nearing its physical limits. Therefore, packaging is now regarded as an area of focus for extending Moore's Law. RDL can help SIP conduct heterogeneous integration. In future 5G and AI integrated application electronics, MCUs, memory, and other digital computing components and sensors can be integrated, thereby reducing the signal transmission distance. Additionally, the thinner packaging can help with heat dissipation, thereby providing better efficiency and performance than existing packaging methods.Although FOPLP has many advantages, it is difficult for semiconductor companies to introduce the technology. The current wafer level packaging used by the companies has different surface areas and materials compared to FOPLP. Therefore, it can easily cause warping in the boards, uneven coatings, and other problems. Furthermore, because the packaging sizes have not been standardized, the production processes of each packaging company are different. Companies must find their own solutions and suitable equipment. Therefore, in the semiconductor RDL production equipment sector, Manz is focused on designed services, which can satisfy the need for customization in the market. However, Adam Jian specifically pointed out that semiconductor companies do not only require a single machine for FOPLP, instead they need a partner who can provide turnkey solutions. He stated that to reach the mass production standards for FOPLP yield, companies need more than RDL packaging equipment. The surrounding machinery must also support the functions. He used the coating process as an example. Uneven coating has always been a big problem for packaging companies. In response to this problem, Manz developed patented technologies for electroplating equipment, which can provide a coating evenness of 95%, greatly improving the yield and efficiency of production.Adam Jian said that Manz has been deploying FOPLP technology for many years and started offering related services in 2015, and has successfully applied this technology in real-world applications. Besides semiconductor companies, other companies have also incorporated the technology in recent years. For example, LED companies plan to use panel level packaging to electroplate circuits onto glass, optimizing the performance of MiniLED displays. Passive component suppliers hope to use the capacity and inductance of the product to expand the application scope. Facing the diverse needs of the market, Adam Jian stated that besides continued investments in technology development, in the future, Manz will actively expand the reach of its partnerships to help companies in different fields construct high performance FOPLP production systems, seizing the numerous opportunities in smart devices.Vice President of Sales at Manz, Adam Jian (left) and Director of Technology at Manz, Dr. Eric Lee (right)

BTU International, a wholly-owned subsidiary of Amtech Group, is a global supplier and technology leader of advanced thermal processing equipment in the electronics and semiconductor manufacturing market. BTU's high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. For semiconductor packaging applications where warpage of very thin substrates is a concern BTU offers the Pyramax TrueFlat configuration.The Pyramax TrueFlat operates without the use of a vacuum pump or specialty tooling and uses convection heat transfer for superior thermal uniformity. BTU's Pyramax TrueFlat is the market leader for the controlled reflow of very thin substrates with extensive install base throughout Taiwan and Asia.BTU and its distributor welcome you at booth I2716 in SEMICON Taiwan 2021 International Semiconductor Show.Pyramax is also offered in a vacuum reflow configuration, the Pyramax Vacuum, where the convection oven is configured with a vacuum chamber in the reflow zone. Vacuum reflow has been proven to be a reliable solution for virtually eliminating solder voids. Solder voids have been identified as a reliability issue for some critical applications.For front-end semiconductor processing the BTU BDF 300 is the market leading solution for 300mm horizontal diffusion furnaces. The BDF is offered in 3 tube configuration and features full cassette to cassette automation and maximum process temperature of 1200 degrees C, making it the tool of choice for power semiconductor applications. The BDF, Bruce Diffusion Furnace, is also offered in 200mm and 150mm/100mm models, the BDF 200 and BDF 41 respectively.BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), and sintering. These continuous furnaces are available with air atmospheres, inert atmospheres, reducing atmospheres and operate at temperatures up to 1180 degrees C. These controlled atmosphere furnaces excel in applications where precise control of temperature (-/-2 degrees across the belt width) is required.BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. In Taiwan BTU maintains direct sales, service and marketing offices. Information about BTU International is available at www.btu.com. BTU also operates fully functional process labs in the US and China.To learn about Pyramax high-performance reflow oven, visit booth I2716 in SEMICON Taiwan 2021.

As enterprises continue to digitize at an even faster pace, global data is also on a slope of substantial growth. According to research from IDC, the total global amount of data will climb to 175ZB by 2025, far exceeding the total of 33ZB in 2018. Given the increasing demand from enterprises for massive data storage, Chenbro Micom launched the RM25324 high-density storage server chassis. In its just 2U height, it supports installation of up to 24 3.5" SATA/SAS interface hard disk drives.Considering the application requirements of various industries, RM25324 can also use in combination with other control modules. It supports the installation of 48 2.5" SATA/SAS hard disk drives or NVME flash memory drives. The backside of the chassis also supports the installation of two 2.5" SATA hard drives as an optional package, and it is optimized for warm and cold data tiering. In other words, the usage model of this product is very flexible and diversified, meaning that it can meet various applications, such as cold and hot data storage, security monitoring, NVR/DVR, data warehousing, database, file servers, among others.To create a more convenient user environment, Chenbro has added many exclusive patented designs to the RM25324 high-density storage server chassis: First, to facilitate maintenance by IT personnel, a large number of its products adopt a tool-less maintenance design, such as tool-less slide rail kits and hard disk drive brackets. Second, the chassis adopts a side load design on both sides. When paired with the original manufacturer exclusive slide rails, only about 50% of the server needs to be pulled out of the chassis to install or replace a hard disk drive. Traditional 2U storage servers, in comparison, mainly adopt a flip-up design and must be completely removed from the chassis to replace or add hard drives. The RM25324 high-density storage server chassis obviously takes the user environment and operation into consideration. Restrictions, obviously very convenient in maintenance.In addition, to ensure the reliability and convenience of the side load design of the chassis, the Chenbro design team endeavored to find the best pull-out angle and worked to improve the heat dissipation performance and durability and longevity of the load. Not only does RM25324 installed six 6-cm high-speed hot-swappable cooling fans in high-density storage server chassis but the suspension design can effectively reduce impact from fan vibration and smoothly introduce cool air from the data center at the front, effectively reducing the temperature of the internal electronic components in the chassis and thereby ensuring that the equipment can maintain stable operation.In terms of other specifications, the RM25324 high-density storage server chassis supports standard ATX motherboards and supports seven low-profile PCI slots, making it convenient for enterprise users to install a network or other expansion cards. As for the power supply, two 800W 80+, Platinum power supplies that support mutual backup use to maintain high energy conversion efficiency while reducing overall energy consumption.With the rapid increase in the data value, enterprises are paying more attention to data storage and analysis by the day. The RM25324 high-density storage server chassis can support a variety of hard disk specifications, making it the first choice on the market for mechanical design and convenient maintenance. Naturally, it is currently the optimal choice for building a large-capacity storage environment.

National Telecom (NT), The WhiteSpace (The WSP), Delta Electronics (Thailand) and Chunghwa Telecom signed a memorandum of understanding (MOU) for collaboration in a 5G private network in December 2021. The joint project will support the "Thailand 4.0" innovative manufacturing plan and assist Thailand in accelerating the use of 5G Innovative applications to introduce technologies such as the Internet of Things (IoT), information security, artificial intelligence (AI) and big data. In addition, the project will help realize innovative application services, such as Thailand's smart manufacturing, remote collaboration, and smart medical care.NT is a state-owned enterprise 100% owned by the Ministry of Finance of Thailand. It has obtained 2100 MHz, 2300 MHz, 26 GHz and other frequency band licenses in Thailand's 5G release. The WhiteSpace (The WSP) is the largest MVNO (Mobile Virtual Network Operator) service provider in the Thai market, dedicated to 5G new application services and innovative development of the Internet of Things.This four-party multinational cooperation promotes 5G enterprise private networks and innovative application services in the Thai market. It focuses on solving the pain points of digital transformation for enterprises in the post-epidemic era and leverages Chunghwa Telecom's abundant technical energy, service best practices, and solution ecosystem partners to support Thailand. Moreover, it will assist the Thai government in creating a 5G innovative application service ecosystem to make Thailand a leader in "industrial transformation" and "technological innovation" among the five North ASEAN countries (Thailand, Cambodia, Myanmar, Laos, and Vietnam).Firstly, this cooperation between Chunghwa Telecom, NT and The WSP is to introduce a 5G private network to actualize AR remote collaboration for application in assembly training, operation assistance, and visual equipment control at the main office and first plant of Delta Electronics (Thailand) in Bangpoo Industrial Estate, Thailand. This will complete digital transformation for the post-epidemic era. In the future, this joint plan will extend to the local government, manufacturing, tourism, medical or financial industries in Thailand. Chunghwa Telecom will provide their own MEC Intelligent A+, as well as design and planning experience. NT will provide the local 5G core network. Lastly, The WSP will provide local marketing and operation experience, and work together to create innovative application services for Delta's smart factories.Delta Electronics (Thailand) Factory No. 1 in ThailandChunghwa Telecom is cultivating regional partnerships as part of the government's Southbound policy for a long time. It has joined forces with telecommunications companies such as Thailand's National Telecom, Vietnam's Viettel Group, Singapore's Singtel, as well as other cross-border telecom companies. It is also calling for more high-quality partners from Taiwan to join the new Southbound national team.Nattawut Satrawaha, Senior Executive Vice President – Wireless Communication 2 of NT, stated: "5G innovative application services will play a key role in technology and serve as an enabler in the post-epidemic era. Thailand, as the center of the five North ASEAN countries (Thailand, Cambodia, Myanmar, Laos and Vietnam), occupies a very important position in terms of geography, transportation, and economic and trade relations. Through this cooperation, we can help Thailand to become a regional center for talents, logistics, and cash flow. In the future, we can also work together to serve corporate customers in the ASEAN market."Chaiyod Chirabowornkul, the Chairman of The WhiteSpace (The WSP) pointed out: "The WhiteSpace delighted to be part of this big step in developing 5G private network initiative in Thailand. 5G private network can demonstrate the strength of 5G and lay down groundwork for 5G ecosystem. We foresee 5G private network as a future of MVNO in Thailand.We would like to thank NT for the opportunity and trust in our partnership to start with the POC. We would like to thank CHT International in their willingness to bring their 5G solution to Thailand and trust us as a local partner. We believe with this partnership we can bring 5G private network to be very attractive and effective solution for large enterprise in Thailand. "Curtis Ku, Senior Director, Thailand Country of Delta Electronics Thailand, said: "Delta Thailand is delighted to pioneer 5G for smart factory applications in Thailand with Chunghwa Telecom. As a top electronics company and innovative solutions provider in Thailand, 5G connectivity offers us many opportunities in Internet of Things (IoT), information security, artificial intelligence (AI), and big data, which will accelerate our smart manufacturing transformation. This groundbreaking project at Delta's main plant is an excellent learning model for local manufacturers, which supports the Thailand 4.0 development policy, and a firm platform to build further Taiwan-Thailand business collaboration for mutual benefit."Sarah Wu, President of Chunghwa Telecom International Business Group, remarked: "Chunghwa Telecom has been cultivating the new southward development plan for a long time, our mission has been to actively form alliances with high-quality international partners to develop various innovative application services, and to call on more Taiwanese manufacturers to join the new southward national team. We are convinced that through this cooperation, Taiwan will reach a new milestone in the expansion of the ASEAN market, and usher in a new digital transformation service energy for Thailand and the ASEAN market."CHT(Thai) GM Arthur Yang, Delta(Thai) Senior Director Kurtis Ku, CHT-I President Sarah Wu,NT SEVP Nattawut Satrawaha, WSP CEO Pakorn Pannachet and Chairman Chaiyod Chirabowornkul (left to right)

The global server market will be in short supply in 2021. From the perspective of the larger trend, the growth of cloud services dominates the development of the server industry, especially in this post-pandemic era. It continues to drive home office, remote teaching, online shopping, and audio-visual applications, leading to higher demand for data centers and cloud services. Another major trend is 5G applications. With its characteristics of high-bandwidth communications, wide-area connectivity, and low latency, 5G applications are regarded as a boost to the development of smart cities and the IoT, and it also drives strong growth in servers.Chenbro OTS products with high compatibility and high differentiationAs cloud and 5G drive rapid increases in demand for global data centers and servers, global server chassis leader Chenbro Micom is actively developing business opportunities in the server chassis market by developing innovative and forward-looking products. In fact, server chassis have certain thresholds and difficulties: they must carry different components, such as motherboards, cooling systems, power supplies, and be installed in bodies of different sizes, which is an extremely large demand for system stability.Chenbro said that the compatibility of the internal mechanism and electromechanical integration of the chassis, along with detailed craftsmanship and quality of production, are of great benefit to the stability of the server system. Therefore, its server chassis products have the dual characteristics of "high compatibility" and "high differentiation". Compatibility of the server chassis and the motherboard usually requires much verification, and verification itself often requires huge amounts of time and efforts. Therefore, when pairing Chenbro server chassis with motherboards of different manufacturers, various motherboards are pre-tested for items such as mechanical compatibility, system function testing, and heat resistance. This means that customers will have more flexibility in their selection of servers for deployment.Chenbro further pointed out that, in its design, development, and production of a series of OTS standard products, it has found inspiration in the toy "Lego". Using a modular design, Chenbro develops mechanical products that function somewhat like Lego blocks, allowing customers to choose products according to their application needs and import them quickly to meet the demands of the high-diversity, low-volume server industry market. As a result, Chenbro possesses products that fully demonstrate flexibility, agility, diversity, and high compatibility. This has allowed it to achieve the goal of "Compatible yet Differentiated, Made Easy", and provide customers with high-quality products and services.Value-added edge computing products for concept engineering applicationsIDC predicts that the edge computing server market will be driven by the diverse business needs of users in the telecommunications, energy, manufacturing, and transportation industries, to become one of the fastest-growing sub-markets of the server market. As there are more diverse scenarios in the applications of edge computing at the data-generation end, the demand for edge customized servers that have specific external sizes, low-energy-consumption capabilities, broad working temperature, and other specified designs, will see accelerating growth, so as to adapt to complex and diverse deployment environments and business needs.Chenbro stated that using "concept engineering" for product design and innovating products from the perspective of customers and end users helps them maximize the performance of various components in the server chassis. Chenbro gave further explanation using the recently launched RM252 and RM352 series products as examples. These edge computing server chassis products developed by "concept engineering" have their design based on O-RAN architecture, use a 450mm ultra-short depth chassis, provide FIO (front-end I/O) and RIO (rear-end I/O) connection mechanisms, adopt a flexible fan configuration, and have built-in dual redundant power supplies with hot-swappable functionality; such design and functionality makes them suited for fields with constraints in deployment space, such as telecommunications racks or small-scale data centers.A wellspring of product innovationAs 5G, AIoT, and edge computing have transformed the industry once again, innovative research and development of server products has received increasing attention. What can easily be underestimated as a server's "coat" holds within it Chenbro's 38 years of intensive R&D and innovation. Chenbro said that as it moves into the future, it will continue to promote the coexistence of "high compatibility" and "high differentiation" in OTS product innovation. It will absorb the lessons of its "concept engineering" product development experience, and continue to enhance its electromechanical integration capabilities, and thereby develop diversified products to meet customer needs.To maximize the compatibility of its chassis, Chenbro has upheld the slogan "Whatever's inside, Chenbro outside". Regardless of how the needs of industry can change and influence server configuration, Chenbro is the best choice of server chassis. Chenbro will continue to provide diverse server chassis products according to user needs that also consider actual use and operation scenarios.

Dow (NYSE: Dow) will preview its latest silicone technologies for advanced semiconductor packaging at SEMICON Taiwan 2021 in Booth #I2616. These next-generation silicone-organic hybrid adhesives, silicone hotmelt solutions and silicone die-attach films (DAF) deliver improved performance, durability, uniformity and processability vs. traditional organics. Dow's high-performance technologies are engineered to address top trends in advanced semiconductor packaging, including ever-thinner, smaller and more-complex designs, by mitigating stress from mismatched coefficients of thermal expansion (CTEs) that can cause warpage. They also provide greater durability and reliability for applications exposed to harsh environmental conditions in industries such as aerospace and automotive electronics.In addition to displaying posters, example applications and demos at its booth, Dow will participate in the TechXPOT conference at the show. Roderick Chen, technical service and development specialist for Dow, will present on "Novel Silicone Hotmelt Solutions for Microelectronics" at 1:40 p.m. China Standard Time (CST) on Tuesday, December 28."While advanced packaging designs are essential to meet increasing demand for higher performance and expanded functionality in electronics, they can also place greater thermal, electrical and mechanical stresses on the chip," said Jayden Cho, Dow's global segment leader for Displays & Microelectronics. "To address this situation and help customers improve quality, consistency and processability, Dow has developed an array of novel silicone technologies specifically designed for side-by-side and stacked chip configurations and MEMS devices. Our breakthrough silicone products surpass organics by optimizing thermal stability, stress relaxation and durability in many different types of packaging."Differentiated Silicone TechnologiesDow's new silicone technologies provide fresh solutions to enable complex packaging designs, such as multi-stacked packages and coreless substrates. They also have important advantages over organics and can help customers resolve issues such as warpage, delamination, bleed-out and premature failure that can occur with epoxies and other incumbent materials.The new DAF solutions, which are cured silicone films, offer excellent uniformity for precise thickness and eliminate fillets and bleed-out that commonly occur with epoxy adhesives. Low modulus ensures good sensing accuracy, especially for environmental sensors.Dow's hybrid solutions combine silicone and organics in a unique formulation. These adhesives deliver enhanced mechanical properties that silicone alone can't achieve, such as higher modulus and strong adhesion to various surfaces. Potential applications include flip chip packaging, which can experience delamination after harsh reliability testing when epoxy mold underfill is used. The hybrid solutions also feature excellent optical properties, enabling them to be used in optical devices.The company's silicone hotmelt technologies, offered in three formats (film, cartridge and tablet), provide excellent adhesion to a variety of substrates, as well as stress relief for warpage mitigation.*The hotmelt film can be vacuum laminated for chip encapsulation or bonding over a large area, which is a simpler process than molding. It is especially valuable for substrates that warp easily, such as flexible, coreless packaging.*The silicone hotmelt cartridge solution for compression molding provides better workability and thermal stability compared to commercial liquid silicone hotmelts for chip encapsulation and soft molding.*The hotmelt tablet technology is designed for transfer molding, where it provides properties similar to those of conventional epoxy molding compound (EMC), plus exceptional thermal stability to at least 250oCDow invites attendees at SEMICON Taiwan to stop by its booth (#I2616) for additional information on these novel silicone technologies.To learn more, visit Dow at www.dow.com.

Fusion Worldwide, the premier global open-market sourcing distributor of electronic components and finished products, is celebrating its 20th anniversary.Since its founding in 2001, Fusion Worldwide has grown from four people in an office in Andover, Mass., to over 380 people covering 20 locations across the globe. In addition, it has amassed yearly revenues of over US$1 billion and ships on average 5 billion units."Our journey from where we were 20 years ago to where we are today is the result of the dedication our employees have to both the organization and its customers. We've been able to capitalize on the growth of the open market and its essential role in the supply chain by creating long-standing relationships with some of the world's largest OEMs and CMs," said Peter LeSaffre, Founder and CEO of Fusion Worldwide.With a mission to solve supply chain shocks, Fusion Worldwide has implemented an aggressive growth strategy to support customers where they are. In addition, it has developed an unparalleled supplier network and sourcing strategy that focuses on closely monitoring the market to help to mitigate the effects of supply chain disturbances for its customers."The success we've had over time comes from within. We've worked hard to accomplish our vision by going global and bringing our company to where our customers are so we can provide local service. It's been an exciting journey, and we're looking forward to the next 20 years," continues LeSaffre.Throughout its history, Fusion Worldwide has been continuously recognized as one of the world's top distributors by SourceToday, Electronics Sourcing and ESM China.Fusion Worldwide celebrates 20 years in the electronics sourcing industry.

At dusk on November 9, 1965, all of New York state, parts of seven adjoining states, and the Canadian province of Ontario were plunged into darkness. A heavily loaded protection relay in southern Ontario had tripped out, causing a trip-out cascade when the load was transferred and overloaded other power lines. The blackout was one of the biggest power failures in history and at the height of rush hour, leaving 800,000 people trapped in New York's subway system, delaying millions of commuters and stranding thousands more in office buildings, elevators, and trains.Fortunately, blackouts of this magnitude are rare but blackouts can hit almost any grid and it is an uncomfortable truth that many power networks worldwide are showing signs of strain. The overcapacity needed to ensure security of supply (and keep the lights on) is simply too small, leaving potential blackouts or brownouts on the horizon.These are nightmare scenarios for anyone tasked with keeping critical systems like medical equipment, industrial automation systems, security monitoring systems or transportation running. Infrastructure managers know that a quality UPS buys them something priceless: time. Time to spool up backup generators or to gracefully power-down the system and avoid equipment damage.Asian Power Devices (APD) have a long record at the forefront of professional lithium ion UPS design, where more than 10% of the company's turnover is funnelled to R&D every year:"The professional teams of APD's Uninterruptible Power System Business department have over 20 years of R&D strength, becoming long-term strategic partners with many world-renowned European, American and Japanese companies. We use our strengths in innovative R&D technology to provide customized UPS designs and manufacturing services for our customers," said Peter Hu, General Manager of APD's Uninterruptible Power System Business department.The latest APD lithium-ion UPSs boast a 10-year usage life - over twice that of lead-acid UPS products - and a 53% reduction in size compared to similar products in the industry, which provides reliable protection where it's needed.All APD's lithium-ion UPS product series have UL 1973 and IEC 62133 safety certifications and excellent thermal characteristics, guaranteeing safe operation wherever they are used. This is backed up by a smart battery management system (BMS), with sophisticated dual protection functions and accurate State of Health (SOH) and State of Charge (SOC) estimation algorithms that monitor the operating status of the battery in real-time, improving both system reliability and performance whilst extending battery life.In a hospital environment, infrastructure managers can rest easier knowing that APD's small and light UL 60601-1 certified lithium-ion UPSs are proven to effectively reduce leakage current and electromagnetic interference. This ensures effective protection for their medical equipment, even on small medical diagnosis and treatment trolleys.APD's rich experience has led it to become a long-term partner of many first-tier global industrial control and medical equipment companies throughout Europe, the United States and Japan, using its outstanding customized R&D capabilities. APD has the industry's highest-level safety laboratory where the scope of testing includes helping customers get the swiftest product certifications in the industry, significantly reducing their time to market and winning them 'best quality support' awards and quality excellence awards for many years running.APD's Lithium battery UPS bring customers a fresh experience of small size, long product life and safety. Find yours at https://www.apd.com.tw/en/our-products/apd-lithium-ion-ups/Over the years, APD has become a long-term partner of many first-tier global industrial control and medical equipment companies using its outstanding customized R&D capabilities.All of APD's lithium-ion UPS product series have UL 1973 and IEC 62133 safety certifications and excellent thermal characteristics, guaranteeing safe operation wherever they are used.

Moore's Law, which predicts the growth of chip computing power, is still valid but has been slowing down. The micronization of the semiconductor process could no longer hold on to the former pace of doubling chip performance every 18 months. Currently, investing in advanced semiconductor processes has become an expensive game that only a few profitable international enterprises could play. As one set of 7nm reticles costs nine million USD, only these companies can bear this astonishing financial burden. Furthermore, the development of the 3nm process is already in full swing in the industry. The escalating difficulty caused global signs of stagnating in the chip developments, resulting in overwhelming pressure on the semiconductor supply chain.The accelerating expansion of wafer factories has thus become the new norm in 2021. The capital expenditure of TSMC in 2021 set an unprecedented increase. The US and Japanese governments have been eagerly inviting leading manufacturers to establish factories to facilitate the shift and growth of the global wafer manufacturing supply chain. As a result, an increasing number of semiconductor companies pursue greater production capacity. The upstream IC design and electronic design automation (EDA) tool leaders also keep up with this trend, integrating Artificial Intelligence (AI) to advance rapidly towards more prospective software technology development.SysMoore to initiate a semiconductor evoluti on beyond Moore's Law with software innovationSassine Ghazi, president and COO of Synopsys, during an interview elaborated on Synopsys' development strategy of "SysMoore." It is an innovation that utilizes EDA software technology to accelerate the System on Chip (SOC) design process and achieve critical applications that surpass Moore's Law to drive semiconductor evolution. Regarding the recent global shrinkage of semiconductor production capacity and supply, he saw that not only TSMC but the entire semiconductor industry all significantly increased their production capacity investments in response to this expansion in demand. The main reason for this was the diversified development of intelligent devices that began one and a half years or even three or four years ago.The technology of Smart Everything in the electronic world has boosted the development of emerging industries. The trending IoT devices driven by smart cities, the foundation for commercialization of 5G technology established by global telecom operators, and more novel technologies powered by AI all contributed to the lightning speed of intelligent device development. The resulting expansion in semiconductor demand intensified the impact on the supply chain. Nowadays, major great powers believe the ability to manufacture semiconductor chips independently affects the future of the automotive industry and high-tech industries such as medical and biotech. It became a crucial strategic consideration in relevance to national security. Therefore, this opportunity to expand the semiconductor industry will become a long-term and raging development trend for years.The SysMoore Era ushers in a fundamental disruption in the dynamics of the market.EDA bridges the semiconductor manufacturing process and chip designGhazi was a IC design engineer before becoming senior business manager and COO. He experienced firsthand the anxiety of facing constantly developing new technologies and high-complexity electronic products through IC design process. Due to the escalating complexity of chips, to ensure both precision and high-level integration, introducing advanced EDA solutions for design has become the industry common practices. Today, the core chip of systems can easily contain IC circuits with more than millions of transistors. The system simulation and verification processes alone put development teams under enormous pressure, not to mention the subsequent sophisticated integration of key components. In short, the level of challenge for process development now is at all-time highs.Synopsys' EDA solutions focus on design automation to improve circuit design efficiency while providing better reliability for highly complex designs to save valuable engineering labor costs. Whether it's the early functional structure partitioning at the top level of systems, level-by-level system simulation and verification, or physical IC architecting with optimizing tools, the costs can be lowered at the early resource-intensive development stage and boost the efficiency of developing large chips or highly complex system architecture semiconductor products.Ghazi believes that EDA is the best bridge between the semiconductor manufacturing process and chip design and that EDA can contribute significantly to enhancing semiconductor performance. Five to six years ago, Moore's Law became inaccurate for estimating the density of semiconductor processes. The benefits from chip computing performance growth driven by transistors density improvement are reducing, but there was no sign of decline for the massive demand for chips. This resulted in an exponentially increasing cost for developing single IC chips. Therefore, the IC design industry is seeking a creative solution. The development of SoC brings an opportunity to integrate system function requirements of specific fields into a single SoC to meet market demands. The robust growth of SoC becomes the main background of Synopsys' development of SysMoore.Ghazi explained that Synopsys was privileged to have established R&D teams in Taiwan at a rather early stage so that its application engineers could continuously make close interactions with Taiwanese semiconductor clients and provide services. Such an advantage enables Synopsys to understand the trend of industry changes quickly. By active interaction on the front line, from the development of the foundry to the response strategy of the IC design industry, Synopsys effectively grasps the evolution of the semiconductor process and aims to bring solutions to the development challenges of processors and SoCs. Under the SysMoore strategy, a series of AI software tools are developed so that EDA can bring revolutionary changes to the new-generation electronic systems. The strategic focus is not only on advanced chip design, verification services, and IP integration tools but also information security, life cycle management, quality testing, and continuous system maintenance and optimization functions - all integrated into the SysMoore strategy. In simple terms, "SysMoore is Moore's Law of software."DSO.ai is the world's first AI decision-making tool for chip design targeting PPA optimizationAI technology is one of the most critical enablers of this revolution. As early as in 2017, Synopsys' engineering team of architects and scientists used AI technology to promote an insightful concept, "use AI to design IC chips". This may sound sci-fi then, but around the end of 2018, a prototype was developed. In comparison with its counterpart designed by human engineers, the prototype showed many superior benefits in terms of multiple functional goals. Therefore, Synopsys transformed the entire AI module into a system and implemented it to client's designs for more in-depth testing and verification. This led to the birth of DSO.ai (Design Space Optimization AI), the first AI-enabled design automation solution.Ghazi stated that DSO.ai is the world's first AI decision-making tool for chip design. Leading industry players have begun to utilize DSO.ai to assist in chip design and manufacturing. DSO.ai is the first Synopsys solution to adopt Reinforcement Learning to comb through data from IP, IC design tools, and databases and provide the best possible option for PPA (Power-Performance- Area) decision-making. By thoroughly exploring the big data of the chip design workflow while automatically conducting subsequent simulations, DSO.ai massively improves the efficiency of chip design teams, accelerating the design process and delivering better chip results.The secret of the brilliance of DSO.ai, as Ghazi revealed, is that DSO.ai provides internal algorithms for EDA tools to enhance decision-making efficiency. On the contrary, AI tools developed by regular IC design clients can only find solutions to improve efficiency from external input and output data of EDA tools. This difference between internal and external is the reason why DSO.ai can be faster and more effective.In traditional IC design, the simulation of pre-architecture and process node selection takes about nine months. The complexity varies from chip to chip, and the situation or timing of DSO.ai usage may differ. It is estimated that DSO.ai saves 35% time on average for public reference. DSO.ai reduces trivial tasks for designers by adjusting tool configuration so that design teams can almost operate like pros and effectively control the Time-To-Market for product launch timing. In addition, there're also areas in the fields of pre-architecture development, chip design implementation, and verification where DSO.ai can get involved to solve other crucial design problems with the same algorithm.Helping clients succeed helps Synopsys achieve greatnessBorn and raised in Lebanon, Ghazi had an exciting journey from an IC design engineer to the president of Synopsys. Ghazi's father inspired him as an engineer at an early age, and he dreamt of being one when he grew up. When Ghazi went to the United States for advanced studies, he first majored in business and then went straight to a master's degree in electronic engineering and control systems. As he was trying to pursue a doctoral degree, he found a job opportunity at Intel. So he left his academic career and began his professional career in IC design. He joined Synopsys in 1998 to start a new chapter.Ghazi went through multiple job rotations with Synopsys, from engineering to business. He found that business is not only to pursue growth, but more importantly, to develop partnerships with customers."Only by helping customers succeed can Synopsys continue to achieve greatness" - This is one of the core values that pushes the entire company forward. Therefore, when he became the general manager of the business group, he realized that the essential leadership skill is to put this value into practice.Synopsys'core values include integrity, helping customers succeed, unceasing innovation, and forging the greatest consensus to achieve goals. Ghazi advises young Taiwanese engineers need to understand the core value of a company they joined. Only by truly understanding the company's core value and putting efforts into realizing it can these young engineers go further along with this journey.Push the limits of silicon performance with AI-driven design solutions.

Chenbro (TWSE: 8210), a pioneer in the design and manufacturing of own-brand rackmount system, is excited to announce the latest compact 2U JBOD, the DS25224, which supports 24 x 2.5" tool-less SAS or SATA drives, with the 12Gbps redundant expanders. It offers optimal reliability for high-density storage in big data era.Big data and data analytics are driving a continuous demand for storage capacity and the JBOD (just a bunch of disks) array is proving to be a compelling solution for it. Chenbro offers DS25224 to support 24 x 2.5" SATA/SAS drive bays as a primary storage solution. The JBOD is specifically designed to meet the needs of 2.5" HDD/SSD testing environments, which include 3 x 2.5" 8-port 12Gbps SAS/SATA dual path passive BP, a super cool HDD working temperature (<50°C/122°F at 30°C/86°F) and 3 x 80mm hot-swap cooling fans. DS25224 is specifically designed to provide data resilience and accessibility for your computing and storage applications.Equipped with redundant CRPS 1+1, 550W digital power supplies, the DS25224 is designed to guarantee great conversion efficiency regardless of load. This enables a total system power efficiency savings and contributes to greater energy efficiency for performance challenges in demanding environments.Featuring a short-depth design, the DS25224 JBOD is suitable for universal deployment. The 450mm ultra-short chassis is ideal for various environments and perfect for footprint minimization. The JBOD is appearing to enterprises with the demands of big data as it teams up an innovative design with a truly remarkable storage density while it targets software-defined storage, big data, virtualization, and media & content storage.DS25224 is now ready for global sale. For business inquiries, please contact Chenbro regional sales or channel partner. For more information, please visit http://www.chenbro.comAbout ChenbroFounded in 1983, Chenbro (TWSE: 8210) has been the trailblazer in designing and manufacturing of own-brand rackmount system, tower server, and PC chassis for over 38 years. Chenbro is not only qualified by the first-tier server brands and provides OEM, ODM, and JDM services with EMS companies, but also successfully extends its business footprint to datacenters and industrial solutions by continuously investing in technologies and delivers the most trusted server and PC chassis with the highest standard of innovation.Chenbro offers DS25224 to support 24 x 2.5" SATA/SAS drive bays as a primary storage solution