As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security. The rapid expansion of high-bandwidth memory (HBM) production continues to consume advanced fabrication capacity, constraining the supply of conventional memory products and creating persistent shortages across the market. This concentration of high-end production has widened the supply-demand gap, driving the average selling prices of certain premium memory products to levels eight to ten times higher than previous norms

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers

Technology news, product launches and show highlights from the event attendees available for download (PDF).

As the global technology industry descends on Taipei for COMPUTEX 2026 this June, a Canadian startup is preparing to challenge the fundamental architecture of modern processing. Irreversible, a Montreal-based firm with deep roots in quantum computing, is unveiling a "physics-first" analog in-memory computing architecture that promises a staggering 1,000x reduction in power consumption compared to conventional digital processors.Unlike many silicon startups that originate in traditional chip design, Irreversible’s journey began in the highly constrained world of quantum physics. The core team originally specialized in quantum computing, where they were forced to solve computing problems within the extreme limitations of a dilution refrigerator - an environment where even the slightest heat or noise can destroy a fragile quantum state. Co-Founder Dominic Marchand explains that this background led them to become a "computing company that found its way to designing chips," rather than the reverse. This unique DNA pushed the team to strip away decades of architectural abstractions and return to the most basic laws of physics to find the most energy-efficient ways to process information.The current industry obsession with massive Large Language Models (LLMs) has created a significant energy crisis, particularly at the "extreme edge" where devices must operate on microwatt-class power. Irreversible addresses this by sidestepping the Von Neumann bottleneck, the energy-intensive movement of data back and forth between memory and the processor. By performing calculations directly in memory and maintaining a fully analog signal path, Irreversible also eliminates the power-hungry digital-to-analog conversions that often limit hybrid AI chips. This approach recognizes that while digital logic offers noise protection, the energy required to strictly maintain ones and zeros is a luxury that edge sensors can no longer afford.A critical point of differentiation is how Irreversible compares to other innovators in this space. Marchand notes that while he is proud of the Canadian leadership in analog in-memory compute, Irreversible maintains several distinct advantages. First, the company is memory-agnostic, meaning they are not tied to a single proprietary memory technology and can instead utilize various non-volatile memories and emerging RRAM roadmaps. Second, the company places extraordinary emphasis on its software and simulation tools, which allow their hardware and software teams to work in lockstep. Their proprietary hardware-aware training ensures that neural networks remain accurate by accounting for the inherent variability of analog circuits during the initial training phase.For their up-coming visit to Taipei, Irreversible has set clear strategic objectives to integrate with the world's leading semiconductor ecosystem. A primary goal is establishing high-level connections with semiconductor foundries to gain privileged access to specific memory cells, which are essential for their "physics-first" custom designs. Additionally, the company is actively seeking partnerships with OEMs and solution integrators. By bringing intelligence directly to the sensor site, Irreversible aims to enable "previously impossible" use cases, such as deploying sophisticated AI on small drones or always-on wearable devices that cannot support a traditional GPU. Ultimately, Irreversible arrives in Taipei not just to showcase a chip, but to advocate for a shift in how the world thinks about intelligence. By trading the rigid certainty of digital bits for the natural efficiency of physics, they are proving that the future of AI isn't just about more power - it's about more efficient computing.

Test Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series. This highly modular platform is a dedicated solution for Back End Process and Advanced Packaging Inspection, ranging from patterning to wafer saw, and is engineered to set new benchmarks in wafer inspection and micro-measurement metrology.The AI-powered Wafer Metrology and Inspection Platform, TR7950Q SII, is built on a high-stability granite platform and the system supports 6" to 12" wafers. The platform features robust Automated Visual Inspection (AVI) for high-speed detection of surface defects, including particles, scratches, chipping, contamination, and foreign materials.The optional Short-Wave Infrared (SWIR) module allows the system to penetrate silicon to detect hidden inner cracks and subsurface defects invisible to standard sensors. For high-detail requirements, the platform offers 0.5 µm or 1 µm high-resolution imaging via the 3D DFF (Depth from Focus) module.The TR7950Q SII provides high-precision metrology for wafer thickness, top-side warpage, and complex surface topography, alongside high-speed sensing for Through-Silicon Via (TSV) depth, trench dimensions, thin film, and Chiplet metrology. Please visit the link to learn more about the TR7950Q SII.Credit: TRI

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider for data centers. This collaboration integrates GUC's flagship SoC design and 2.5D/3D advanced packaging with Wiwynn's expertise in rack-scale system integration, liquid cooling and optical interconnect. Together, the collaboration enables hyperscale customers to transition more efficiently from silicon definition to deployment-ready AI infrastructure.AI clusters continue to scale in performance, bandwidth and power density, hyperscalers must increasingly evaluate silicon, packaging, interconnect, thermal and rack-level design choices much earlier in the development cycle. Through this collaboration, GUC and Wiwynn are aligning key technology pillars, including leading-edge ASIC implementation, 2.5D/3D advanced packaging, optical I/O, power delivery, thermal architecture, manufacturability, serviceability and rack-scale integration. By addressing these factors holistically at the outset, the collaboration partners aim to reduce integration complexity, improve development efficiency and accelerate the transition from silicon-ready innovation to system-ready AI infrastructure."As AI infrastructure evolves beyond chip-level optimization and scale-up networks push the limits of conventional electrical interconnects, close alignment across silicon to system architecture become critical," said Aditya Raina, Chief of Marketing of GUC. "By collaborating with Wiwynn, we are helping hyperscale customers evaluate critical system-level tradeoffs earlier, integrating optical I/O to deliver the bandwidth and power efficiency required for next generation AI systems. This partnership establishes a more practical, holistic path from flagship ASIC development to deployable, rack-scale AI infrastructure."With deep expertise across board-level innovation, rack-scale integration, and manufacturing, Wiwynn effectively bridges semiconductor innovation with data center deployment," said Tony Wen, Vice President at Wiwynn. "Together with GUC, we are enabling a comprehensive silicon-tosystem approach that delivers scalable, efficient and serviceable AI infrastructure tailored for nextgeneration hyperscale environments."For more information, please visit.