Taiwan-based networking device assemblers continue to relocate their production lines from China back to Taiwan or to Southeast Asia, despite a recent surge in COVID-19 infections locally.

In the era of smart devices, the capabilities of traditional networking equipment are no longer sufficient as more diverse IT system functions become available. Therefore, virtualization has become a focal point when designing corporate IT systems. Apart from large-scale independent software vendors (ISV) and cloud service providers relying on virtualization, small-scale operators have also begun investing in this technology, generating demand for the market as a whole. AEWIN has navigated the networking field for many years, accumulating abundant technological expertise and experience. Recently, AEWIN has built the SCB-1937, a high-performance networking computing platform that supports the latest EPYC 7003 Milan CPU launched by the large processor manufacturer AMD. This platform can help enterprises swiftly introduce network function virtualization.

Pure-play foundry houses are requiring fabless chip vendors to prepay for the capacity bookings or to co-fund their capacity expansion projects. One of such cases is Qualcomm striking a six-year deal UMC in order to secure foundry support. Supply in the semiconductor sector is expected to remain tight in the foreseeable future, with IC substrate supply unlikely to see major improvements until late 2021 or 2022.

ADLINK Technology Inc, a global leader in edge computing, introduces two new modules in the 6-CH EU Series digital I/O – the ECAT-4XMO motion control and trigger module, and the ECAT-TRG4 trigger modules. The new modules are a dynamic extension to ADLINK's EtherCAT System and are designed to perfectly complement the EU Series, enabling higher performance in automatic assembly, test, and inspection equipment across a multitude of applications including cell phone glass inspection, battery cell assembly, camera lens assembly and test and glue dispensing machinery, as well as inspection equipment.

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the electrical characteristics of each die on the wafer, so that dies with faulty electrical performance can be vetted before packaging, effectively reducing unnecessary manufacturing costs from faulty products.

Consumer demand for higher audiovisual quality is driving the evolution of technologies behind LCD displays. Specifically, mini-LEDs, with their superior contrast and color gradation performance, have emerged in the field of display backlights. With a strong R&D foundation in the field of mini-LED technology, Macroblock recently launched a series of mini-LED backlight driver ICs that correspond to various LCD display sizes. According to Chris Chen, Macroblock backlight product manager, the company can help clients create the most suitable products tailored to the needs of different groups in the market.