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Tuesday 21 July 2026
Electronics Supply Chain Outlook: Where H2 2026 Momentum Is Heading
Six months into 2026, the story isn't whether the electronics supply chain has stabilized. It has, broadly. The real story is that it has split into two distinct markets moving in opposite directions, and most procurement teams are still planning as if there's just one. The AI-driven leading edge remains capacity-constrained and pricing-positive, while the mature-node segment is loosening into a genuine buyer's market. Knowing which side of that line each line item on your BOM sits on is the single most useful thing you can do heading into the second half of the year.The Two-Speed Market, BrieflyTSMC is reportedly preparing to raise prices 3–10% on its sub-5nm offerings, and with Nvidia and Apple having already locked in large blocks of capacity through year-end, second-tier buyers are increasingly competing for allocation that may not exist in H2. Memory tells a similar story. Combined output from Samsung, SK Hynix, and Micron is expected to grow sharply by 2030, led by a projected rise in HBM production, but that new capacity doesn't meaningfully arrive until 2027. In the meantime, DRAM and HBM remain the tightest categories in the entire component ecosystem.Mature-node wafer pricing has actually returned to pre-pandemic levels, down 5–8% year-over-year, as Chinese fab capacity comes online and automotive/industrial utilization climbs into the 80–85% range. Consumer electronics demand is stabilizing too, which is easing pressure on mature-node semiconductors and passives.What This Actually Means for Your Procurement StrategyThis is where most H2 outlooks stop short. Here's what to actually do with this picture, category by category.1. Segment your BOM by risk profile, not just by part number.Advanced logic tied to AI-adjacent applications faces a fundamentally different supply reality than commodity discrete or mature-node passives. Treat these as two separate procurement strategies, not one blended approach. A BOM review that groups parts by constrained, stable, or loosening rather than by function or supplier will surface where your actual exposure sits, and it's often not where teams assume.2. Use the mature-node buyer's market now, not later.If you were forced into single-sourcing during the 2021–2023 shortage years, H2 2026 is the window to qualify second sources for those mature-node components while pricing and availability both favor you. This window won't stay open indefinitely. As automotive and industrial utilization keeps climbing toward capacity, the leverage shifts back to suppliers.3. Be strategic, not reactive, on memory buys.Memory is not one uniform story. Leading-edge densities tied to HBM demand carry a real price premium, but previous-generation DDR4 and LPDDR4 may still offer value while pricing is structurally supported mainly at the high end. If your designs can tolerate a prior-generation module, this is the year to lock it in rather than wait and hope for relief that isn't coming until 2027.4. Watch for new procurement categories forming in real time.Optical networking components for AI data centres are moving from niche to mainstream as AI clusters push toward much higher bandwidth per rack. If your roadmap touches high-bandwidth AI infrastructure at all, get ahead of this now. Procurement categories that don't exist yet in your sourcing playbook have a way of becoming urgent overnight once a design win locks them in.5. Rebuild safety stock around true risk, not blanket buffers.Broadly increasing inventory across the board is expensive and imprecise. The more effective move is targeting buffers at the small percentage of components, often a single connector, capacitor, or legacy memory module, that actually drive downtime risk if they disappear. Combine that with forecasting discipline: suppliers increasingly prioritize allocation and pricing based on how credible and consistent your rolling forecasts are, which means forecast accuracy is now a negotiating asset, not just a planning exercise.6. Don't sleep on non-obvious demand drivers.Rising defense spending across Asia-Pacific is quietly adding a new, non-cyclical source of demand for industrial and mature-node electronics, one that doesn't show up in most consumer-electronics-driven forecasts. If your end markets touch defense, aerospace, or industrial automation, factor this in as upside demand pressure, not background noise.The Bottom Line for the Rest of 2026H2 2026 doesn't call for a single supply chain strategy. It calls for two, running in parallel. Where you're constrained, the priorities are allocation planning, forecast credibility, and locking in what capacity you can. Where you're not, the priority is using the current leverage to diversify, qualify alternates, and rebuild resilience before the window closes. Teams that treat this as one undifferentiated “stabilizing market” will miss both opportunities.If you're navigating either side of this, securing allocation on constrained parts or taking advantage of loosening mature-node availability, that's exactly the kind of sourcing challenge our team works through with customers every day. Reach out to your Fusion Worldwide representative and let's talk through your BOM.(Article Sponsored by Howard Tan, Director of Purchasing, China Fusion Worldwide)
Tuesday 21 July 2026
Driving Global Intelligence: Best AI Awards 2026 Wraps Up
The Ministry of Economic Affairs officialized the successful conclusion of the second annual Best AI Awards, held at the Taipei Nangang Exhibition Center Hall 2. This year's event witnessed an extraordinary surge in international engagement, drawing 1,487 competing teams from 36 countries across the globe, which represents a near two-fold growth in foreign participation compared to the inaugural edition. Out of 253 finalist teams, 100 awards were presented to recognize exceptional breakthroughs in artificial intelligence technology and integration.Leading Innovators Secure Top Honors Across Key Industry VerticalsThe competition highlighted highly competitive solutions spanning healthcare, information and communications technology, manufacturing, and education. Eight prestigious gold medals were awarded to outstanding organizations and academic institutions, including Delta Electronics, Kneron, BrainNavi Biotechnology, ZenTech, National Cheng Kung University, and National Formosa University, alongside pioneering international teams from Thailand and Poland. These entries showcased the practical implementation of artificial intelligence, bridging advanced research with market-ready products.Minister of Economic Affairs Kung Ming-hsin. Credit: TCAMinister Highlights Shift From Hardware Dominance to Practical Industry DeploymentDuring the ceremony, Minister of Economic Affairs Kung Ming-hsin emphasized that while Taiwan maintains a critical global advantage in foundational AI hardware such as semiconductors and servers, the next vital phase involves translating this power into practical applications across all sectors. Under the framework of the government's new major AI infrastructure initiatives, the ministry has established over 50 trial production sites with automated AI capabilities and developed models covering 23 core industries. More than 1,000 consultants have been deployed across the nation to actively assist over 2,600 enterprises in integrating artificial intelligence into their daily operations.Emerging Tech Trends Shape the Future of Edge and Agentic IntelligenceThe second edition successfully guided industrial investments toward the frontier developments of Agentic AI and Edge AI, shifting artificial intelligence from a passive responsive tool to an autonomous partner capable of independent judgment. Driven by strong local integrated circuit design capabilities, more than 430 projects focused on lightweight AI architectures to enable real-time processing directly within terminal devices and industrial machinery. Furthermore, 590 teams integrated open-source environments like GitHub and registered on Crunchbase, significantly elevating the international visibility of the technological ecosystem.Extended Business Matchmaking Initiatives Showcase Commercial Achievements at COMPUTEXTo foster substantial commercial partnerships, organizers featured a dedicated industry matchmaking zone during the finals to link venture capital with startup resources. This promotional effort extended into the COMPUTEX exhibition period, where exclusive matchmaking sessions successfully showcased the winning projects to connect the teams with international buyers and global investors. The Ministry of Economic Affairs plans to continue opening institutional pilot lines to support design verification, prototyping, and unified system integrations, ensuring businesses can seamlessly implement artificial intelligence without developing systems from scratch.The Best AI Awards celebrate global excellence in artificial intelligence and IC design, welcoming submissions from innovative companies and brilliant student teams. Following the success of the 2026 edition—advised by the MOEA, organized by DoIT, and executed by TCA—the prestigious competition is officially transitioning into an annual tradition.Offering substantial grand prizes and unmatched industry exposure, the countdown to Best AI Awards 2027 has already begun. Details on the next submission cycle, prize tiers, and eligibility rules will be released soon. Connect with on LinkedIn for the latest official updates and application alerts. Group Photo of the Best AI Awards 2026 Winners. Credit: TCA
Tuesday 21 July 2026
EDABK Brain: A chip in the ear measures heart activity
Cardiovascular disease – diseases of the heart or the blood vessels that move blood to and from the heart – were responsible for an estimated 32 per cent of deaths worldwide, or just under 20 million deaths, in 2022, according to the World Health Organisation. Their takeaway? "It is important to detect cardiovascular disease as early as possible so that management with counselling and medicines can begin."Electrocardiograms (ECGs), a series of peaks that represent each heartbeat, depict the heart's electrical activity over time. An abnormal ECG (compared to one's baseline) can be indicative of arrhythmias, the medical term for irregular heartbeats that, in most cases, are not serious but can sometimes lead to strokes, heart attacks, and death. Patients can wear Holter monitors to continuously measure their ECG, but that entails placing a large number of electrodes (between three and eight, and up to twelve for greatest accuracy) on the skin, and wearing a piece of recording equipment around the neck or waist. Not only can this be inconvenient, but up to half of all patients reported some sort of skin irritation due to the electrodes.Smartwatches can also be used to measure an ECG, but only when both hands touch the device – in other words, they cannot be used for passive, continuous heart monitoring. That's where integrated circuits can help. Students at the Hanoi University of Science and Technology (HUST) are working on an integrated circuit that can continuously monitor the heart's electrical activity through the ear. Such devices are already commonplace, with many people wearing hearing aids or smart hearables for at least some of the day. There are three physical connection points – both ears and one earlobe – the minimum required to measure an ECG.The ECG collected between the ears is useful only insofar as it can then reconstruct what lead-1 ECG, which is the electrical activity as would be measured by electrodes placed on the right and left arms. The lead-1 ECG is also a standard ECG measurement that is used for diagnosis and monitoring arrhythmias. There are generally similarities between the ear ECG and the lead-1 ECG – in particular, the peaks (representing the heartbeats) appear at the same location – but they are clearer in the lead-1 ECG than in the ear ECG.So while the algorithm on the chip must be able to recover the shape of the original lead-1 ECG with as little noise as possible, it should not smooth over any possible signs of abnormality – in other words, it needs to be sensitive enough to detect arrhythmias when they are present.The system is relatively unobtrusive and runs on low power, but using the ear also presents disadvantages. The signal-to-noise ratio is low. In fact, simply shaking one's head or talking will introduce noise into the measurements. Furthermore, special data privacy concerns when collecting biological signals – each user has a unique ‘heartprint’ and some users might be particularly wary of sending such data to another machine – make it imperative that any analysis is done on the chip itself.The user himself can measure his own lead-1 ECG using his two fingers (as proxies for the right and left arms), and measure his ear ECG with the devices touching his ear. All of this is done with electrodes attached to a sensor (with a built-in analog-digital convertor, or ADG) developed by Texas Instruments. Two datasets were created to train the AI calibration algorithm for the conversion between the ear and lead-1 ECGs. Firstly, the team collected its own dataset, measuring the ECGs for 45 patients for 10 minutes each. A synthetic public dataset was also created by modifying an existing large, open dataset of ECGs, the PTB-XL. This dataset doesn't include ear ECGs, so the team added noise to existing lead-1 measurements (in an attempt to emulate the ear ECG) and tried to recover the original, non-noisy lead-1 ECG. The team, which calls itself EDABK Brain, was able to bring the algorithm's latency, or delay time between receiving the ear ECG and producing the lead-1 ECG, down to below 50 milliseconds. Such short times obviate the need to store data from the ear-ECG, for instance. At the same time, they maximised the utilisation of the processing element, meaning that they worked hard to make sure the chip was effective.After prototyping a field-programmable gate array (FPGA) with their IC design, the team trained it on the self-collected dataset. On the two most important metrics, the signal-to-noise ratio and the correlation with the true lead-1 ECG, EDABK Brain slightly outperformed state-of-the-art algorithms. It was edged out by another algorithm – but the HUST model used fewer than a quarter as many parameters as that algorithm did.For another comparison, EDABK Brain's circuit used less power and was more energy efficient than BioGAP, a leading biosensing platform that can measure ECGs as well as other electrical signals in the body. However, BioGAP's circuit has a lower latency time and a high throughput (measured in operations per second).The team behind this chip design, the EDABK Brain Team (the EDA stands for electronic design automation, and the BK stands for Bách khoa, which is in the Vietnamese name of their university,  consists of Phuong Linh Nguyen, a student who graduated from their university last year and is now studying for a master's degree at Télécom Paris (one of the most prestigious French grandes écoles and part of the Polytechnic Institute of Paris), and who spoke to DIGITIMES; and her two former classmates, Thanh Dat Do and Duc Tu Nguyen, both of whom are in their final year in the School of Electronics and Electrical Engineering at HUST; and their supervisor, Duc Minh Nguyen. Having the chance to participate in the Best AI Awards motivates Nguyen and her teammates. Being just students at the start of their scientific career, they were curious to know what industry professionals thought of their idea – does it have potential? Winning the bronze medal is confirmation that it indeed does have potential.Nguyen said that it was also a relatively rare opportunity for them to communicate their ideas in a non-academic setting. Their university was able to send three teams to the finals, which also entailed a trip to Taiwan and interactions with state-of-the-art AI and IC researchers.They will now focus on writing a paper – after all, they come from academia – and preparing patent applications. On the technical side, they want to reduce the number of bits in their resolution – in other words, see whether they can convert the analog signal to a digital one with a fewer number of bits and less accuracy – to reduce complexity and thereby power consumption. The team will also experiment with other electrodes.The Best AI Awards celebrate global excellence in artificial intelligence and IC design, welcoming submissions from innovative companies and brilliant student teams. Following the success of the 2026 edition—advised by the MOEA, organized by DoIT, and executed by TCA—the prestigious competition is officially transitioning into an annual tradition.Offering substantial grand prizes and unmatched industry exposure, the countdown to Best AI Awards 2027 has already begun. Details on the next submission cycle, prize tiers, and eligibility rules will be released soon. Connect with us on LinkedIn for the latest official updates and application alerts.