Tracking devices play a critical role in the Internet of Things (IoT) by enabling real-time monitoring and data collection across various industries. As IoT applications expand, the demand for energy-efficient solutions becomes increasingly important. This article explores the rise of battery-efficient tracking devices and their transformative impact on IoT ecosystems

Amidst the reality of global oil prices continuously skyrocketing due to war, the global market is facing the formidable challenges posed by the turbulence impacting the global economy in 2026. Major Taiwanese electronics manufacturers and supply chains are pivoting to review comprehensive AI strategies. They are adopting a particularly aggressive stance in their strategic deployment of cloud server systems and AI infrastructure, aiming to achieve an operational breakthrough where the market outlook remains far from optimistic

Technology news, product launches and show highlights from the event attendees available for download (PDF).

The Asia FinTech Alliance (AFA) recently announced the results of its latest leadership election, conducted in full accordance with the AFA Bylaws unanimously adopted by all members in 2025.All elected members of the Executive Committee received affirmative written consent from more than two-thirds (2/3) of AFA member associations, representing at least ten Asian economies, underscoring strong collective confidence in AFA's governance framework and leadership continuity.Election ResultsJaclyn Tsai (Taiwan) was re-elected as Chairwoman of AFA for a second term.Dongpyo Hong (Korea) and Wilson Beh (Malaysia) continue their roles as Vice Chairpersons, having been elected in November 2025.Takafumi Ochiai (Japan) was elected as Treasurer, a newly established Executive Committee position that marks a key milestone in strengthening AFA's financial oversight and institutional maturity.Winston Hsiao (Taiwan) was re-elected as Secretary, ensuring continuity in AFA’s operational coordination and internal governance.Under the renewed leadership structure, the two Vice Chairpersons will jointly oversee eight Working Groups, including Bylaws, Anti-Fraud, Academy, Affiliate Members, Women in FinTech, Website, and Webinars, to drive focused execution across policy, industry development, inclusion, and knowledge exchange.Leadership Voices"I am deeply honored by the trust our members have placed in this leadership team," said Jaclyn Tsai, Chairwoman of AFA. "AFA is not just a platform - it is a network of trust. The more trust we build across borders, the more collective power we have to shape Asia's fintech future."Dongpyo Hong, Vice Chairperson, noted: "Strong governance is the foundation of meaningful regional collaboration. With clearer roles and active working groups, AFA is well positioned to move from dialogue to coordinated action."Wilson Beh, Vice Chairperson, added: "AFA's strength lies in its diversity - across markets, regulatory environments, and stages of development. This allows us to co-create solutions that truly work for Asia."Takafumi Ochiai, Treasurer, commented: "The creation of the Treasurer role reflects AFA's evolution into a more accountable and sustainable regional organization, reinforcing member trust through sound financial governance. As a member of the Executive Committee, I also look forward to contributing to AFA's broader initiatives across the region."Winston Hsiao, Secretary of AFA, emphasized execution and continuity: "Good governance is not only about structure, but about consistent implementation. As Secretary, I look forward to supporting the Executive Committee and Working Groups in translating AFA’s shared vision into concrete outcomes for our members."A Shared Vision for AsiaGuided by the principle of an alliance of associations, AFA brings together one leading fintech association from each participating economy. The Alliance currently comprises 15 member associations, representing Taiwan, Korea, Japan, Singapore, Malaysia, Hong Kong, the Philippines, Indonesia, Thailand, Mongolia, Cambodia, Vietnam, India, Nepal, and Sri Lanka.With its renewed mandate, AFA will continue to strengthen cross-border trust, regulatory dialogue, and industry collaboration, transforming diversity into collective strength and governance into long-term regional impact.AFA — We Build Trust Together, Shape Asia's Future Together.

DesignCon, the United States' premier annual gathering for chip, board, and systems design engineers, returns to the Santa Clara Convention Center from February 24-26, 2026. For over three decades, this flagship Silicon Valley event has served as the essential forum for industry professionals to discover innovative solutions to the most pressing signal and power integrity challenges.As a global leader in semiconductor test sockets, Smiths Interconnect is proud to announce its participation in this prestigious conference and exhibition. We will feature a comprehensive portfolio of our star test products, highlighting solutions engineered for the next generation of technology in AI PCs, Enterprise Data Centres (EDC), automotive electronics, and the Internet of Things (IoT).Spotlight on Innovation: DaVinci Gen V High-Speed Test SocketHeadlining the display will be the DaVinci Gen V High-Speed Test Socket, Smiths Interconnect's latest flagship product. Designed to meet the extreme demands of high-performance computing and AI data centres, the DaVinci Gen V test socket delivers breakthrough high-speed signal transmission and performance. It enables unprecedented digital signaling speeds of up to 224 Gbps PAM4 for AI accelerators and beyond 100 GHz for 6G communications. These speeds are crucial for supporting the growing demand for massive data transfer.The solution supports BGA, LGA, and other package variants, using spring probe technology with a homogeneous alloy and gold plating to ensure better grounding. It delivers RF bandwidth greater than 84 GHz at -1 dB insertion loss, with a short signal path and a 4.90 mm test height. The impedance is tuned to match the system, providing consistent and stable contact resistance of 55 mΩ on average.The design also accommodates high co-planarity and features a tri-temp socket structure capable of operating from -55 °C to +150 °C. The same socket is suitable for manual test, bench test, and high-volume manufacturing (HVM) production test, enabling greater efficiency and consistency across test stages.In addition to high-speed test solutions, Smiths Interconnect will also showcase its high-power burn-in socket, a specialised electromechanical interface designed to temporarily connect a semiconductor device—such as a CPU, GPU, AI accelerator, or high-power discrete component—to a test board during the burn-in and stress-testing phase of manufacturing.It is designed to support next-generation devices with up to 22,000 contacts and sizes up to 150 × 150 mm, while managing power levels of up to 2000 W through integrated liquid cooling. The socket is universally compatible with advanced burn-in chamber platforms and can deliver a 500 lb applied load with a maximum closing force of 15 lb. Flexible thermal options, including passive heatsinks and heat pipes, are also available to meet different testing requirements.This burn-in socket is built for durability and thermal/electrical stability under extreme stress conditions.Attendees are invited to visit Booth 508 to experience Smiths Interconnect's cutting-edge technologies firsthand and engage with technical experts.Credit: Smiths InterconnectCredit: Smiths Interconnect

The "From Shenzhen to Global Opportunity: BIWIN Mini SSD Ecosystem Application Seminar", jointly hosted by BIWIN and Intel, was successfully concluded at the Intel Greater Bay Area Innovation Center in Shenzhen.  The seminar convened leading companies, industry partners, and authoritative media from across the value chain, including but not limited to computing power, advanced packaging, controller solutions, and end-device manufacturing providers. Together, participants gained an early glimpse into BIWIN's Mini SSD ecosystem strategy and engaged in in-depth discussions on industry collaboration and emerging business opportunities driven by AI.On-Device AI Is Redefining Storage Innovations at the EdgeAI is now embedding into edge devices like PCs, wearables, and robots with unmatched depth and reach, sparking revolutionary hardware needs. Storage, the core data foundation, must balance form factor, speed/performance, and power consumption - a critical constraint hindering new terminal designs and major performance jumps.Across the industry, a clear consensus is emerging: the edge-AI revolution must be powered by a fundamental transformation in storage technology. Conventional storage solutions can no longer satisfy the rigid requirements for ultra-compact size, high performance, low power consumption, and flexible scalability. The market is calling for a truly disruptive solution.BIWIN Mini SSD: Reshaping Industry Possibilities with a Ground-Up InnovationIn response to these industry shifts, BIWIN introduced Mini SSD, a product designed from the ground up for next-generation edge platforms. Rather than a simple iteration of existing solutions, Mini SSD represents a complete redefinition of SSD form factors, purpose-built for the future."The explosive growth of edge AI has created the perfect moment for storage innovation," said Rixin Sun, Founder and Group Strategic Advisor of BIWIN, in his opening remarks. "Mini SSD is not only a technological breakthrough for BIWIN, but also a new starting point for co-creating business value with our ecosystem partners."With approximately 40% of the volume of an M.2 2230 SSD and weighing about 1 gram, the Mini SSD delivers flagship-class performance, supporting capacities of up to 2TB and sequential read/write speeds of up to 3,700MB/s and 3,400MB/s. It also features IP68-rated dust and water resistance, 3-meter drop protection, and durability rated for over 12,000 insertion cycles.Its breakthrough design has earned multiple prestigious international awards, including TIME's Best Inventions of 2025 (the only storage product globally selected) and "Best-in-Show" at Embedded World North America 2025.Huilian Wang, Product Director, BIWIN. Credit:BIWINHuilian Wang, Product Director at BIWIN, further elaborated on the product's ecosystem value. Mini SSD is precisely positioned for five key application scenarios, namely ultra-thin notebooks, gaming handhelds, external storage, mobile workstations, and Physical AI devices, providing a new core engine for terminal-side innovation.BIWIN Mini SSD's power ultra-thin laptops, handhelds, external storage, workstations, and Physical AI. Credit:BIWINVertical Integration + Ecosystem Collaboration: Building a Solid Industrial FoundationThe success of Mini SSD is underpinned by BIWIN's strong vertically integrated capabilities and its open, collaborative ecosystem strategy.Internally, BIWIN has established a complete vertical chain spanning IC design, firmware development, and advanced packaging and testing. Greater Bay Advanced Technology Co., Ltd. (GBAT), its wholly-owned subsidiary and also the advanced packaging and manufacturing center, has overcome critical challenges such as 45μm ultra-thin die cracking in advanced packaging, ensuring exceptional reliability and performance.Externally, BIWIN is working closely with leading ecosystem partners to foster an open and mutually beneficial industry environment. As a long-term strategic partner, Intel shared its latest advancements in AI PC technologies. Tao Yan, Client Technology Director, Intel China, noted the strong foundation of cooperation between the two companies and expressed expectations for broader innovation enabled by Mini SSD in the AI PC era.Vertical Integration + Ecosystem Collaboration: Building a Solid Industrial Foundation. Credit:BIWINGlobal controller leaders such as Silicon Motion and Maxio Technology have also collaborated closely with BIWIN to provide powerful performance engines for Mini SSD. On the terminal side, Lin Wang, General Manager of One-Netbook (ONEXPLAYER), the first brand to adopt Mini SSD, shared that the product has become a core differentiator for its offerings. Meanwhile, AI PC solution providers such as Sixunited Intelligent confirmed plans to actively integrate Mini SSD into future product lines to address the surging storage demands driven by AI applications.Open Collaboration, Shared GrowthThis successful seminar marks not only a key milestone in BIWIN's Mini SSD ecosystem strategy, but also signals the industry's collective move into a new era of AI-driven storage.Looking ahead, BIWIN reaffirmed its commitment to openness by sharing product specifications, standardizing interfaces, and working with partners to establish industry alliances. Leveraging 32-die stacking packaging technology, 4TB and higher capacity Mini SSD variants are already on the roadmap, promising even higher performance and larger storage options.From defining a breakthrough product to building an open ecosystem, BIWIN is steadily transforming Mini SSD from a single innovation into a scalable industry standard. Through continuous technological advancement, open interface standards, and deep scenario enablement, BIWIN will work alongside global partners to convert the vast potential of edge AI into tangible commercial value, accelerating the arrival of the next era of AI hardware.Seminar marks BIWIN's Mini SSD milestone and a new AI-driven storage era. Credit:BIWIN