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REALTIME NEWS
Commentaty: Huawei’s Kirin's road to 2027
Tomorrow's Headlines
8h 52min ago
Analysis: What's GlobalFoundries calculus behind its US$2 billion entry into TSMC’s CoWoS ecosystem
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8h 52min ago
ProLogium shifts solid-state battery focus to AI and aviation markets
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8h 52min ago
Commentary: What is Musk's plan to catch up with TSMC
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Commentary: The many hurdles of Apple HomeView
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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Monday 24 August 2026
STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
With an absolute maximum rating (AMR) of 75V, STMicroelectronics' L98GD8E is the only 48V automotive pre-driver to combine compliance with the ISO 21780 standard for 48V electrical systems and eight channels for high-side and low-side driving.
Monday 24 August 2026
iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in an AI multichip package while scaling up glass panel sizes? If so, visit iCometrue at Booth M0957, Hall 1, 4F, Taipei Nangang Exhibition Center during SEMICON Taiwan 2026!
Thursday 20 August 2026
Corning-IRICO Trade Secret Case Enters New Phase
The intellectual property dispute between Corning and China-based IRICO has entered a new phase at the U.S. International Trade Commission (ITC), with the focus shifting from the finding of trade secret misappropriation to potential remedies affecting access to the U.S. market.
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
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Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
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TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
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TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
Broadcom executive says chipmakers must tackle packaging, power limits together
Tata's flagship chip fab faces pressure from its own shareholders
Applied Materials lifts 2030 margin goals, but a missing industry forecast sends a disappointing signal
HBM capacity shift sends DDR4 contract prices rising faster than DDR5
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