As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...

Technology news, product launches and show highlights from the event attendees available for download (PDF).

As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly. Thermal management has therefore become a critical factor affecting performance, reliability, and system design...

Taiwan is home to the world's most advanced semiconductor ecosystem. The island produces over 60% of global contract chip manufacturing and dominates key segments from IC design to advanced packaging. For international engineers, joining this ecosystem represents an opportunity to work at the frontier of chip technology - but succeeding here requires more than technical brilliance...

Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in an AI multichip package? Interested in knowing how to increase the glass panel size for manufacturing AI multichip packages? If so, visit iCometrue® at Booth M0957, Hall 1, 4F, Taipei...