Taipei, December 11, 2025: Dimerco Express Group ("Dimerco") has announced that it is strengthening its integrated, Asia-focused logistics solutions to help customers capture growth from AI and "Taiwan+, China+" manufacturing while managing risks from congestion, regulatory changes and shifting capacity

At COMPUTEX 2025, ASUS showcased its comprehensive AI infrastructure solutions, targeting the computing needs of data centers, edge computing, and a wide range of intelligent applications. With a robust product portfolio, ASUS brings to life the NVIDIA AI Factory vision, illustrating how AI will be deeply embedded into enterprise IT infrastructure. This evolution continues to drive forward applications and services that shape the future of AI and high-performance computing

Technology news, product launches and show highlights from the event attendees available for download (PDF).

As AI workloads scale across global cloud infrastructure, chip designers face a persistent challenge: balancing compute throughput, bandwidth, and power efficiency amid escalating design complexity.Emerging architectures built around UCIe-based chiplets, PCI Express 7.0 and CXL 3.1 interconnects, and 2.5D/3D memory-integrated packaging have made integration-not computation-the new bottleneck.Progate Group Corporation (PGC, TPEx: 8227), a member of TSMC DCA, leverages its long-term partnership with Synopsys to solve that bottleneck.Through a unified ASIC turnkey flow, PGC enables innovators to design, verify, and manufacture advanced-node SoCs and chiplet-based accelerators for cloud and AI applications with greater efficiency and lower risk.PGC integrates the latest generation of Synopsys Interface IP, spanning high-speed interconnects, memory, and networking subsystems critical to modern cloud and AI processors.The portfolio includes UCIe 40G Die-to-Die, CXL 3.x, and PCI Express 7.0 controllers that enable seamless chiplet-based compute integration for next-generation server processors.It also incorporates HBM4 and DDR5 Gen2 memory subsystems optimized for multi-stack 2.5D and 3D integration, as well as 224G Ultra Ethernet PHY solutions designed for high-throughput data-center networking.Validated across TSMC 3nm to 2nm process nodes, these silicon-proven IPs address the cloud industry's most demanding bandwidth and power-efficiency challenges while maintaining full compatibility with Synopsys EDA and PDK environments.Through its TSMC Design Center Alliance (DCA) membership, PGC provides a verified turnkey service covering RTL design, APR layout, wafer fabrication, 2.5D/3D packaging, and final test coordination.By integrating Synopsys EDA tools (Design Compiler, Fusion Compiler, ICC2, PrimeTime) and complete IP deliverables (Lib, LEF, GDS, and testbench models), PGC helps customers accelerate RTL-to-signoff cycles through pre-verified IP subsystems, SIPI (signal and power integrity) analysis, and IP hardening support-as described in Synopsys' IP Accelerated methodology.This unified approach reduces integration risk, minimiclozes manual iteration, and ensures design closure consistency across advanced-node ASIC projects."Cloud and AI systems are evolving into distributed compute platforms built on multiple dies and protocol layers," said Fred Lai, CEO of PGC."By aligning Synopsys' IP Accelerated methodology with TSMC's leading-edge processes, PGC helps customers scale performance while maintaining design predictability and manufacturing reliability."Unlike large turnkey providers that concentrate solely on a handful of mega-scale clients, PGC combines advanced-node design capability with engineering agility, making it a trusted partner for both hyperscalers and rapidly growing AI startups.Beyond simplifying multi-vendor coordination, the company maintains unified technical accountability across design, IP integration, and manufacturing, ensuring that every stage of development proceeds seamlessly.PGC's engineers perform SIPI co-optimization using Synopsys EDA and PDK models to guarantee signal and power stability, while TSMC-certified signoff flows deliver predictable yield and reliability.Supported by cross-regional teams in Taiwan, Japan, China, and the United States, PGC provides rapid collaboration and execution across the entire ASIC turnkey cycle.PGC's ecosystem extends from design integration to manufacturing, combining TSMC's advanced-node foundry services, Synopsys' comprehensive IP portfolio, and partnerships with leading OSAT partners for 2.5D/3D packaging enablement.Together, this network provides a complete foundation for high-bandwidth, energy-efficient ASIC innovation across AI, HPC, and cloud computing markets.

Global Unichip Corp. (GUC), the Advanced ASIC leader, and Ayar Labs, a leader in co-packaged optics (CPO) for large-scale AI workloads, have announced a strategic partnership to integrate CPO into GUC's advanced ASIC design services.This collaboration paves the way for high-bandwidth, low-latency, power-efficient optical interconnects in next-generation AI, HPC and networking applications where electrical signaling is reaching its limits. By integrating Ayar Labs'TeraPH optical engines into GUC's advanced packaging and ASIC workflow, the companies are exploring critical areas to enable future CPO deployment."The CPO revolution is at our doorstep. Integrating Ayar Labs'optical engines into our advanced packaging flows is a critical step," said Igor Elkanovich, CTO of GUC. "Our new joint design allows us to address the challenges of CPO integration - architectural, power and signal integrity, mechanical and thermal - ensuring our future customers have access to a robust, high-bandwidth and power-efficient solution."The new XPU multi-chip package (MCP) design replaces traditional electrical interconnects with Ayar Labs'optical engines attached directly to the MCP organic substrate. This architecture enables more than 100 Tbps full-duplex optical interface from the XPU package, more than an order of magnitude improvement over current XPUs.UCIe-S (64 Gbps) provides bandwidth between the optical engines and I/O chiplets over the MCP substrate, while UCIe-A (64 Gbps) is used for communication between the I/O chiplet to the main AI die over local silicon interconnect (LSI) bridges. The design also addresses signal and power integrity challenges associated with the large-scale package. Thermal optimization is done at the XPU MCP level, and a new stiffener design incorporates optical engines' requirements and enables detachable fiber connections while meeting mechanical stress and warpage requirements."The future of AI and data center scale-up will not be possible without optics to overcome the electrical I/O bottleneck," said Vladimir Stojanovic, CTO and co-founder of Ayar Labs. "Working with GUC on advanced packaging and silicon technologies is an important step in demonstrating how our optical engines can accelerate the implementation of co-packaged optics for hyperscalers and AI scale-up."GUC will share more about these technology advancements during a presentation titled "Advanced Packaging Technologies for Modular and Powerful Compute" at the 2025 TSMC Open Innovation Platform (OIP) Ecosystem Forum in Hsinchu, Taiwan, on Tuesday, Nov. 18, 2025.For more information about GUC.For more information about Ayar Labs.

The rise of generative AI is accelerating digital transformation across traditional industries, and the construction sector is no exception. In an industry long dependent on hands-on expertise and experience sharing, construction companies face mounting challenges including labor shortages, rising costs, project delays, and increasingly stringent regulatory requirements. To address these issues, Shipeng Technology has developed an end-to-end smart construction solution centered on a "Digital Twin + AI Platform," powered by the robust computing capabilities of Amazon Web Services (AWS).Integrating AI, cloud, and digital twin technologies to drive smart constructionAccording to Shibo Lin, founder of Shipeng Technology, the company's core solution revolves around three key pillars: visibility, precision, and control. Covering the entire project lifecycle - from design and construction to operation and maintenance - it establishes a comprehensive digital twin management process. By replacing traditional 2D blueprints with 3D BIM (Building Information Modeling), design conflicts can be identified and resolved before construction begins. The AI platform integrates material and scheduling data, allowing on-site teams to query project progress and cost details using natural language. In addition, AR and sensor technologies enable real-time comparison between physical structures and digital models, ensuring quality and progress remain aligned. The result is a significant reduction in human error and delay risks, along with enhanced data-driven decision-making capabilities.Shipeng Technology leverages AWS cloud computing, AI/ML platforms, and IoT services to handle the massive volume of construction data and 3D model computations. By integrating sensor, image, and progress data in the cloud, the company builds high-precision digital twins that remain perfectly synchronized with the physical site. This architecture not only ensures flexibility, scalability, and security but also enables rapid model updates and data processing within minutes - greatly reducing operational costs and accelerating project delivery. Lin emphasized that AWS's global cloud infrastructure allows the team to focus on application innovation and AI model optimization, truly realizing the vision of bringing "smart construction from cloud to job site."Real-world projects demonstrate efficiency gainsIn a recent major construction project, regulatory changes required a complete redesign. Traditionally, the revision process would take four months. With Shipeng Technology's BIM solution and AWS support, the team completed the entire update and validation in just one week, reducing the timeline by over tenfold and saving substantial downtime costs.In another project, the Startup Terrace A6 Tower in Linkou adopted Shipeng Technology's digital asset management system. Tasks that once took three months - such as inventory verification - are now completed within five to ten minutes. Supported by AWS's real-time data integration and high-performance computing, the platform enables project managers to monitor on-site progress and asset conditions seamlessly. Lin noted that Shipeng Technology aims to make every data point from construction sites actionable, turning real-time insights into the foundation for smarter decisions.From Taiwan to the world: building a cloud ecosystem for smart constructionThrough its participation in the Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC) project, Shipeng Technology established a presence in Kaohsiung's Startup Terrace and gained access to extensive local industry resources. The project's matchmaking and mentoring programs have helped the company connect with construction partners in southern Taiwan and refine its business presentation and client engagement capabilities. Lin remarked that this industry collaboration model - combining local partnerships with cloud-based coordination - not only accelerates digital transformation in southern Taiwan's construction industry but also strengthens Shipeng Technology's local market foothold.While deepening its presence in Taiwan, Shipeng Technology is actively expanding internationally. Following its strategy of "Taiwan R&D, Japan validation, and global deployment" , the team recently participated in a global startup competition and secured collaboration opportunities with Japanese partners to deploy smart construction solutions overseas. Given Japan's strong demand for construction automation and ESG management, the market serves as the company's first step toward globalization. Moving forward, Shipeng Technology will continue to establish international standards for smart building practices and bringing its digital construction technologies to the world.