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REALTIME NEWS
Anthropic's surging compute demand fuels ASIC prospects, favoring Broadcom over MediaTek
ICT
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Seagate sees a multi-year storage upcycle as long-term deals lock up supply through 2028
ICT
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Taiwanese chipmakers’ earnings calls to spotlight mobile, PC and cloud AI trends
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AI startup ARR inflation controversy raises doubts over revenue credibility
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PHP2Shell vulnerabilities expose global websites to severe cybersecurity risks
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SFC to supply blue host materials for Apple OLED MacBook Pro
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Display industry transformation remains focus as earnings briefings begin
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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains
As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the future of computing. However, moving technologies such as silicon photonics and co-packaged optics (CPO) from development to commercial deployment presents a critical challenge: how to achieve reliable, high-volume production.
Wednesday 2 September 2026
Keywave Technology innovative radar sensors spark a smart sensing revolution
Keywave Technology is a fabless semiconductor company founded in December 2022 that specializes in radio frequency (RF) integrated circuit (IC) design and advanced radar sensing solutions...
Wednesday 2 September 2026
Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging
Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands...
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Nvidia unveils OOI CPO prototype for post-2028 AI needs
SK Hynix's record quarter shows AI demand turning memory into a contracted, supply-limited business
CXMT reportedly prioritizes China demand, rejecting Apple's DRAM inquiry
FarEasTone, Elveo Mobile expand satellite-to-phone connectivity in Taiwan
NXP lines up software-defined vehicles, industrial AI and data centers for double-digit growth in 2027
Nvidia DSX POD targets AI factories as Microsoft and AWS push modular data centers to the edge
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