AEWIN announces partnership with D8AI to accelerate the arrival of AI empowered future. With continued growth in smart applications, D8AI solutions enable companies of all sizes to leverage the power of AI to provide better value and improve organizational efficiency.

The digital transformation driven by the convergence of AI and 5G has made data a key enabler of economic development. As a result, in addition to requiring higher computing performance, memory and storage components are playing an increasingly important role for various computing architectures. At 2021 Computex Taipei, Micron Technology unveiled several new products based on its leading 176-layer NAND and 1α (1-alpha) DRAM technology. Meanwhile, Sanjay Mehrotra, Micron President and CEO, and Raj Hazra, Senior Vice President and General Manager of Compute and Networking Business Unit, also gave speeches, explaining how the innovation of memory and storage can drive the expansion of AI applications, in a bid to realize the unlimited possibilities from data center to intelligent edge devices.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS Platform with 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and third-party 112G-LR SerDes IPs. The main die of the platform contains the world's first HBM3 Controller and PHY IP with a record-high 7.2 Gbps performance. The platform meets strict signal and power integrity (SI and PI) requirements of 112G-LR SerDes routed through TSMC CoWoS technologies.

ADLINK Technology Inc, a global leader in edge computing, introduces two new modules in the 6-CH EU Series digital I/O – the ECAT-4XMO motion control and trigger module, and the ECAT-TRG4 trigger modules. The new modules are a dynamic extension to ADLINK's EtherCAT System and are designed to perfectly complement the EU Series, enabling higher performance in automatic assembly, test, and inspection equipment across a multitude of applications including cell phone glass inspection, battery cell assembly, camera lens assembly and test and glue dispensing machinery, as well as inspection equipment.

The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the electrical characteristics of each die on the wafer, so that dies with faulty electrical performance can be vetted before packaging, effectively reducing unnecessary manufacturing costs from faulty products.

Consumer demand for higher audiovisual quality is driving the evolution of technologies behind LCD displays. Specifically, mini-LEDs, with their superior contrast and color gradation performance, have emerged in the field of display backlights. With a strong R&D foundation in the field of mini-LED technology, Macroblock recently launched a series of mini-LED backlight driver ICs that correspond to various LCD display sizes. According to Chris Chen, Macroblock backlight product manager, the company can help clients create the most suitable products tailored to the needs of different groups in the market.