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REALTIME NEWS
Why are China EVs barriers on US market untouched during Trump-Xi talks
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China car market weakens as Taiwanese suppliers brace for inventory clearance in 2H26
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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Wednesday 2 September 2026
DAS Introduces ALCEA for Integrated NOx Treatment in Semiconductor Fabs
DAS Environmental Expert GmbH today announced the launch of ALCEA, a new secondary abatement solution for nitrogen oxide (NOx) emissions in semiconductor manufacturing. Installed downstream of NOx-generating waste gas treatment units, ALCEA can reduce NOx by up to 95 percent while its catalyst stage is integrated directly into the exhaust duct, minimizing additional floor space in the subfab...
Wednesday 2 September 2026
Keywave Technology innovative radar sensors spark a smart sensing revolution
Keywave Technology is a fabless semiconductor company founded in December 2022 that specializes in radio frequency (RF) integrated circuit (IC) design and advanced radar sensing solutions...
Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains
As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the future of computing. However, moving technologies such as silicon photonics and co-packaged optics (CPO) from development to commercial deployment presents a critical challenge: how to achieve reliable, high-volume production.
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
Musk's Memphis move puts xAI at the center of his empire
SK Hynix touts up to 5.15x inference gains with custom HBM
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
AMD pays US$8.2 billion for Fei-Fei Li's 3D world-modeling startup to shape future AI chips
LG AI Research expands sovereign AI push into Kazakhstan, Middle East
GlobalFoundries eyes GaN expansion to challenge TSMC in AI
SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform
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