j5create, a global leader in 3C peripherals and smart workspace solutions, is showcasing a comprehensive lineup of new smart connectivity products at COMPUTEX 2026. Focusing on cross-device collaboration, wireless audio/video (AV), smart desktops, and AI-integrated applications, the exhibition demonstrates how j5create is expanding beyond traditional connectivity hardware to deliver a more intuitive, unconstrained digital experience

PEGATRON Corporation (PEGATRON) officially opened its booth at COMPUTEX 2026, presenting its AI Tech Maker strategy and its role in helping move AI from infrastructure planning to real-world deployment

Technology news, product launches and show highlights from the event attendees available for download (PDF).

As Artificial Intelligence (AI) applications rapidly expand from cloud computing to edge computing, smart manufacturing, networking equipment, and AI PCs, stable and high-efficiency power supply has become the critical foundation for AI system operations. FSP Group will make a major appearance at COMPUTEX 2026 under the theme "Powering AI Together," showcase to  comprehensively demonstrate its AI power solution layout from data centers to end-user devices.Collaborating with Global ICT LeadersThis year, FSP Group has joined forces with multiple AI and Information and Communications Technology (ICT) leaders to demonstrate application results. Partners include Advantech, AIC, ARBOR, Chenbro, CyberTAN, UNEEC, Intel, SPARKLE, Trust5 intelligence and Uniwill.Through live system demonstrations, FSP will showcase how its power solutions are successfully integrated into AI servers, industrial PCs, and smart devices, further driving the rapid implementation of AI business applications.Focusing on Critical Power Infrastructure in the AI EraThis exhibition showcases FSP's AI power solution portfolio spanning from data centers to end devices, focusing on the critical power infrastructure driving the AI era, including: Data Center Power Shelf, Battery Backup Unit (BBU) Shelf, Networking Power Solutions, CRPS Solutions, Industrial PC (IPC) Power Solutions, USB PD Fast Charging Solutions, Grid Resilience Solutions, AI PC Power Solutions.These exhibits fully demonstrate FSP's comprehensive technical strength from core infrastructure to terminal applications.High-Performance Computing and Edge AI ApplicationsData center solutions focus on AI servers and High-Performance Computing (HPC) applications, providing high-efficiency and reliable power support tailored for high-power, high-density, and redundancy requirements. Meanwhile, networking and edge computing applications cover diverse scenarios including PoE switches, network switches, embedded systems, and edge AI servers, aiming to meet the power demands of various AI architectures."Micro Customization" as a Core Competitive EdgeFSP stated that in the face of rapid AI market development and diversified application needs, the company continues to leverage "Micro Customization" as its core competitive advantage. By providing highly flexible and reliable power solutions tailored to different application scenarios, FSP helps customers shorten development cycles and enhance system stability and market competitiveness.Complete Layout for High-End Consumer and Retail MarketsIn addition, FSP showcased a variety of products tailored for AI workstations. This impressive lineup features high-wattage power supplies such as the CANNON 3300W, the TWINS PRO 1400W ATX(PS2) redundant power supply, the high-power TWINS CRPS 3200W redundant power supply, and the 80 PLUS Titanium-certified MEGA TI 1650W White Edition. On the chassis front, FSP introduced multiple 4U Tower/Rack hybrid AI chassis, alongside the S210 chassis, specifically designed for compact performance and certified with NVIDIA SFF READY.  Providing a complete solution from power supply to chassis cooling, this display fully demonstrates FSP's comprehensive product layout in both enterprise-level applications and high-end consumer markets.With the rapid advancement of AI applications, power supplies have evolved from backstage components to the critical core of system performance and stability. Through COMPUTEX 2026, FSP Group will further demonstrate its technical prowess and industrial layout in the AI power sector.For more information on FSP products, please visit.

As generative AI and intelligent applications continue expanding from cloud infrastructure into real-world environments, demand is rapidly increasing for Edge AI platforms capable of delivering real-time computing, low latency, space efficiency, and long-term operational stability. At COMPUTEX 2026, Shuttle Inc. will showcase a series of Edge AI computing platforms powered by Intel Core Ultra processors, highlighting AI-ready edge computing systems designed to accelerate practical AI deployment across commercial and industrial environments.As AI applications continue expanding into retail, healthcare, smart manufacturing, and visual computing environments, Shuttle continues to focus on compact and deployment-ready Edge AI platforms designed for different spaces and operational requirements.At COMPUTEX 2026, Shuttle will present Edge AI platforms ranging from compact 1-liter systems to expandable 5-liter AI workstations, supporting workloads including visual AI, intelligent analytics, digital signage, healthcare applications, agentic AI workflows, and industrial automation.Among the featured systems, the DB860 supports multi-display output and rich I/O connectivity for digital signage, retail analytics, and control center applications. The XB860G2 provides PCIe Gen5 expansion capability for GPU and AI accelerator integration targeting advanced visual analytics workloads. The ultra-compact NT20H delivers up to 99 TOPS AI performance for space-constrained edge deployments, while the fanless BPCAR03 industrial platform is designed for smart factory and AIoT environments requiring wide-temperature support and long-term reliability.In addition to hardware platforms, Shuttle will also demonstrate several Edge AI deployment scenarios across commercial and industrial environments during COMPUTEX 2026.Experience the future of Edge AI with Shuttle at COMPUTEX 2026! We warmly invite our industry partners to join us from June 2–5 at the Taipei Nangang Exhibition Center, Hall 2, 4F (Booth R0114). Connect with our team and explore our latest solutions in action. Click here to book your exclusive meeting or download our newest product highlights today!

iCatch Technology announced PAISB (Physical AI Sensor Bridge) - a HSB-aligned Imaging ASIC designed to enable scalable, time-aligned multi-sensor ingest for Physical AI platforms. At COMPUTEX 2026 (June 2–5), iCatch will showcase its latest PAISB solutions at Booth #R0826, Nangang Exhibition Center Hall 2, 4F.As Physical AI systems rapidly evolve, developers are increasingly challenged by the complexity of multi-sensor synchronization, high-bandwidth data ingest, and image quality tuning, which often diverts resources away from core AI development. iCatch's PAISB platform directly addresses this challenge by introducing a hardware-accelerated, HSB-aligned imaging pipeline that enables deterministic, low-latency data transfer into NVIDIA GPU platforms. By offloading sensor ingest, synchronization, and imaging processing into a dedicated ASIC, PAISB allows developers to focus on AI model innovation and system-level applications, positioning iCatch as a key enabler within the NVIDIA Holoscan ecosystem for next-generation robotics, autonomous systems, and Physical AI deployments.At COMPUTEX 2026, iCatch will demonstrate two key PAISB platforms that highlight this capability. The PAISB-E1 (1GbE) can run stereo vision applications on NVIDIA platforms, designed for smart actuators and dexterous robotic manipulation requiring precise depth perception and real-time responsiveness. In parallel, the PAISB-E10 Proto-ES (10GbE) will showcase Tele/Wide imaging with EIS on NVIDIA platforms, targeting humanoid robot edge platforms and robotic factory simulation server environments. These demonstrations illustrate how PAISB enables time-aligned, high-bandwidth multi-sensor streaming while simplifying system integration."PAISB represents a key milestone in iCatch's Physical AI platform strategy," said Weber Hsu, President of iCatch Technology. "As the first HSB-aligned Imaging ASIC, PAISB enables AI developers to focus on model innovation by abstracting sensor-level complexity. We are committed to building the sensor infrastructure layer that accelerates Physical AI deployment across robotics and autonomous systems."iCatch invites industry partners and developers to visit the booth at COMPUTEX 2026 to experience live PAISB demonstrations and explore collaboration opportunities. Learn more about PAISB and Schedule a meeting or request information.