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Analysis: Apple HomeView faces hurdles in smart-home adoption
ICT
10min ago
Synopsys CEO says fully autonomous AI chip design remains out of reach
Semiconductors
22min ago
Samsung, Applied Materials back startup targeting chip packaging warpage
Semiconductors
24min ago
Intel says AI 'gold rush' is over, pushes prompt routing across open hardware
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44min ago
Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystem
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51min ago
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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Thursday 24 September 2026
FSP Debuts World's First 80 PLUS Ruby ATX PSU
As the global wave of artificial intelligence (AI) accelerates, the surge in large language model training and edge-side inference has driven an exponential demand for computational power, bringing unprecedented challenges in energy consumption...
Wednesday 23 September 2026
The Robot in the Supply Chain
Beijing's second annual World Humanoid Robot Games offered a vivid preview of where this technology race is headed. Over five days, more than 2,000 humanoid robots competed across 51 events and over 1,000 individual matches including running, table tennis, soccer participated in an Olympics-style spectacle that doubled as a statement of intent. As the technology race with the U.S...
Tuesday 22 September 2026
GUC Announces 2nm 16 Gbps HBM4E IP
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs. Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS-L
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SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
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Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
TSMC locks in 3-6% wafer out price hikes for 2027
Musk's Memphis move puts xAI at the center of his empire
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
Lite-On unveils 800 VDC power and liquid cooling for AI data centers
Nvidia's Rubin expected to use mostly 12-layer HBM4 despite reported 8-layer shift
Applied Materials tracks 100-plus fabs as cleanroom capacity limits equipment growth
Korean memory makers accept ASML parts price hike, leaving TSMC as the open question
Taiwan suppliers target OCP power, cooling, 1.6T integration
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