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REALTIME NEWS
Xi's US visit stirs alarm over a possible Chinese auto push into America
Electric Vehicles
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Garmin drops Micro LED after 1 year, returns to OLED
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India reportedly probes LG, Samsung over duties on OLED TV display parts
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Sep 23, 17:49
United Renewable Power plans US plant, expands overseas sales and space solar business
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Interview: IMAPS chairman says TSMC’s CoWoS was a key lesson in advanced packaging
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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Wednesday 2 September 2026
Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in an AI multichip package? Interested in knowing how to increase the glass panel size for manufacturing AI multichip packages? If so, visit iCometrue® at Booth M0957, Hall 1, 4F, Taipei...
Wednesday 2 September 2026
Keywave Technology innovative radar sensors spark a smart sensing revolution
Keywave Technology is a fabless semiconductor company founded in December 2022 that specializes in radio frequency (RF) integrated circuit (IC) design and advanced radar sensing solutions...
Wednesday 2 September 2026
Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging
Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands...
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SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
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Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
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MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
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Industrial software giants race to build industry world models
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Microsoft reframes AI ROI calculations, keeps in-house ASICs for internal use
AUO unveils EPS 2030 blueprint linking sustainability to business value
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