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Friday 10 April 2026
STMicroelectronics expands 800 VDC AI datacenter power portfolio with NVIDIA
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced the expansion of its 800 VDC power conversion portfolio with two new advanced architectures: 800 VDC to 12V and 800 VDC to 6V. Developed according to the NVIDIA 800 VDC reference design, these new power conversion stages complement the previously introduced 800 VDC to 50V solution. The rapidly emerging 800 VDC data center architecture enables higher energy efficiency, reduces power losses, and supports more scalable, high compute density, infrastructure for hyperscalers and AI compute."As AI infrastructure compute scale continues to expand fast, it requires higher voltage distribution and greater density, which can only be achieved with system-level innovation for each of the different AI server form factors," said Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group Head of STMicroelectronics' Strategy, System Research and Applications, Innovation Office at STMicroelectronics. "With these new converters for 800 VDC power distribution, ST brings a complete set of solutions to support the deployment of gigawatt-scale compute infrastructure with more efficient, scalable, and sustainable power architectures."A complete 800 VDC ecosystem for the different AI server form factorsThe expansion to 12V and 6V output stages reflects the industry move toward different server architectures requiring different power delivery topologies depending on GPU generation, server height, form factor, and thermal envelope for large-scale training clusters, inference farms, and high-density AI infrastructures. The 50V, 12V, and 6V intermediate DC buses will all coexist in AI data centers depending on rack density, GPU configuration, and cooling strategy.The new 800 VDC to 12V converter enables high-efficiency distribution from rack-level power shelves directly to the voltage domains that feed advanced AI accelerators.The new 800 VDC to 6V path allows OEMs to reduce the number of conversion stages and move the 6V bus closer to the GPU. This reduces copper usage, minimizes resistive losses, and improves transient performance, a critical differentiator for large-scale training clusters.Back in October 2025, STMicroelectronics introduced a fully integrated prototype power?delivery system showcasing a compact GaN?based LLC converter operating directly from 800 V at 1 MHz with over 98% efficiency and exceptional power density in a smartphone?sized footprint exceeding 2,600 W/in³ at 50 V. The three solutions combine ST technologies across power semiconductors (silicon, SiC, GaN), analog and mixed-signal, and microcontrollers. Technical highlights of the new 12V and 6V architecturesDirect 800 VDC to 12V high-efficiency conversion:Eliminates the traditional 54V intermediate stage, reducing conversion steps and system-level losses. Enables higher rack-level efficiency, lower copper usage, and simplified integration for future GPU generations. Includes newly developed high-density power delivery board (PDB) achieving efficiency targets exceeding the sum of previous two-stage conversion paths.800 VDC to 6V architecture for GPU-nearing conversion:Is designed for system builders who require power stages closer to the GPU, minimizing IR drop and improving response under fast load transients.Completes the topology portfolio for servers with ultra dense GPU configurations.Additional technical information at the site.
Thursday 9 April 2026
AI EXPO Taiwan 2026 Sets New Global Benchmark
AI EXPO Taiwan 2026, the premier annual technology event in Asia, concluded with record-breaking success at the Taipei Expo Dome. Organized by DIGITIMES in collaboration with IC Radio Broadcasting, College of Intelligent Computing and Quantum Information of Chung Yuan Christian University, the National Development Council, and the Taipei Expo Foundation, the event’s fifth anniversary marked a historic milestone under the theme "AI·X: Infinite Cross-Domain."AI EXPO Taiwan 2026 saw a staggering 93% year-on-year increase in registrations, surpassing 50,000 attendees. Featuring 300 premier brands and more than 350 enterprise AI solutions and autonomous agents, the event solidified Taiwan's position as the mission control of the global AI supply chain.National Strategy Meets Urban GovernanceThe opening day was graced by Vice President Bi-khim Hsiao and Taipei Mayor Wan-an Chiang, signaling that AI development has ascended to the level of national security and strategic priority.Colley Hwang, Chairman of DIGITIMES and IC Broadcasting, highlighted that Taiwan's electronics industry has reached a staggering output of $1.18 trillion USD. With over 90% of the world's AI servers now manufactured by Taiwanese firms, the nation has solidified its indispensable role at the core of the global supply chain, marking what is currently the strongest era in Taiwan's industrial history.Mayor Chiang highlighted Taipei's leadership as the first city in Taiwan to implement AI governance guidelines, noting that AI-powered municipal services have boosted the efficiency of the 1999 Citizen Hotline by 90%, providing a blueprint for AI-driven urban management.The event also demonstrated powerful momentum through the active participation of various local governments. Chiu Chao-mei, Director of the New Taipei City Youth Bureau, led a cohort of promising startups to showcase their innovations. Meanwhile, Chang Cheng, Director of the Taoyuan City Economic Development Bureau, engaged in high-level exchanges regarding industrial upgrading. Additionally, the Hsinchu County Government organized a professional delegation for an on-site study tour. Together, these initiatives highlight the seamless integration between Taiwan’s strategic tech corridor and the burgeoning AI ecosystem.Market Dynamics: Inference, Autonomous Agents, and Physical AIThe DIGITIMES Research Center revealed a critical shift in computing power toward inference. Global high-end AI server shipments (equipped with HBM) are projected to reach 1.914 million units, representing 67.5% year-on-year growth, as supply chain bottlenecks for components and system assembly continue to ease.Industry leaders identified 2026 as the "Year One" for AI killer applications:AI Agents: Microsoft Taiwan and IBM Taiwan showcased the transition to an era where humans lead and agents execute. Solutions ranging from Dell's "AI Factory" to 91APP's retail agent platform signal that AI has moved beyond proof of concept (PoC) into full-scale commercialization.Physical AI: Advantech and Innodisk demonstrated the integration of Edge AI and robotics, enabling real-time computing and functional safety in industrial environments.Quantum Frontiers:Prof. Ching-Ray Chang, Director of CYCU Quantum Information Center, joined experts from Google and NVIDIA to discuss "Quantum-HPC Integration" and warned of potential "Q-Day" security risks, urging organizations to accelerate adoption of post-quantum cryptography (PQC).Credit: DIGITIMESCross-Domain Synergy: From K-POP to Humanistic ValuesThe expo transcended technical boundaries by merging the entertainment economy with philosophical reflection. Lim Seul-ong, a member of the legendary Kpop group 2AM, appeared as Chief Creative Officer of INIP to discuss how AI and XR are reshaping K-POP's business models.In the realm of content, the "Creator Influence Awards" - jointly organized by DIGITIMES, IC Broadcasting, and DailyView - honored PanSci as "Creator of the Year," recognizing the vital role of scientific literacy in the AI era.The event concluded with a keynote by renowned artist Shih-Yi Yang titled: "This is Not AI: Seeing the Beauty of the Real World." Yang offered a poignant reminder: "Salt crystallizes through the sun; humans find clarity through stillness." He urged the audience to reconsider the value of time in an age where AI maximizes technical efficiency.Looking Forward: Leading the Global WaveFrom "Standing in the Future" in its first year to "Infinite Cross-Domain" in its fifth, AI EXPO Taiwan has evolved into a global catalyst for innovation. AI EXPO Taiwan 2026 proves that Taiwan remains at the heart of AI innovation and global influence. We thank our international partners for their incredible support. We look forward to welcoming you back in 2027 as we continue to push the boundaries of what's possible.
Wednesday 8 April 2026
DEEPX Speeds Physical AI Commercialization: 27 Orders In Seven Months
DEEPX, a Seoul-based fabless semiconductor company developing ultra-low-power AI inference chips for physical AI applications, has secured 27 commercial purchase orders across eight countries within seven months of starting mass production of its first-generation AI chip - a pace that industry observers describe as highly unusual for an emerging fabless company at such an early stage of commercialization.The orders span seven major Physical AI application domains, including robotics, smart factories, edge AI servers, industrial AI, surveillance, AI IT services, and smart cities, with deployments now active across Asia, North America, and Europe.Global Expansion at Unusual SpeedThe ramp-up was slow at first: only two orders came in during the first five months after production began. But the company added 25 additional orders in less than three months in 2026, indicating rapidly accelerating commercial adoption.While some semiconductor startups have achieved limited international shipments, DEEPX's simultaneous expansion across multiple countries and application domains at this pace is highly unusual, according to industry observers. The company's chips are now being deployed across eight countries spanning Asia, North America, and Europe.Early Global Supply Chain ExecutionDEEPX established a global distribution network early in its commercialization phase through partnerships with Avnet, DigiKey, and WPG. Industry analysts note that it is rare for an emerging fabless semiconductor company to secure a global supply chain at such an early stage of mass production.In Europe, DEEPX signed a distribution agreement with Avnet Silica - the European arm of Avnet - establishing a regional supply chain ahead of broader market entry. Avnet Silica has already identified more than 30 prospective customers across high-performance embedded segments including smart city infrastructure, autonomous mobile robots (AMR), machine vision, and smart factories. Both companies are actively expanding purchase contracts as European industrial demand for edge AI inference accelerates.Partner Ecosystem: From Silicon Vendors to AI Software LeadersA key driver of DEEPX's commercial momentum is a cross-industry partner ecosystem spanning semiconductor vendors, industrial computing platforms, and open-source AI software leaders - reflecting a deliberate strategy to position its silicon as an embedded AI standard rather than a point solution.Renesas Electronics: Has integrated DEEPX NPUs into more than three types of industrial boards combining Renesas application processors, delivering solutions applicable to smart factory deployments. The collaboration between a tier-one AP semiconductor company and an AI chip startup has been widely noted as an uncommon signal of hardware ecosystem maturity.Sixfab and Raspberry Pi: Have jointly developed and released an AI HAT module built around the DX-M1, alongside a real-time smart traffic analysis solution using the CES 2026 Best of Innovation-winning 'ALPON X5' AI PC that integrates DEEPX products.AAEON (ASUS subsidiary), IEI, WeLink, Endrich, Toradex, and Lanner: Industrial system developers have deployed customized AI hardware solutions for smart cities, automated logistics, and security systems powered by DEEPX chips, extending the company's reach across diverse embedded application segments.Ultralytics & Network Optix: Ultralytics, developer of the widely-adopted YOLO vision AI model family, has demonstrated 'Open-Source Physical AI Alliance' workloads running on the DEEPX NPU with a one-click deployment flow. Network Optix has validated an intelligent Video Management System capable of managing thousands of camera feeds simultaneously using DEEPX inference.New Products: DX-M1M and DX-AIPlayerAlongside its commercial order momentum, DEEPX has launched two mass-production product lines designed to reduce integration friction for industrial developers across its key markets:DX-M1M (M.2 Module): A standard M.2 form factor module embedding the DX-M1 AI chip, designed to drop into existing industrial PCs and edge servers. The format allows customers to add powerful AI inference capability without redesigning hardware, significantly lowering the barrier to deployment.DX-AIPlayer: An edge AI acceleration solution integrating the DEEPX NPU with a high-efficiency CPU board. Positioned as a 'one-stop' platform covering the full workflow from model development to industrial deployment, the product enables developers to implement vision AI applications without complex integration overhead.Large-Scale Global PoC StrategyThe company attributes its rapid adoption to a large-scale pre-production engagement strategy. In the semiconductor industry, it typically takes 9 to 18 months from PoC initiation to full production deployment in customer applications. To shorten this cycle, DEEPX began working with customers well before mass production began.Over more than one year prior to production, the company collaborated with approximately 350 global companies, supporting proof-of-concept testing and system integration. This approach created a large pipeline of customers already familiar with the silicon and ready to transition into commercial orders once production began.Physical AI Moving from Concept to RealityCEO Lokwon Kim pointed to the growing volume of PoC activity as the clearest signal that physical AI is no longer a forward-looking concept. "Many people still view Physical AI as a concept for the future. But when we look at the growing number of PoC projects with global companies today, it becomes clear that Physical AI is already becoming a reality," he said.On the commercial order milestone, Kim was direct. "Securing 27 commercial orders within seven months is one of the early signs that this transition is already happening in the industry." With distribution in place across Asia, North America, and Europe, and a partner ecosystem spanning silicon vendors, industrial platform makers, and open-source AI software leaders, DEEPX appears positioned to expand its commercial footprint across multiple regions simultaneously. If the current order velocity holds, the company's ambition to establish its NPU as the default physical AI inference chip for embedded developers worldwide may be closer to reality than the industry expected.