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Tuesday 26 May 2026
Shuttle Showcases Intel Core Ultra Edge AI Platforms at COMPUTEX
As generative AI and intelligent applications continue expanding from cloud infrastructure into real-world environments, demand is rapidly increasing for Edge AI platforms capable of delivering real-time computing, low latency, space efficiency, and long-term operational stability. At COMPUTEX 2026, Shuttle Inc. will showcase a series of Edge AI computing platforms powered by Intel Core Ultra processors, highlighting AI-ready edge computing systems designed to accelerate practical AI deployment across commercial and industrial environments.As AI applications continue expanding into retail, healthcare, smart manufacturing, and visual computing environments, Shuttle continues to focus on compact and deployment-ready Edge AI platforms designed for different spaces and operational requirements.At COMPUTEX 2026, Shuttle will present Edge AI platforms ranging from compact 1-liter systems to expandable 5-liter AI workstations, supporting workloads including visual AI, intelligent analytics, digital signage, healthcare applications, agentic AI workflows, and industrial automation.Among the featured systems, the DB860 supports multi-display output and rich I/O connectivity for digital signage, retail analytics, and control center applications. The XB860G2 provides PCIe Gen5 expansion capability for GPU and AI accelerator integration targeting advanced visual analytics workloads. The ultra-compact NT20H delivers up to 99 TOPS AI performance for space-constrained edge deployments, while the fanless BPCAR03 industrial platform is designed for smart factory and AIoT environments requiring wide-temperature support and long-term reliability.In addition to hardware platforms, Shuttle will also demonstrate several Edge AI deployment scenarios across commercial and industrial environments during COMPUTEX 2026.Experience the future of Edge AI with Shuttle at COMPUTEX 2026! We warmly invite our industry partners to join us from June 2–5 at the Taipei Nangang Exhibition Center, Hall 2, 4F (Booth R0114). Connect with our team and explore our latest solutions in action. Click here to book your exclusive meeting or download our newest product highlights today!
Monday 25 May 2026
iCatch Technology Showcases HSB-Aligned Imaging ASIC PAISB at COMPUTEX 2026
iCatch Technology announced PAISB (Physical AI Sensor Bridge) - a HSB-aligned Imaging ASIC designed to enable scalable, time-aligned multi-sensor ingest for Physical AI platforms. At COMPUTEX 2026 (June 2–5), iCatch will showcase its latest PAISB solutions at Booth #R0826, Nangang Exhibition Center Hall 2, 4F.As Physical AI systems rapidly evolve, developers are increasingly challenged by the complexity of multi-sensor synchronization, high-bandwidth data ingest, and image quality tuning, which often diverts resources away from core AI development. iCatch's PAISB platform directly addresses this challenge by introducing a hardware-accelerated, HSB-aligned imaging pipeline that enables deterministic, low-latency data transfer into NVIDIA GPU platforms. By offloading sensor ingest, synchronization, and imaging processing into a dedicated ASIC, PAISB allows developers to focus on AI model innovation and system-level applications, positioning iCatch as a key enabler within the NVIDIA Holoscan ecosystem for next-generation robotics, autonomous systems, and Physical AI deployments.At COMPUTEX 2026, iCatch will demonstrate two key PAISB platforms that highlight this capability. The PAISB-E1 (1GbE) can run stereo vision applications on NVIDIA platforms, designed for smart actuators and dexterous robotic manipulation requiring precise depth perception and real-time responsiveness. In parallel, the PAISB-E10 Proto-ES (10GbE) will showcase Tele/Wide imaging with EIS on NVIDIA platforms, targeting humanoid robot edge platforms and robotic factory simulation server environments. These demonstrations illustrate how PAISB enables time-aligned, high-bandwidth multi-sensor streaming while simplifying system integration."PAISB represents a key milestone in iCatch's Physical AI platform strategy," said Weber Hsu, President of iCatch Technology. "As the first HSB-aligned Imaging ASIC, PAISB enables AI developers to focus on model innovation by abstracting sensor-level complexity. We are committed to building the sensor infrastructure layer that accelerates Physical AI deployment across robotics and autonomous systems."iCatch invites industry partners and developers to visit the booth at COMPUTEX 2026 to experience live PAISB demonstrations and explore collaboration opportunities. Learn more about PAISB and Schedule a meeting or request information.
Friday 22 May 2026
Datotek Unveils AI Storage and Gen5 Active Cooler COMPUTEX 2026
The perfect fusion of the world’s smallest fan and advanced thermal-optimized SSD technology for AI computing applications.Datotek Inc., a provider of high-performance storage and memory solutions, will showcase its latest AI-driven storage technologies at COMPUTEX 2026 in Taipei. As one of the SSD manufacturers and DRAM manufacturers focusing on AI storage innovation, Datotek will present PCIe Gen5 NVMe SSDs, memory modules, portable SSDs, and advanced SSD heatsink innovations designed for AI computing, edge AI applications, and high-performance systems.The company continues to strengthen the integration between AI technologies and high-speed storage architecture. By combining PCIe Gen5 SSD, NVMe SSD, memory modules, and intelligent thermal management technologies, Datotek aims to deliver faster, smarter, and more intuitive storage experiences for creators, professionals, gamers, and AI users.At COMPUTEX 2026, Datotek will present a wide range of AI storage and high-performance computing solutions, including PCIe Gen5 NVMe SSDs, portable SSD solutions, memory module technologies, and SSD heatsink designs optimized for AI PCs, gaming systems, creator workflows, and edge AI environments.New M.2 2280 PCIe Gen5 SSD Active Cooler: 1cm thin with extreme cooling. Credit: Datotek Inc.One of the key highlights of this year's exhibition is the debut of the "ARES AEROFIN" active SSD Heatsink solution, designed for the extreme thermal demands generated by PCIe Gen5 NVMe SSD platforms and AI-intensive workloads. The advanced cooling system combines an ultra-slim active cooling architecture, Skived Fin high-density fin technology, and a micro cooling fan to effectively reduce thermal throttling, maintain SSD stability, and improve long-term system reliability under sustained high-load operation.With an industry-leading thickness of only 1 cm and a lightweight 20 g design, ARES AEROFIN delivers a compact yet highly efficient SSD cooling solution for high-performance PCs, gaming platforms, AI computing systems, and content creation environments. Designed for AI workloads, 8K video editing, AAA gaming, and professional creator applications, the active heatsink significantly improves thermal efficiency while maintaining stable PCIe Gen5 NVMe SSD performance.Exploded view detailing the cooler module's tech & specs. Credit: Datotek Inc.In addition to performance innovation, Datotek continues to advance intuitive AI storage and portable SSD solutions that simplify data management and improve accessibility. By integrating user-centric design with high-speed storage and memory module technologies, the company aims to accelerate the adoption of AI-powered storage in everyday applications.Under intensive operating conditions, Gen5 NVMe SSD temperatures can rapidly increase and impact system stability. Equipped with the ARES AEROFIN heatsink, SSD peak temperatures can be reduced to as low as 42.6°C and stabilized at approximately 38°C during extended operation. This thermal performance enables PCIe Gen5 NVMe SSDs to sustain ultra-high-speed performance of up to 14,000 MB/s read and 12,000 MB/s write speeds without throttling, helping extend SSD lifespan and supporting more sustainable storage operation.Datotek remains committed to its core philosophy of "Technology Innovation" and "Sustainable Development." In addition to advancing SSD, NVMe, PCIe, memory module, and AI storage technologies, the company continues to promote green supply chain practices, intelligent cooling innovation, and environmentally responsible product development. Moving forward, Datotek will collaborate with global ecosystem partners to accelerate smarter and more sustainable digital transformation in the AI era.Visitors are welcome to explore Datotek's latest AI storage, PCIe Gen5 NVMe SSD, portable SSD, memory module, and advanced SSD heatsink innovations at Booth I1124, Taipei Nangang Exhibition Center, from June 2-5, 2026 during COMPUTEX 2026. For more information, please visit Datotek Official Website and Datotek Facebook Page.