At COMPUTEX 2025, ASUS showcased its comprehensive AI infrastructure solutions, targeting the computing needs of data centers, edge computing, and a wide range of intelligent applications. With a robust product portfolio, ASUS brings to life the NVIDIA AI Factory vision, illustrating how AI will be deeply embedded into enterprise IT infrastructure. This evolution continues to drive forward applications and services that shape the future of AI and high-performance computing

Linxens, a global leader in component-based solutions for authentication and traceability, and Dracula Technologies, a pioneer in ambient light energy harvesting, have announced a strategic collaboration to develop next-generation autonomous IoT solutions for traceability and smart labelling applications. This collaboration paves the way for smarter and more sustainable connected devices

Technology news, product launches and show highlights from the event attendees available for download (PDF).

HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable again after use, as well as manage the packaging logistics of high-quality industrial products. They do so for clients in the semiconductor and other high-tech industries.The process procedures and packaging solutions ensure the parts, modules or components of highly sophisticated equipment are fully protected during transportation and logistical arrangements. And at the same time, the system will meet the customer demand for protection of valuable products during transit while adhering to environmental, social, and governance (ESG) principles. The packaging design incorporates features like sustainable materials, waste reduction strategies, and carbon footprint minimization, alongside ensuring the integrity of high-value goods through robust physical protection.The company provides complete packaging solutions, starting with the development and sourcing of customized packaging materials. HQ Pack's regional Service Centers ensure that reusable packaging materials are ready to use again by cleaning and repairing them to like-new condition. They can also support reuse of parts by harvesting them before scrapping for new build packaging. If there is material destined for waste management, HQ Pack supports this at the same time. Because most of its high-tech clients operate on a global scale, HQ Pack operates not only at its headquarters in Eindhoven, the Netherlands, but also in Johor and Penang in Malaysia, Taiwan, Singapore, Germany, and in the United States (locations in Brookfield (CT), Newark (CA), and San Diego (CA)) providing the same quality and service at each location. With their Service Centers they support both their customers' sustainability goals as well as their own.Their slogan "We Create to Protect" is exactly what they do. The high-quality packaging solutions ensure that valuable and fragile products, modules, components and/or parts can be safely transported worldwide. With over 40 years of experience and global presence, no compromission on quality, flexibility at the heart of our organization, they are a full-service provider with fast, reliable and sustainable packaging solutions.

Founded in 1993, Prodrive Technologies designs and manufactures mission-critical products that combine advanced engineering, innovative manufacturing, and global expertise. The company empowers semiconductor equipment manufacturers and customers across multiple industries to accelerate innovation and achieve operational excellence.Headquartered in the Netherlands, with regional hubs in the USA, Japan, and China, Prodrive Technologies serves the semiconductor, medical, life sciences, energy, infrastructure, and industrial markets. Its customer-centric approach, deep engineering expertise, and vertically integrated manufacturing enable fast time-to-market, superior quality, and scalable systems.The company's portfolio spans optical and e-beam cameras, embedded computing systems, high-precision motion control and drives, and RF plasma power solutions. These offerings are available as off-the-shelf products, customized systems, or turnkey solutions.With its broad product range, flexible business model, and decades of experience in the semiconductor sector, Prodrive Technologies is now also exploring opportunities in Taiwan. As home to the world's largest semiconductor foundry and a growing ecosystem of equipment manufacturers, Taiwan represents a potentially strategic market where Prodrive's innovation, quality, and speed-enabled by its unique vertical integration-can create significant value.

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In addition to its headquarters in the Netherlands, the company has operations in Singapore and China Suzhou. The key technologies of Boschman are silver sintering and Film Assisted Molding (FAM). Boschman uses a pressurized silver sintering process in module packaging to address the stringent challenges and difficulties of power module interconnect technology.The power module market is experiencing substantial growth in Europe and China, driven by the accelerating adoption of electric vehicles (EVs), expansion of renewable energy systems, and increased demand for energy-efficient industrial and consumer electronics. The power modules require sophisticated packaging for high-temperature, high-power, and high-reliability connections. The FAM technologies for protection against harsh environments like high humidity and vibration, as well as to manage thermal and electrical stress. On the other hand, silver sintering offers superior thermal and electrical conductivity compared to traditional soldering process, while FAM with its vacuum-assisted films prevents voids during molding, leading to more reliable and high-performing power modules with better thermal management.Boschman began its journey by developing and manufacturing module packaging molds, then expanded into the research and development of silver sintering packaging equipment. And the company continues to invest in and develop advanced packaging technologies. Boschman specializes in serving the global electronics assembly and semiconductor back-end packaging industries, providing advanced sintering equipment using advanced high-pressure sintering technology. Specifically tailored to the needs of customers of varying sizes and production scales, Boschman's sintering equipment offers a variety of solutions suitable for R&D doing small batches, small- to medium-volume pilot production, and large volume manufacturing environments.Boschman has many years of experience in cooperation with Taiwanese industries, especially in power electronics and components manufacturing service vendors that provide power management, power electronics, and thermal solutions. Among the new business opportunities, OSAT (Outsourced Semiconductor Assembly and Test) companies serve a broad range of semiconductor clients, is one of the key types of customers in Taiwan for Boschman. OSAT customers are providing back-end packaging services such as Tire Pressure Monitor Sensors (TPMS) and other automotive sensors for customers, which has enabled Boschman to gain the benefits.Talking about the business model, Boschman provides customers with packaging design and development, as well as silver sintering process equipment to meet the needs of the automotive supply chains and power system industries. It also provides design proofing and small-batch assembly production services to customers. One more thing, Boschman and Powertrim Technologies, another Dutch company exhibiting at the Netherlands Pavilion, have a collaborative upstream and downstream relationship. These two companies collaborate in the manufacturing of automotive and power module systems in Europe, jointly serving leading Auto and industrial customers.