DATOTEK INTERNATIONAL CO., LTD., a Taiwan-based memory and storage manufacturer, showcased its latest AI-powered sustainable storage solutions and AI infrastructure technologies at COMPUTEX 2026 in Taipei under the exhibition theme "AI Together." The company presented a comprehensive portfolio of AI storage, edge AI computing, PCIe Gen5 SSD thermal management, USB4 portable SSDs, and next-generation memory products designed for both enterprise and consumer markets

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers

Technology news, product launches and show highlights from the event attendees available for download (PDF).

MSI, a global leader in high-performance computing and industrial solutions, returns to COMPUTEX 2026 (Booth #J0605a) to unveil its strategic AI roadmap. This year's showcase centers on a seamless continuum from data center scale to autonomous edge execution, featuring liquid-cooled AI platforms and supercomputers built on NVIDIA MGX, NVIDIA DGX Station, and NVIDIA DGX Spark architectures.Cloud Foundation: Liquid-Cooled Infrastructure for Hyperscale AITo meet the demands of modern AI data centers, MSI is introducing high-density platforms that prioritize thermal efficiency and performance: CG681-S6093 6U Liquid-Cooled AI Server (based on NVIDIA MGX): Built on NVIDIA MGX architecture, this server supports dual AMD EPYC processors and up to eight NVIDIA RTX PRO 6000 Blackwell Server Edition Liquid Cooled GPUs. It delivers the compute density required for large-scale AI inference - with support for a wide range of agentic, physical AI, scientific computing, simulation, graphics, and video workloads.High-Speed Connectivity: The platform is equipped with NVIDIA ConnectX-8 SuperNICs, providing up to 8×400Gbps Ethernet connectivity for distributed AI environments.    Rack-Scale Scalability: MSI's liquid-cooled rack-scale architecture supports up to four CG681-S6093 GPU systems within a 48RU configuration. Networking is anchored by NVIDIA Spectrum-4 SN5600 Ethernet switches and SN2201 out-of-band switches for high-performance AI cluster connectivity.Deskside Development: The Desktop AI SupercomputerBridging the gap between the data center and the developer's desk, MSI presents high-performance AI computing for local workflows: XpertStation WS300 (NVIDIA DGX Station): Powered by NVIDIA GB300 Grace Blackwell Ultra Desktop Superchip with up to 748GB coherent memory and 7.1TB/s HBM3e bandwidth, supporting Windows-based AI development while enabling high-speed CPU-GPU data sharing for large AI models and data-intensive workflows.Efficient AI Refinement: The WS300 is designed for AI model development, fine-tuning, and inference, utilizing a compact, liquid-cooled design with dual 400GbE networking powered by NVIDIA ConnectX-8 SuperNICs to sustain peak performance. (Recently showcased at GTC Taipei).Edge Execution: EdgeXpert and Autonomous IntelligenceMSI is bringing data center-level performance directly to real-world environments through the debut of its edge supercomputing platform: EdgeXpert AI Supercomputer: Built on the NVIDIA DGX Spark platform, EdgeXpert enables enterprises to deploy smarter, faster, and more scalable AI agents and applications at the edge.OpenClaw/Hermes Agent on MSI EdgeXpert: MSI showcases prominent AI Agent frameworks, providing open-source Agentic AI structures that support sustainable local operations and self-optimization capabilities.EU CRA Compliant Agentic AI with Galene Elettra: Powered by a Multi-Agent System (MAS), this solution enables intelligent decision-making across complex workflows while maintaining compliance with the European Cyber Resilience Act (CRA). Legal AI Suite: A specialized platform for enterprise AI, streamlining legal research, document analysis, and IP governance. Smart Campus Patrol: The Smart Campus Patrol Vehicle demonstrates real-time computer vision for precision inspection and smarter industrial operations. Tarot AI Experience with Reachy Mini: An interactive demonstration of Agentic AI, blending robotics with generative AI to deliver personalized engagement. End-to-End AI in Action Across IndustriesMSI delivers purpose-built Edge AI solutions developed with leading industry partners across diverse vertical markets:Smart Manufacturing & Semiconductor:The Edge AI Box MS-C910E with Memorence AI enables real-time machine vision. Partnering with Qiming Tech, MSI leverages the Edge AI Box MS-C939 to deliver real-time, high-precision automated optical inspection (AOI) to optimize semiconductor production yield.Voice AI & Driver Safety: Powered by Ubestream, the Slim Box MS-C926 provides real-time translation, while the Embedded Box MS-C927 enables instant voice-to-order experiences for retail. For driver safety, the In-vehicle Box MS-C932 runs real-time AI Driver Fatigue Detection to enhance on-road security.Smart Transportation & Precision AgricultureIntegrating edge inference with frontline mobility and field operations, MSI optimizes commercial transit and smart farming workflows:Smart Transportation × AI Vision Solutions:MSI is expanding its smart transportation portfolio with mobility solutions powered by Edge AI and in-vehicle vision. The lineup features fleet management tablets, telematics boxes, smart rearview mirrors, and AI-enabled ADAS and DMS systems for fleet monitoring and video analytics. Utilizing real-time AI processing, MSI helps logistics and fleet operators improve management efficiency and strengthen road safety.Smart Agriculture & Drone Integration: MSI introduces an intelligent agricultural solution that seamlessly integrates autonomous drone technology, Edge AI computing, and ground control systems.Built for harsh environments, this comprehensive platform combines drone ground control stations, rugged tablets, T-Box connectivity modules, and centralized multi-drone management platforms. It is engineered for critical use cases including automated field inspection, precision spraying, crop monitoring, and pest/disease identification. By leveraging real-time video analytics, edge inference, and cloud data synchronization, the solution empowers agricultural operators to boost efficiency, streamline operational workflows, and accelerate the transition to smart farming.Extreme Field Mobility (MS-NE21): The NE21 Rugged Industrial Tablet features an Intel 13th Gen Core i Series (Raptor Lake-U) processor, supporting up to 32GB LPDDR5/LPDDR5X memory and 2TB PCIe SSD. Built to MIL-STD-810G standards with an IP65 rating, it survives 4-foot drops and functions from -10°C to 50°C. It offers a 650-nit sunlight-readable 11.6" display with glove/wet-touch modes and a continuous hot-swappable battery system (64Wh to 98.1Wh).Industrial Panel PCs & Robust Hardware FoundationTo support heavy enterprise workloads, MSI highlights its high-reliability industrial hardware portfolio:Industrial Panel PCs: Features include the MS-1A81 (21.5") for Smart Healthcare clinical workflows; the MS-1A22 (12.1") and MS-1A32 (15") for factory floor monitoring; and the MS-1A91 (10.1") and MS-OP01 (15.6") for secure Smart Locker Systems.Hardware Backbone: For multi-industry infrastructure durability, MSI showcases its robust hardware portfolio featuring the Intel Wildcat Lake, NXP, and NVIDIA Jetson Thor series platforms, alongside industrial 4U rackmount systems.Sustainability & EV Charging InfrastructureBringing intelligent infrastructure to the energy transition, MSI presents its smart EV charging solutions:Eco Series Home EV Charger: Awarded the Taiwan Excellence Award, this residential smart charger delivers up to 22kW three-phase output. Powered by NXP industrial MCUs and AI smart control, it integrates with solar storage. Featuring a UL94-V0 fire-rated enclosure (extinguishing over-heat sources in 10 seconds) and RDC-DD leakage detection for underground parking safety, it holds global safety certifications, RPC certification in Taiwan, and $5M USD product liability insurance.MSI Hyper 80 Dual Fast Charger: Designed for urban commercial hubs, this DC fast charger delivers 80kW power distribution within an industry-leading 30cm ultra-slim chassis to maximize space efficiency.Visit MSI at COMPUTEX 2026, Booth #J0605a, Hall 1 (1F), to experience the future of the cloud-to-edge AI ecosystem.Credit: MSICredit: MSI

JMicron Technology Corp., a global leader in high-speed Bridge IC solutions, today announced it will unveil its flagship innovations at COMPUTEX 2026. Building on years of proven expertise in high-speed interface technologies and strong market recognition, JMicron will present a portfolio centered on extreme performance, intelligent backup, and hyperscale expansion, demonstrating its continued momentum in advancing the digital storage ecosystem.In response to the stringent demands for performance and data protection in big data and professional storage markets, JMicron introduces three key controllers: JMS591, JMS591U, and JMB595.JMS591 is purpose-built for multi-bay HDD array applications, supporting USB 20G and eSATA interfaces. In RAID 0 mode, it delivers read/write performance exceeding 2000 MB/s, providing a powerful foundation for NAS and DAS systems.JMS591U targets enterprise and professional users, integrating JMicron's exclusive Offline Clone & Erase technology. It enables 1-to-4 high-speed duplication and DoD-compliant data sanitization, offering a one-touch solution for data migration and security compliance.JMB595 is a high-performance PCIe Gen4 x4 to 16-port SATA III expansion controller. Through cascading architecture, it can scale to connect up to 240 storage devices, ideally suited for hyperscale data centers and surveillance storage infrastructures."JMicron has long been committed to transforming complex high-speed transmission technologies into intuitive and powerful hardware solutions," said Ming-Cheng Lin, VP of Sales and Marketing at JMicron."The products showcased at COMPUTEX not only push storage performance beyond the 2000 MB/s milestone, but also precisely address customers' critical needs in large-capacity storage and security compliance through integrated RAID engines and offline cloning technologies. We are not merely a chip supplier—we are a strategic partner helping customers build a solid foundation in the data-driven era."JMicron cordially invites global partners and media representatives to visit its booth at COMPUTEX 2026. Through face-to-face engagement and forward-looking technology demonstrations, JMicron looks forward to exploring the future of storage innovation together and ushering in a new era of high-efficiency data transmission and intelligent data management.

As AI data center rapidly scales toward the gigawatt (GW) level, energy management is evolving from a supporting function into a defining strategic pillar. Against this backdrop, Infineon Technologies is redefining power infrastructure of AI era through its comprehensive "From Grid to Core" strategy, integrating energy efficiency, power density, and system resilience from the electrical grid to the processor core.Scaling AI: Strategic Power Solutions MatterThe evolution of artificial intelligence (AI) has accelerated far beyond the trajectory once predicted by Moore's Law. As AI models continue to expand in parameter scale and real-time inference becomes increasingly critical, demand for computing power is rising at an unprecedented pace.Today, the power consumption of a single GPU is rapidly approaching the kilowatt level, and the power density of a server rack has increased significantly from less than 60kW in the past to exceeding 100kW, now moving toward a new threshold in the megawatt range.This is not just numerical growth; it represents a fundamental shift in power architecture. As AI computing clusters expand rapidly, traditional 48V busbars and AC power distribution architectures are quickly approaching their physical limits in terms of power loss, thermal management, and spatial constraints.Adam White, President of Infineon's Power & Sensor Systems Division, emphasized that future competition in AI infrastructure will no longer be limited to chip performance. Instead, it will be a cross-disciplinary integration battle encompassing power electronics, materials technology, and system architecture.From Grid to Core: Rethinking the power delivery architectureAt this critical turning point for the industry, Infineon's competitive advantage lies not in a single breakthrough product, but in its ability to orchestrate and optimize the entire power delivery chain at the system level."From Grid to Core" is more than a product strategy - it is a multi-phase architectural framework designed to reshape the future AI energy chain. Developed through early collaboration with global hyperscalers and ecosystem partners, the strategy enables Infineon to address evolving AI power demands across every phase of infrastructure, from utility grids to processor-level power management.Power grid: Enabling a sustainable, high-efficiency power with HVDCAt the front end of the data center, power infrastructure is transitioning from traditional mechanical systems to highly integrated solid-state solutions. Future AI facilities are expected to increasingly adopt decentralized DC microgrids, enabling greater efficiency, flexibility, and resilience in energy management.By leveraging silicon carbide (SiC) technology in solid-state transformers (SSTs), system weight can be dramatically reduced - from nearly 20 tons to approximately 500 kilograms—while simultaneously improving overall energy efficiency by more than 1%. Beyond optimizing space utilization and operational costs, this advancement signals a broader industry migration from electromechanical infrastructure toward semiconductor-driven power systems.As SSTs and related technologies become integrated into AI power infrastructure, a multi-billion-dollar semiconductor opportunity is emerging across next-generation energy systems.At the same time, the power grid is evolving beyond its traditional role as just an energy source. Through digitally controlled power systems with real-time monitoring and remote management capabilities, combined with solid-state circuit breakers (SSCBs) featuring microsecond-level response times, the grid is becoming an intelligent energy platform capable of continuous optimization and predictive management.Server rack: Reshaping power density and maximizing efficiencyAs data centers advance toward GW-scale deployments, power distribution architecture is undergoing a fundamental redesign. Infineon is driving the industry's transition from traditional 48V systems to ±400V and 800V high-voltage DC architectures. Through the design of three-phase power sidecars, Infineon is restructuring power supply and computing systems to establish a more efficient and flexible power distribution model.At the same time, the power architecture of AI data centers is following a clear evolutionary path: moving from integrated server rack designs to high-voltage DC and sidecar power supply configurations, and ultimately advancing to gigawatt-scale infrastructures that incorporate DC microgrids.Meanwhile, The high-frequency characteristics of gallium nitride (GaN) components enable intermediate bus converters (IBCs) to achieve over 98% conversion efficiency and exceptionally high power density in an extremely compact form factor, significantly reducing power transmission losses and freeing up more space for AI computing resources.Processor core: Power density and new architectures for next-gen AI computeAt the processor core—the final stage of power delivery—the challenge shifts toward managing extreme current density and ultra-fast transient response.To support next-generation GPUs requiring massive current delivery and rapid load transitions, Infineon has introduced a digital multiphase PWM controller alongside the industry's first TLVR four-phase power module. These technologies are engineered to provide highly stable, efficient, and responsive power delivery for AI processors operating under increasingly demanding workloads.In response to the next generation of GPUs demanding ultra-high current and rapid load changes, Infineon has introduced digital multiphase PWM controllers and the industry's first TLVR quad-phase module. By leveraging high-precision telemetry and digital control technologies, power systems have transformed from energy suppliers into intelligent platforms capable of real-time monitoring, prediction, and optimization.From AI data center to physical AIIf data centers form the foundation of AI computing power, the physical world will be where AI's true value is ultimately realized. As AI increasingly expands into humanoid robots, autonomous systems, and intelligent manufacturing equipment, demands for energy efficiency, real-time responsiveness, and system reliability will become even more critical.Infineon is extending its long-established expertise in power management beyond data centers into the emerging era of Physical AI. By integrating sensing technologies, actuate, security and connectivity solutions, and high-efficiency power modules, the company is enabling a comprehensive functional blocks that empower humanoid robots to perceive, think, act and connect, safely and secured in a real-world environment.Push the boundaries of power technology in AI era"We Power AI" is not just a slogan for Infineon—it is a concrete commitment to the future of the industry. From gigawatt-scale data centers to physical AI, Infineon continues to push the boundaries of power technology, ensuring that every watt of energy is transformed into the greatest possible value for AI.As the industry advances toward the next generation of computing, energy management will become the decisive key to truly unlocking the full potential of AI. In this wave of transformation, Infineon is joining forces with ecosystem partners to stand at the forefront of defining the future.Editor's Note: Adam White will deliver a keynote address at COMPUTEX 2026 on June 4 titled  "Infineon Powering AI from Grid to Core to Physical AI."  The session will explore emerging trends and strategic opportunities in power infrastructure of AI era.Credit: Infineon