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China’s IC designers expand AI interconnect efforts as Montage grows in DDR5 and TWSC targets CXL
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Nvidia emerges as AI industry’s central bank amid cloud startup risks
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Apple reportedly plans high-end HomeView with robotic arm
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Rising memory costs push smartphone makers from LTPO to LTPS panels
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Qiyi Technology’s Arizona fab projects drive order backlog to NT$4.476 billion
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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Wednesday 14 October 2026
Practical Insights & Industry Ideas
How can AI become more powerful and, at the same time, more energy-efficient? How is the electronics industry adapting to new cyber resilience requirements? And what is driving the All Electric Society forward? electronica 2026 provides answers to these questions not only in the exhibition area of its 18 exhibition halls, but also through its extensive supporting program...
Tuesday 13 October 2026
Chenbro unveils AI rack-level solutions at 2026 OCP Summit
Chenbro, a leading professional server chassis manufacturer, announced today its participation in the OCP Global Summit 2026, taking place from October 13 to 15 in San Jose, California...
Thursday 8 October 2026
Nuvoton, AMI Empower AI Factories Via Arbel NPCM8XX OpenBMC
As global AI infrastructure investments continue to accelerate, OEMs, ODMs, and hyperscale cloud providers are seeking secure, scalable, and production-ready OpenBMC platforms that can shorten development cycles and accelerate deployment...
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SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
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Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
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K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
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TSMC locks in 3-6% wafer out price hikes for 2027
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GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
Sony keeps chip unit as imaging sensors, TSMC partnership drive strategy
How ByteDance, Alibaba, Tencent are testing the boundaries of US AI chip restrictions
PCB material shortages persist as capacity expansion extends beyond 2029
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