As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security. The rapid expansion of high-bandwidth memory (HBM) production continues to consume advanced fabrication capacity, constraining the supply of conventional memory products and creating persistent shortages across the market. This concentration of high-end production has widened the supply-demand gap, driving the average selling prices of certain premium memory products to levels eight to ten times higher than previous norms

DATOTEK INTERNATIONAL CO., LTD., a Taiwan-based memory and storage manufacturer, showcased its latest AI-powered sustainable storage solutions and AI infrastructure technologies at COMPUTEX 2026 in Taipei under the exhibition theme "AI Together." The company presented a comprehensive portfolio of AI storage, edge AI computing, PCIe Gen5 SSD thermal management, USB4 portable SSDs, and next-generation memory products designed for both enterprise and consumer markets

Technology news, product launches and show highlights from the event attendees available for download (PDF).

Henkel Adhesive Technologies today announced the launch of Loctite ABLESTIK CDF900, its next-generation conductive die attach film (cDAF) series, at SEMICON Taiwan 2026. Delivering thermal conductivity exceeding 8 W/m-K, the new material is designed to help semiconductor manufacturers overcome rising thermal and stress challenges in AI, 5G and emerging 6G telecommunications, and high-performance computing (HPC) applications.As AI, HPC, and next-generation communications drive higher chip frequencies, greater thermal design power, and more complex package architectures, efficient heat dissipation and stress control have become critical to device performance and reliability. Loctite ABLESTIK CDF900 addresses these challenges by combining high thermal conductivity with the precision and process consistency of a film-based die attach format.Technical Breakthrough for High-Performance AI Packaging"Henkel is a global leader in conductive die attach film, with technology widely adopted in Wi-Fi communications, automotive electronics, and power devices. Today, Loctite ABLESTIK CDF900 pushes thermal performance to new heights while expanding applications into large-die packaging scenarios such as processors and AI chips. This offers customers broader design flexibility and superior thermal management solutions," said Kaihua Zhou, Head of Market Strategy for Semiconductor at Henkel Adhesive Technologies Electronics.The core breakthrough of Loctite ABLESTIK CDF900 lies in its proprietary thermal filler technology, which substantially increases thermal conductivity to more than 8 W/m-K. This enables high-power components in mobile phones, processors, and Wi-Fi equipment to dissipate heat efficiently and maintain stable performance in demanding operating environments.Compared with competing liquid die attach adhesives, Loctite ABLESTIK CDF900's film-based format helps eliminate the risks of material bleed-out and non-uniform bondline thickness. This enables chip designers to achieve smaller, more precise die footprints within constrained spaces while enhancing overall package reliability and robustness.Complete Material Solutions to Address Stress Challenges in AI Advanced PackagingTo address warpage during processing and component stress issues inherent in large-die advanced packaging, Henkel continues to expand its material portfolio. The company has developed high-thermal-conductivity liquid molding compounds, high-performance capillary underfills, and diverse packaging material platforms to meet requirements for efficient heat dissipation, high reliability, and process flexibility. By reinforcing structural strength, toughness, and adhesion, Henkel's materials help mitigate stress imbalances while meeting the stringent reliability and high-volume manufacturing stability requirements of high-end AI packaging.At SEMICON Taiwan 2026, Henkel will present its complete portfolio for critical advanced packaging applications, including underfill, conductive die attach film, liquid molded underfill, and non-conductive liquid adhesive technologies.Kevin Becker, Senior Vice President of Product Development and Engineering, added, "These solutions support board-level to wafer-level packaging, low to high thermal conductivity applications, and small to large die footprints. Leveraging its comprehensive product portfolio, global R&D resources, and localized technical support, Henkel empowers customers to improve thermal performance, package reliability, and mass-production readiness in advanced package designs, while providing vital material support for the next generation of AI development."Global Footprint and Multi-Site Support Deliver Supply Chain ResilienceAmid geopolitical shifts and global expansion, semiconductor supply chain resilience has become a priority in international procurement decisions. Henkel has established a robust multi-site support network and operates manufacturing facilities across North America, Europe, and Asia, with established production and technical support hubs in Taiwan, South Korea, China, Japan, and Southeast Asia. Flexible backup production sites enable localized, real-time support to meet global customers’ capacity expansion and procurement flexibility needs.Sustainability Commitment: Advancing Circularity in Semiconductor MaterialsSustainability is a core value at Henkel. In material R&D, the company has pioneered the integration of eco-friendly product design methodologies. For example, Henkel is collaborating with partners to advance circular economy practices, including the use of silver powder from recycled silver, a precious metal widely used in semiconductor packaging. Henkel is committed to working hand in hand with industry partners to reduce carbon emissions and minimize resource waste.Visit Henkel at SEMICON Taiwan 2026During SEMICON Taiwan in September, Henkel will present its full suite of material solutions for advanced packaging and high-performance semiconductor applications in Room 404, Hall 1 of the Taipei Nangang Exhibition Center. The company will showcase its technical capabilities across AI infrastructure, HPC, next-generation communications, and Edge AI.The hospitality suite will feature a variety of interactive experiences, creating opportunities for customers and industry partners to engage directly with Henkel's technical experts. Together, participants will explore innovative solutions for advanced packaging, including thermal management, reliability enhancement, stress mitigation, and readiness for high-volume manufacturing. Through collaboration and knowledge exchange, Henkel continues to support the semiconductor industry's progress toward higher performance, greater reliability, and enhanced resilience.Details about Henkel consumer electronics materials are available here, and information about its semiconductor solutions can be found here.LOCTITE is a registered trademark of Henkel and/or its affiliates in the USA, Germany and elsewhere.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that its Board of Directors has approved a resolution to repurchase and fully cancel 40 trillion won worth of its own shares. The Company also revealed plans to return "over 50% of cumulative Free Cash Flow (FCF)" generated during the program period (2025-2027), adopting a framework centered on the parallel execution of share repurchases and cancellations alongside cash dividends.Following the Board meeting held earlier today, the Company formally disclosed the share repurchase and cancellation resolution along with the shareholder return plan via a regulatory filing.The decision stems from the assessment that the Company's intrinsic value—underpinned by its business competitiveness, robust cash generation capability, and mid-to-long-term growth potential—is not fully reflected in its current stock price.SK hynix continues to record record-breaking financial performance, maintaining its leadership in the AI memory market. As of the end of the second quarter of this year, the Company's net cash stood at approximately 69 trillion won, demonstrating significantly improved cash generation capability.The total planned amount for the share repurchase is 40 trillion won. Based on the closing stock price of 1,662,000 won on the day prior to the Board resolution, this represents approximately 24.07 million shares, or about 3.3% of total issued shares (730,492,365 shares). The repurchase period is scheduled to run for approximately three months starting August 20, with all repurchased shares set to be cancelled upon completion of the acquisition.This initiative accelerates the execution of the existing shareholder return program ahead of schedule. In November 2024, SK hynix announced a program to execute shareholder returns within the range of 50% of its three-year (2025-2027) cumulative FCF, noting that it would consider early execution prior to the program's expiration if FCF increased meaningfully due to improved operational performance.The 40 trillion won program marks the largest treasury share cancellation ever conducted by a South Korean listed company. The Company noted that progress toward its financial health targets remains on track, affirming its commitment to maintaining a stable financial structure while delivering sustained shareholder value.Through today's regulatory filing, SK hynix announced plans to pursue an expansion of its total shareholder return target from the previous "within 50% of cumulative FCF" to "over 50% of cumulative FCF". Under the framework, shareholder returns will be executed through a dual-track approach running share repurchases/cancellations alongside cash dividends, while options to expand payouts—including the existing fixed dividends and special dividends—are also under consideration.SK hynix emphasized that it intends to pursue additional shareholder returns within the program period through the parallel execution of share repurchases/cancellations and dividends, by taking into account cash flows, market conditions, and distributable profits, adding that specific details regarding scale and execution will be announced following Board approval at the time of its third-quarter earnings release.

The AI industry is entering a new phase centered on inference efficiency and agentic deployment. As AI search, enterprise copilots, autonomous driving, embodied intelligence, AI PCs, AI smartphones, and multi-agent collaboration accelerate, the token has evolved beyond a simple unit for measuring model calls to become a core metric for AI infrastructure efficiency, cost structure, and production capacity. Amid this shift, the value of memory and storage is being redefined.From model loading and KV cache to RAG, vector retrieval, long-context inference, and data accumulation, every critical stage of AI inference and application depends on memory and storage that are high-performance, highly reliable, low-latency, and built to scale sustainably. AI memory and storage are evolving from back-end data repositories into core foundations underpinning token generation, caching, retrieval, scheduling, and data accumulation.At the same time, AI workloads are extending from cloud data centers to edge nodes and end devices, giving rise to a new paradigm of coordinated cloud-edge-device evolution. Breakthroughs in AI-era memory and storage will no longer come from single-point performance gains alone, but from system-level collaboration, ecosystem integration, and supply chain resilience; industry collaboration is moving beyond linear upstream-downstream supply relationships toward a new paradigm of deep alignment and shared growth, built around cloud-edge-device workload demands, joint product definition, scenario validation, supply security, and shared value creation.Against this backdrop, the 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026), themed "The Future Built on AI Memory and Storage," will be held on September 22–23, 2026, in Shenzhen, China. Rooted in the memory and storage supply chain and geared toward new AI infrastructure and cloud-edge-device scenarios, the summit will bring together leading voices across the ecosystem, including players in wafer manufacturing (IDMs), controllers, modules, OSAT, equipment and materials, servers and systems, AI computing, AIDC, cloud services, smart terminals, automotive electronics, and embodied intelligence, along with investment and academia institutions, to explore the trends, demands, and collaborations shaping memory and storage in the AI era.Summit Topics: Exploring New Variables in the Token Economy through the Lens of AI Memory and StorageCentered on the memory and storage industry chain and framed through the lens of the token economy, GMIF 2026 will build a cross-sector exchange platform around AI infrastructure efficiency, cloud-edge-device application expansion, industry ecosystem collaboration, and capital value reassessment.Token Economy: Redefining the Value of Memory and Storage for AI. Examining how memory and storage are evolving beyond capacity resources into critical infrastructure for Token-driven AI, with a focus on AI inference, KV cache, vector retrieval, RAG, long-context inference, and data persistence.Token Economy: Redefining the Value of Memory and Storage for AI. Examining how memory and storage are evolving beyond capacity resources into critical infrastructure for Token-driven AI, with a focus on AI inference, KV cache, vector retrieval, RAG, long-context inference, and data persistence.Cloud-Edge-Device Collaboration: Extending AI Memory and Storage Across New Application Frontiers. Exploring the upgrade of memory architectures and product innovation opportunities driven by diverse AI-demanded scenarios, including AI data centers, edge inference, AI PCs, AI smartphones, AI glasses, intelligent vehicles, embodied intelligence, and multi-agent systems.Global Landscape: Building an Open, Resilient Ecosystem Together. Addressing shifting global industry dynamics and supply chain restructuring, with a focus on data governance, supply diversification, regional collaboration, and long-term sustainability.Industry Capital: Unlocking the Long-Term Value of AI Memory and Storage. Bringing together investment institutions, industry funds, securities firms, listed companies, and innovative enterprises to jointly assess industry cycles, capital logic, and long-term value.Centered on the Memory and Storage Industry Chain, Connecting the New AI Infrastructure EcosystemAs a leading global platform for the memory and storage industry, GMIF connects wafer IDMs, controllers, modules, OSAT, equipment and materials, terminal companies, and channel partners to drive technical exchange and ecosystem collaboration.GMIF connects IDMs, OSAT, controllers, cloud, equipment, & terminals for memory. Credit: SMIAFor 2026, GMIF expands further into compute providers, cloud and AIDC services, large model platforms, the RAG/agent-layer, smart terminals, automotive electronics, and embodied intelligence, strengthening ties between memory & storage and AI infrastructure across cloud, edge, and device.Summit Programs: Keynotes, Rankings, and a Closed-Door Investment ForumThe summit combines keynotes, roundtables, supply-demand matchmaking, product showcases, industry rankings, awards, and global livestreaming.GMIF Innovation Summit (main forum): keynotes from leaders in memory and storage, computing, cloud services, terminals, academia, and investment, focused on AI memory and storage technology, market opportunities, cloud-edge-device expansion, and token efficiency.AI Industry and Investment Forum: a closed-door, invitation-only session on AI memory and storage, enterprise SSDs, compute infrastructure, edge and on-device AI, advanced packaging, and industry M&A.Summit features keynotes, matches, showcases, awards, rankings, & livestreams. Credit: SMIAGMIF 2026 will also present its annual awards across Technology Innovation, Market Services, Industry Contribution, AI Infrastructure, Terminal Applications, and Capital Value. Alongside the awards, the Shenzhen Memory Industry Association — together with the School of Integrated Circuits at Peking University, JWinsights, and other institutions — will release the Memory & Storage Industry Rankings 2026, spanning semiconductor memory & storage, AI optical interconnect, semiconductor equipment, and AI computing.GMIF 2026 presents annual awards and industry rankings for storage & AI. Credit: SMIAA Track Record of Impact: Proven Value as an Industry PlatformSince its launch in 2022, GMIF has grown into a leading annual platform for the global memory & storage industry, connecting wafer IDMs, controller and module makers, OSAT providers, equipment and materials suppliers, terminal companies, investors, and media. GMIF2025 brought together 42+ key companies, showcased 180+ innovative products, presented 37 annual awards, and drew over 1,600 on-site attendees — with total exposure exceeding 420 million impressions and international livestream viewership surpassing 700,000.In 2026, GMIF builds on that momentum, expanding its reach across AI infrastructure, cloud-edge-device applications, and industry capital as it evolves from an annual exchange into a full AI memory & storage industry collaboration platform.Full-Spectrum Media Reach, Amplifying the Industry's VoiceGMIF 2026 will run an integrated communications campaign — features, short video, online and offline advertising, and outreach through 50+ central, financial, and semiconductor/memory vertical media outlets — to bring the AI memory & storage conversation to decision-makers, technologists, and investors alike.Full-Spectrum Media Reach, Amplifying the Industry's Voice. Credit: SMIALet AI memory and storage be our starting point — together, let's explore the new value the token economy brings to the industry, and witness memory and storage step onto the center stage of AI infrastructure.Join us September 22–23, 2026, as the 5th GMIF Innovation Summit convenes in Shenzhen.Registration is now open. We welcome industry professionals, technology leaders, and ecosystem partners to join us. Registration, awards submission and for more information about GMIF, please visit.