Advancing Intelligent Edge AI Storage Through Inclusive Design and Sustainable Innovation

AGI Technology will showcase a diverse lineup of next-generation storage products at COMPUTEX 2026, centered around this year's core theme: "Think Big, Build Grand." Highlighted exhibits include DDR5 R-DIMM, PCIe Gen5 SSDs, and new additions to the AGI Smart Life industrial solution series. Additionally, AGI will feature its patented thermochromic heat-dissipation memory, alongside a strategic collaboration with StorArt on memory cards and a major external storage lineup featuring a heavyweight Japanese anime crossover

Technology news, product launches and show highlights from the event attendees available for download (PDF).

Global Unichip Corp. (GUC), the Advanced ASIC Leader, will showcase Jotunn8, a next-generation data center AI inference processor developed by VSORA, at the TSMC Europe Technology Symposium.This exhibition highlights the successful collaboration between GUC and VSORA, combining advanced AI architecture with leading-edge ASIC implementation and packaging technologies to deliver a high-performance, scalable inference solution for data center workloads.Enabling advanced AI inference through close collaborationJotunn8 is VSORA's flagship AI inference processor, purpose-built for inference workloads. It delivers ultra-low latency and very high throughput by addressing the memory wall bottleneck, enabling cost-efficient deployment of large-scale AI models.GUC provided comprehensive turnkey ASIC services for Jotunn8, managing the full implementation from netlist to manufacturing. The project demonstrates GUC's expertise in complex system integration, including: Advanced chiplet architecture design and integration, High-bandwidth memory integration with HBM3E PHY and controller, 2.5D die-to-die connectivity using GUC's 17.2 Gbps GLink-2.5D interconnect, Advanced packaging implementation leveraging TSMC CoWoS-S technology (3x reticle size), Implementation on TSMC's 5nm process node,Full-system co- optimization of signal, power, and thermal integrity (SI/PI/TI), Power and IR optimization to enhance overall system efficiency.This collaboration underscores GUC's capability to deliver complex AI and HPC ASICs with optimized performance, power, and scalability.Leveraging a strong ecosystem with TSMCJotunn8 also reflects the strength of GUC's long-standing collaboration with TSMC. As a key partner in TSMC Open Innovation Platform (OIP) ecosystem, GUC enables customers to efficiently adopt advanced process nodes and packaging technologies, bridging innovative architectures with leading-edge manufacturing.By leveraging TSMC's advanced CoWoS packaging and 5nm process technologies,GUC ensures high-quality silicon execution and a reliable path to production for demanding AI applications."We are proud to showcase Jotunn8 at the TSMC Europe Technology Symposium. This achievement highlights our strong collaboration with VSORA and demonstrates GUC's ability to bring complex AI processors to silicon using advanced process and packaging technologies," — said Patrick Wang, Senior Vice President and Chief Revenue Officer at GUC."Jotunn8 is designed to unlock a new level of efficiency and scalability for AI inference. Our collaboration with GUC has been key in successfully translating this architecture into a highperformance silicon solution,"— said Khaled Maalej CEO of VSORA.Driving next-generation data center AIThrough this collaboration, GUC and VSORA address the growing demand for high-performance,energy-efficient AI inference in hyperscale data centers. Jotunn8 enables new levels of throughput and latency optimization, supporting large-scale AI deployment across cloud and enterprise environments.

iCatch Technology announced PAISB (Physical AI Sensor Bridge) - a HSB-aligned Imaging ASIC designed to enable scalable, time-aligned multi-sensor ingest for Physical AI platforms. At COMPUTEX 2026 (June 2–5), iCatch will showcase its latest PAISB solutions at Booth #R0826, Nangang Exhibition Center Hall 2, 4F.As Physical AI systems rapidly evolve, developers are increasingly challenged by the complexity of multi-sensor synchronization, high-bandwidth data ingest, and image quality tuning, which often diverts resources away from core AI development. iCatch's PAISB platform directly addresses this challenge by introducing a hardware-accelerated, HSB-aligned imaging pipeline that enables deterministic, low-latency data transfer into NVIDIA GPU platforms. By offloading sensor ingest, synchronization, and imaging processing into a dedicated ASIC, PAISB allows developers to focus on AI model innovation and system-level applications, positioning iCatch as a key enabler within the NVIDIA Holoscan ecosystem for next-generation robotics, autonomous systems, and Physical AI deployments.At COMPUTEX 2026, iCatch will demonstrate two key PAISB platforms that highlight this capability. The PAISB-E1 (1GbE) can run stereo vision applications on NVIDIA platforms, designed for smart actuators and dexterous robotic manipulation requiring precise depth perception and real-time responsiveness. In parallel, the PAISB-E10 Proto-ES (10GbE) will showcase Tele/Wide imaging with EIS on NVIDIA platforms, targeting humanoid robot edge platforms and robotic factory simulation server environments. These demonstrations illustrate how PAISB enables time-aligned, high-bandwidth multi-sensor streaming while simplifying system integration."PAISB represents a key milestone in iCatch's Physical AI platform strategy," said Weber Hsu, President of iCatch Technology. "As the first HSB-aligned Imaging ASIC, PAISB enables AI developers to focus on model innovation by abstracting sensor-level complexity. We are committed to building the sensor infrastructure layer that accelerates Physical AI deployment across robotics and autonomous systems."iCatch invites industry partners and developers to visit the booth at COMPUTEX 2026 to experience live PAISB demonstrations and explore collaboration opportunities. Learn more about PAISB and Schedule a meeting or request information.

The perfect fusion of the world’s smallest fan and advanced thermal-optimized SSD technology for AI computing applications.Datotek Inc., a provider of high-performance storage and memory solutions, will showcase its latest AI-driven storage technologies at COMPUTEX 2026 in Taipei. As one of the SSD manufacturers and DRAM manufacturers focusing on AI storage innovation, Datotek will present PCIe Gen5 NVMe SSDs, memory modules, portable SSDs, and advanced SSD heatsink innovations designed for AI computing, edge AI applications, and high-performance systems.The company continues to strengthen the integration between AI technologies and high-speed storage architecture. By combining PCIe Gen5 SSD, NVMe SSD, memory modules, and intelligent thermal management technologies, Datotek aims to deliver faster, smarter, and more intuitive storage experiences for creators, professionals, gamers, and AI users.At COMPUTEX 2026, Datotek will present a wide range of AI storage and high-performance computing solutions, including PCIe Gen5 NVMe SSDs, portable SSD solutions, memory module technologies, and SSD heatsink designs optimized for AI PCs, gaming systems, creator workflows, and edge AI environments.New M.2 2280 PCIe Gen5 SSD Active Cooler: 1cm thin with extreme cooling. Credit: Datotek Inc.One of the key highlights of this year's exhibition is the debut of the "ARES AEROFIN" active SSD Heatsink solution, designed for the extreme thermal demands generated by PCIe Gen5 NVMe SSD platforms and AI-intensive workloads. The advanced cooling system combines an ultra-slim active cooling architecture, Skived Fin high-density fin technology, and a micro cooling fan to effectively reduce thermal throttling, maintain SSD stability, and improve long-term system reliability under sustained high-load operation.With an industry-leading thickness of only 1 cm and a lightweight 20 g design, ARES AEROFIN delivers a compact yet highly efficient SSD cooling solution for high-performance PCs, gaming platforms, AI computing systems, and content creation environments. Designed for AI workloads, 8K video editing, AAA gaming, and professional creator applications, the active heatsink significantly improves thermal efficiency while maintaining stable PCIe Gen5 NVMe SSD performance.Exploded view detailing the cooler module's tech & specs. Credit: Datotek Inc.In addition to performance innovation, Datotek continues to advance intuitive AI storage and portable SSD solutions that simplify data management and improve accessibility. By integrating user-centric design with high-speed storage and memory module technologies, the company aims to accelerate the adoption of AI-powered storage in everyday applications.Under intensive operating conditions, Gen5 NVMe SSD temperatures can rapidly increase and impact system stability. Equipped with the ARES AEROFIN heatsink, SSD peak temperatures can be reduced to as low as 42.6°C and stabilized at approximately 38°C during extended operation. This thermal performance enables PCIe Gen5 NVMe SSDs to sustain ultra-high-speed performance of up to 14,000 MB/s read and 12,000 MB/s write speeds without throttling, helping extend SSD lifespan and supporting more sustainable storage operation.Datotek remains committed to its core philosophy of "Technology Innovation" and "Sustainable Development." In addition to advancing SSD, NVMe, PCIe, memory module, and AI storage technologies, the company continues to promote green supply chain practices, intelligent cooling innovation, and environmentally responsible product development. Moving forward, Datotek will collaborate with global ecosystem partners to accelerate smarter and more sustainable digital transformation in the AI era.Visitors are welcome to explore Datotek's latest AI storage, PCIe Gen5 NVMe SSD, portable SSD, memory module, and advanced SSD heatsink innovations at Booth I1124, Taipei Nangang Exhibition Center, from June 2-5, 2026 during COMPUTEX 2026. For more information, please visit Datotek Official Website and Datotek Facebook Page.