Footprintku AI, the global leader in electronics digital data services, made headlines at the 2025 AI EXPO with the debut of its groundbreaking DFM-oriented ECAD Library cloud platform. Co-founder YT Chen delivered the keynote address, unveiling how Footprintku's proprietary AI technologies are transforming traditional ECAD library workflows.
The explosion of edge AI is reshaping the mission of ultrabooks, transforming them from mere productivity tools into real-time intelligent terminals...
TCL CSOT, a global leader in display technology innovation, is making a significant presence at TouchTaiwan 2025, held from April 16-18, showcasing its electronic paper display solutions under the company's advanced APEX technology brand.
The application of artificial intelligence (AI) has emerged as a driving force behind global technological innovation. As AI adoption proliferates, the mastery of semiconductor chip technology becomes paramount for success. The escalating complexity and design costs of chips are fueling the rapid evolution of electronic design automation (EDA) and upstream chip design solutions...
With the rapid expansion of the global medical devices market, the field of medical power supplies is undergoing technological innovations focusing on third-generation semiconductor materials. This year, at the China International Medical Equipment Fair (CMEF) from Apr 8 to 11, APD showcased a full range of medical power supplies, including its next-generation GaN medical power supplies.
Macronix, a leading global non-volatile memory (NVM) integrated device manufacturer, has launched its all-new ArmorBoot MX76 series flash memory. The ArmorBoot MX76 is designed for rapid initialization of electronic devices in diverse application scenarios...
Taipei, Taiwan, March 27, 2025 – As a global provider of rugged industrial computer solutions, Darveen recognizes rugged tablets as the ideal companion for manufacturing. From warehouses to shop floors, these devices enable workers to access key data anytime, significantly boosting operational efficiency...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented using TSMC's cutting-edge N3P process technology and CoWoS-R advanced packaging technology.
