With the rapid expansion of the global medical devices market, the field of medical power supplies is undergoing technological innovations focusing on third-generation semiconductor materials. This year, at the China International Medical Equipment Fair (CMEF) from Apr 8 to 11, APD showcased a full range of medical power supplies, including its next-generation GaN medical power supplies.

Macronix, a leading global non-volatile memory (NVM) integrated device manufacturer, has launched its all-new ArmorBoot MX76 series flash memory. The ArmorBoot MX76 is designed for rapid initialization of electronic devices in diverse application scenarios...

Taipei, Taiwan, March 27, 2025 – As a global provider of rugged industrial computer solutions, Darveen recognizes rugged tablets as the ideal companion for manufacturing. From warehouses to shop floors, these devices enable workers to access key data anytime, significantly boosting operational efficiency...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented using TSMC's cutting-edge N3P process technology and CoWoS-R advanced packaging technology.

The memory market is undergoing a significant transformation as suppliers pivot from traditional inventory-based models to forecast-driven production.

Rugged embedded computer brand Cincoze has added a new 15.6-inch FHD display option for HMI applications in harsh environments to its Display Computing – CRYSTAL product line...

People growingly rely on their phones for navigating via GPS, communicating via satellite and checking weather forecasts. All these services that make our life more intelligent and convenient are made possible by space technology breakthroughs.

Chenbro makes its first appearance at Nvidia GTC 2025, displaying the Nvidia GB300 Grace Blackwell Ultra Superchip compute tray and a full range of AI server chassis solutions based on the Nvidia MGX architecture, including 1U, 2U, and 4U models...

As edge AI applications experience rapid proliferation, intelligent terminal devices, such as ultra-thin laptops, tablets, and AI edge computing terminals, are facing exponentially growing demands for storage performance and capacity. However, conventional storage solutions are increasingly revealing their inherent shortcomings:

SK Hynix Inc. (or "the company") announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time in the world.