Status of global wafer foundry industry, 2023

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UMC posts decreased November revenue

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Nanya sees revenue hit 14-month high

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Haesung DS reportedly expanding automotive leadframe biz

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Chinese lithium carbonate prices fall below CNY150,000 per ton

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Foxconn opens software R&D center in southern Taiwan

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Western Digital to raise NAND flash prices by up to 55%

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TSMC hiring staff in Taiwan for German site

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Taiwan ASIC developers gain from intense AI chip arms race

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Taiwan PMIC suppliers looking to penetrate supply chain for AI servers

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Server PCB specialist Allied Circuit optimistic about outlook for 1H24

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Home Tech Semiconductors

Chipbond slows LCD driver IC packaging but eyes LED

Nuying Huang and Esther Lam, DigiTimes.com Monday 19 June 2006 0

While trimming down revenue and capacity goals, Chipbond Technology is extending beyond LCD driver IC packaging and moving into the LED packaging market, according to the company.

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