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    China chip execs shakeup:Cambricon ex-CTO raises claim to CNY27.832 billion
    1h 30min ago
    Prospects of Chinese automakers building US plants, offers potential supply chain opportunities
    1h 30min ago
    China's AI chip-server champions unite under one chair after scrapped merger
    1h 31min ago
    Micron expands global fabs and calls on Taiwanese suppliers to go overseas
    1h 31min ago
    U.S.-China truce extension lifts 4Q freight rates and tightens capacity
    1h 31min ago
    HomeRegions
    Wednesday 30 September 2026
    From EVs to AI humanoid robots: Tesla leans on Chinese manufacturing once again
    Energy, AI robotics, and autonomous vehicle maker Tesla is reportedly replicating its electric vehicle (EV) playbook by turning to Chinese manufacturing to support the supply chain ramp-up for its Optimus humanoid robot. In addition to conducting factory audits at three auto parts manufacturers in East China, a Tesla delegation also inspected related suppliers in cities such as Hangzhou and Shanghai.
    Wednesday 30 September 2026
    Inside China's 3D DRAM push: from lab to fab, and the road ahead
    China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS), the Beijing Superstring Memory Research Institute (SAMT), CXMT, and equipment maker NAURA Technology Group. The coordinated advance highlights both the momentum behind 3D DRAM and the technical hurdles still blocking mass production.
    Wednesday 30 September 2026
    Dat Bike challenges VinFast with simpler EV scooter strategy
    Vietnamese electric scooter brand Dat Bike has launched its family-oriented ERA model with a starting price of VND29.9 million (US$1,151.22), pairing it with a self-developed "integrated charger" that builds the charger directly into the vehicle's power system. The launch comes as Vietnam's electric two-wheeler market accelerates and Dat Bike sets its sights on market leader VinFast.
    Wednesday 30 September 2026
    Meta reaches agreements with Firmus on securing AI compute in Southeast Asia
    Meta reached several agreements to source AI compute capacity from Firmus, an Australian neocloud, which will lease GPU compute capacity at its AI factories in Southeast Asia. The deal is said to support Meta's AI expansion across the Asia-Pacific region, while Firmus notches another order from a major customer in the run-up to a potential public listing.
    Wednesday 30 September 2026
    Rare earths loom over US-China trade truce
    The US-China trade truce was extended after last week's Trump-Xi summit, but China's dominance of rare-earth supply chains remains a key pressure point as Washington tries to stabilize economic ties while reducing its dependence on Chinese critical minerals.
    Tuesday 29 September 2026
    SoftBank subsidiary Saimemory taps Shinko to bring ZAM closer to commercialization
    Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration and manufacturing expertise to a next-generation memory project that already includes Intel and Japan's RIKEN.
    Tuesday 29 September 2026
    In global semiconductor race, Singapore bets on critical, mature technologies
    Amid the ongoing restructuring of the global semiconductor supply chain, Singapore is focusing on advanced packaging, heterogeneous integration, silicon photonics, and optical interconnects, aiming to leverage nearly six decades' worth of manufacturing and supply chain expertise. In contrast with industry players in Taiwan, South Korea, and the US, who have continued to pour resources into 2nm and 1.4nm advanced processes, Singapore's semiconductor firms see no need to replicate Taiwan's foundry model. Instead, they aim to harness Singapore's existing strengths in mature and specialty processes, assembly and testing, equipment, materials, and multinational R&D clusters to secure their foothold in the supply chain for next-gen semiconductors.
    Tuesday 29 September 2026
    Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5
    Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific development to the core technology behind D0a, its first sub-10nm DRAM generation. Industry observers believe Samsung's push to commercialize B1b DRAM earlier could also benefit its next-generation high-bandwidth memory (HBM) products, including HBM5.
    Tuesday 29 September 2026
    AIDC sees NT$30 billion military maintenance boost, eyes drones
    As the last Brave Eagle advanced trainer rolls off the line in September 2026, Aerospace Industrial Development Corporation (AIDC) says its military business is not ending with the trainer's development and mass production program. Instead, a new phase is just beginning, with maintenance and spare-parts supply contracts for the Indigenous Defense Fighter and Brave Eagle expected to generate more than NT$30 billion (US$941.3 million) in value.
    Tuesday 29 September 2026
    RoboTechnik completes Hong Kong listing to fund ficonTEC expansion in silicon photonics
    RoboTechnik completed a Hong Kong listing on September 29 and began trading on the Hong Kong stock exchange, according to its German photonics automation subsidiary ficonTEC. The new capital will be used for further investment in ficonTEC, which is expanding its role in silicon photonics and optical interconnect manufacturing for AI and high-performance computing infrastructure.
    Tuesday 29 September 2026
    South Korea AI compute squeeze hits researchers and startups
    South Korea's AI sector is facing a growing GPU shortage as research institutes and small companies struggle to secure enough compute for model training and deployment. As government support ends, research teams are finding it harder to continue training, while startups are being squeezed by rising rental costs and long-term contract demands from suppliers.
    Tuesday 29 September 2026
    Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

    At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics (IME), KLA, ASM International, the National University of Singapore (NUS), the SHINE Centre, and ASMPT discussed how advanced packaging is evolving beyond conventional chip integration, with optical interconnects, panel-level packaging, and talent development emerging as key challenges.

    Tuesday 29 September 2026
    Beyond 16 layers: HBM stacks test advanced packaging equipment makers
    At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding beyond the performance of individual tools to hybrid bonding, interface materials, defect metrology, process control, optical interconnects, and panel-level packaging.
    Tuesday 29 September 2026
    Samsung bonus plan to lift South Korea talent race

    Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance bonus in late September, after a holiday break. The move comes as SK Hynix continues recruiting experienced talent, underscoring how pay systems and workplace conditions have become key to attracting and retaining workers at South Korea's semiconductor giants.

    Tuesday 29 September 2026
    Chips make up nearly half of South Korea's September exports; China, Hong Kong account for 52% of them
    Semiconductors made up nearly half of South Korea's exports in the first 20 days of September, while China and Hong Kong combined accounted for more than half of the country's chip shipments in August, underscoring the growing concentration of the latest export surge by both product and destination.
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