SK Hynix said in a July 22 disclosure that it had neither pursued nor decided on an acquisition of Intel's under-construction semiconductor site in New Albany, Ohio, denying a JoongAng Ilbo report that the companies were negotiating over the campus.
Chinese semiconductor equipment suppliers are beginning to secure production orders for through-glass via (TGV) manufacturing tools, marking a shift from prototype validation toward commercial deployment as the industry moves to develop glass substrates for next-generation AI chip packaging.
Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip sample with Shanghai Xianfeng Technology using glass-based Chip-on-Panel-on-Substrate (CoPoS) panel-level advanced packaging.
Chinese GPU developer Biren Technology unveiled a next-generation near-packaged optics (NPO) super node at the World Artificial Intelligence Conference (WAIC) 2026, targeting the growing computing demands of large language models and AI agents.
China is considering tighter export controls on artificial intelligence and semiconductor technologies amid intensifying competition with the US in frontier AI. The proposed measures, reported by Financial Times, would also target overseas acquisitions of advanced technology startups and could appear in the next revision of Beijing's export control catalogue.
Rising investment in AI servers, high-speed networking, and satellite communications is accelerating a shift in Southeast Asia's electronics industry. Thailand, Vietnam, and Malaysia are moving beyond traditional consumer device assembly and building a deeper regional ecosystem for printed circuit boards, advanced substrates, and semiconductor-related manufacturing.
Haesung DS has reportedly added China's CXMT as a customer for DDR5 package substrates as the South Korean supplier expands its DDR5 business and considers panel-based production for higher-layer-count products for the DDR6 generation.
Ishihara Sangyo Kaisha plans to double production capacity for high-purity titanium dioxide used to make dielectric materials for multilayer ceramic capacitors, as rising AI server power requirements increase demand for the components.
China's exports of rare-earth permanent magnets reached record levels in the first half of 2026, yet the same customs data reveal a market increasingly shaped less by demand than by Beijing's discretion — flowing freely to most of the world, throttled to the US, and, since January, newly restricted to Japan.
Samsung Electronics, SK Hynix and Micron Technology are reportedly scaling back or shelving plans to commercialize internally developed Compute Express Link (CXL) controller chips, shifting more controller work to specialist fabless suppliers while continuing to develop CXL-based memory products.
