The global semiconductor industry is rapidly expanding production capacity, with Taiwan, the US, and China accelerating memory, advanced packaging, and wafer foundry construction plans. Supply chain sources report a sharp order increase for 2026, driven not only by TSMC's large-scale expansions in Taiwan and the US but also by accelerated memory fab projects from Nanya Technology and Micron, alongside continuous growth in China's semiconductor output.

Mitsui has concluded a strategic business partnership agreement with Kaynes Semicon Private Limited, an OSAT (semiconductor back-end process) company in India, and AOI Electronics, the largest Japanese OSAT company. The agreement aims to support the start-up and operation of Kaynes' OSAT business and to facilitate sales of products manufactured by Kaynes.

Japanese and South Korean firms are expanding their presence in India as the country strengthens its semiconductor and technology ecosystem. Rohm has partnered with Suchi Semicon for back-end manufacturing, while Hanmi Semiconductor and OLED materials firm Lordin are advancing India plans alongside Micron's new facility.

South Korean OLED materials developer Lordin plans to seek a technology-special listing in the first half of 2027, with a US$25 million fundraising round targeted for completion in 2026, as it advances commercialization of its blue phosphorescent emitter technology and expands operations into India.

South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry's first dual-function BOC COB Bonder, capable of performing both Board-on-Chip (BOC) and Chip-on-Board (COB) processes within a single system, according to Yonhap News Agency and Maeil Business Newspaper. The company says the equipment is designed to improve process flexibility and production efficiency for high-performance memory products.