Andhra Pradesh is making its most concrete move yet in semiconductors, zeroing in on packaging as the immediate entry point into the chip supply chain. Speaking on the sidelines of the Computex technology expo in Taipei, Bhaskar Katamneni, Secretary to the Government for ITE&C, acknowledged that wafer fabrication remains a long-term "seven or eight-year journey," but said packaging work is already well underway — with four PCB manufacturers having already begun operations, according to him

Below are the most-read DIGITIMES Asia stories from the week of May 25-31, 2026

India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations

C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development and scale production. The developments underscore growing investor interest in addressing power delivery bottlenecks in data centers, driven by accelerating AI workloads

Anthropic is expanding its leadership and operational presence in India as it scales adoption of its Claude AI models across startups and enterprises, appointing senior executives to lead growth, partnerships, and digital-native customer engagement in one of its fastest-growing markets

TP-Link India has started local production of Wi‑Fi 7 devices, beginning with the Omada EAP770 enterprise access point, a move that could accelerate the adoption of next‑generation wireless worldwide. The decision follows India's delicensing of the lower 6 GHz band and positions the company to serve domestic and select international markets, according to The Times of India, AP7AM, and The Statesman

Cyient Semiconductors has secured a total of about US$30 million in financing from Edelweiss-managed funds and co-investors, comprising a US$10 million equity investment at a valuation of roughly US$500 million alongside structured debt. The deal bolsters its capital base to scale its power semiconductor and custom silicon offerings for global AI markets

India's electronics manufacturing industry, which has emerged as the world's second-largest mobile phone production hub after China, is facing growing pressure as slowing smartphone demand and rising component costs erode profitability, prompting manufacturers to expand into higher-margin sectors such as defense, industrial electronics, and medical devices

Below are the most-read DIGITIMES Asia stories from the week of May 18-24, 2026

Reliance's pivot from domestic manufacturing to component procurement reveals the geopolitical constraints reshaping India's clean energy transition and raising questions about supply chain resilience in critical infrastructure

Tata Group's semiconductor facility in Assam is expected to begin production soon, marking a significant milestone in India's push to build a domestic semiconductor manufacturing industry and strengthen its standing in global technology supply chains

India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is being shaped around a harder question: whether India can fix the weak links that determine if those projects become a sustainable semiconductor ecosystem

Microsoft's data center expansion in India represents the continuation of a strategic regional investment trajectory, updating previously announced capital commitments rather than introducing new funding. The company is accelerating infrastructure deployment in India's fast-growing AI market, where it competes with Alphabet and Amazon for dominance in cloud services and artificial intelligence

India inaugurated Rajasthan's first semiconductor plant on May 15, marking a significant step in the country's push to expand domestic electronics and chip manufacturing under its broader industrial policy agenda