TECO Electric & Machinery is expanding into global AI computing infrastructure, announcing on the November 11 that it will partner with AI cloud service provider GMI Cloud and KSDI to build an modular AI data center in Satsumasendai, Kagoshima Prefecture, Japan. TECO will serve as the modular data center contractor, handling design, electromechanical systems integration, and technical guidance, with the first 6.4MW phase scheduled for delivery within nine months.

Samsung Electronics and AMD are teaming up to upgrade the Korean chipmaker's semiconductor manufacturing test infrastructure, combining AMD's new EPYC Embedded 9006 processors with Samsung memory and storage technologies, according to AMD's November 10 announcement.

SoftBank Group (SBG) posted a JPY768 billion (approximately US$4.85 billion) net loss for the first half of fiscal 2026, from April to September 2026, its first loss in nearly two years after booking a US$3.7 billion impairment on a US data-center project and absorbing the impact of falling global AI valuations.

China’s HKC has again stalled its OLED expansion, with equipment orders for its Gen 6 OLED line in Mianyang, Sichuan, yet to be placed despite plans for deposition equipment to arrive in March 2027. Industry sources attribute the delay to weak OLED demand and technology challenges, warning that the investment could ultimately be canceled.

Kia is considering investing about US$1.5 billion to expand its plant in Andhra Pradesh, India, while South Korean auto-parts makers have pledged follow-on investments. If approved, the project would establish an integrated vehicle manufacturing and parts-supply chain in the state.

"Jensanity" has helped fuel the global artificial intelligence (AI) boom, but reports linking Nvidia CEO Jensen Huang to an alleged extramarital relationship involving a suspected Chinese spy are putting the company's corporate governance under greater scrutiny. While the controversy could benefit Huawei Technologies and other Chinese competitors, tighter US chip export controls could ultimately inflict greater damage on China's AI industry.

Moonshot AI reportedly accessed advanced Nvidia chips this summer, according to documents filed with Chinese regulators. The finding shows that advanced US chips continue to make their way into China despite Washington's export restrictions. It also reveals Moonshot's continued reliance on American chips even as Beijing seeks to bolster domestic chipmaking.

Samsung Electronics acquired four US silicon photonics patents from UK-based Rockley Photonics in September 2026, South Korea's Shinailbo reported on November 11, citing US Patent and Trademark Office (USPTO) records. The reported acquisition could strengthen Samsung's intellectual property portfolio in optical interconnect technology as it expands its silicon photonics foundry business to compete with TSMC.

Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer evaluations to follow, ZDNet Korea reported on November 10, citing an industry source familiar with the plans.

Nexperia could eventually reunite its Chinese and international operations despite an unresolved control dispute with Chinese parent Wingtech Technology, acting CEO Stefan Tilger said recently. If the separation becomes permanent, Wingtech's ownership should entitle it to fair compensation.

Smaller electronics manufacturers are relying on the spot market for memory as major customers lock in future supply through long-term agreements, according to independent electronic components distributor Smith.

Advantech's South Korean business grew 67% in the first three quarters of 2026, as industrial equipment, networking and cloud infrastructure, and healthcare remained its largest local markets. Some South Korean customers and partners have moved edge AI solutions into mass production, while the company is looking to extend its industrial computing and software integration expertise into robotics and energy applications.

Alibaba filed for a Hong Kong IPO for its chip design unit, T-Head, as a spin-off on November 10. The separate listing would let investors gain direct exposure to the group's chipmaking business as China's AI ecosystem seeks to reduce its reliance on US semiconductors through domestic alternatives.

China's leading smart-device original design manufacturer (ODM), Huaqin Technology, plans to invest CNY1 billion (approx. US$149.86 million) in a wafer foundry venture, strengthening upstream semiconductor ties while expanding its AI server and data center businesses.