China's SiC industry, once viewed as a critical front in global tech rivalry, has been transformed over the past two years. Breakthroughs in domestic SiC materials and mass production capacity have turned the sector into a fierce price battleground, driving many companies into financial distress
China's state-backed DRAM maker CXMT is rapidly advancing in high-bandwidth memory (HBM), a market long controlled by Samsung Electronics and SK Hynix. Citing SemiAnalysis, South Korean outlet Business Post reported that CXMT may start mass production of HBM3E as early as 2026, far ahead of expectations, underscoring how quickly the company is closing the gap with its South Korean competitors
The 26th China International Optoelectronic Exposition (CIOE 2025) opened in Shenzhen on September 10, attracting over 3,800 global companies across communications, optics, lasers, displays, and sensing technologies. Co-located with the Shenzhen International Semiconductor Exhibition (SEMI-e), the combined event covers 300,000 square meters, making it one of the largest showcases of integrated optoelectronic and semiconductor ecosystems
China's large-scale industrial mobilization is on full display as the iPhone 17 enters mass production, with Foxconn's Zhengzhou factory reportedly operating at maximum capacity to meet global demand. Simultaneously, India's manufacturing sector is rapidly expanding, gaining attention as a potential hub for producing the entire iPhone 17 lineup. This dual narrative reflects broader tensions and evolving dynamics within Apple's supply chain ecosystem
Apple's unveiled iPhone 17 series includes units manufactured in India, sparking significant discussion about the evolving dynamics in the company's global supply chain. Indian facilities are now assembling not only the standard model but also the iPhone 17 Pro and new iPhone Air, with a notable proportion of phones sold in major markets produced locally
TSMC's Japanese subsidiary JASM has completed and started operations at its first wafer fab in Kumamoto. According to Japanese sources, a second wafer fab is already under construction. Analysis by Japanese research institutions shows that the large-scale semiconductor industry has revitalized local small and medium-sized enterprises (SMEs), with financial institutions increasing lending accordingly
As the manufacturing and logistics industries shift from mechanical automation to AI-driven autonomy, South Korea-based digital twin provider UVC has launched a smart manufacturing solution that combines high usability with fast processing speeds. The company aims to challenge the dominance of global heavyweights such as Siemens, AutoCAD, and Altair in process simulation
Recent reports indicate that Samsung Electronics is restarting construction on parts of its P4 and P5 fabs to accelerate advanced DRAM mass production. SK Hynix is also reportedly expanding DRAM production capacity in South Korea, with plans to complete its Cheongju plant by the fourth quarter of 2025
Baidu has launched the upgraded inference model ERNIE X1.1, claiming it rivals US models like OpenAI GPT-5 and Google Gemini 2.5 Pro in benchmark tests and surpasses the DeepSeek R1 update from May. At the WAVE SUMMIT, CTO Wang Haifeng revealed that X1.1 improves knowledge accuracy by 34.8%, instruction-following by 12.5%, and agent capabilities by 9.6% compared to ERNIE X1
Japanese measurement leader Horiba Ltd., active in Taiwan for nearly 30 years, has opened a new Application and Solutions Platform (ASP) instrumentation lab at its Hsinchu headquarters. The facility is designed to boost Horiba Taiwan's technical services and reinforce its position in the global semiconductor and AI value chains
Yangtze Memory Technologies (YMTC) officially registered its Phase III unit, Changcun Phase III (Wuhan) Integrated Circuit, on September 5. The company has not disclosed details on investment, technology roadmap, or capacity, but the move indicates YMTC is preparing for fresh expansion. Market speculation continues over whether the initiative signals a push into the DRAM segment
The 26th China International Optoelectronic Expo (CIOE) and the Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025) are being held at the Shenzhen International Convention and Exhibition Center
YMTC, China's leading NAND flash producer, has unveiled a US$2.9 billion Phase III venture in Wuhan, signaling its determination to scale up capacity and sharpen its edge in next-generation memory chips. The move not only underscores Beijing's backing of a national champion but also raises the stakes in the intensifying global memory race
Apple unveiled its latest iPhone 17 series on September 9, 2025, introducing four new models, including the highly anticipated iPhone Air. The iPhone Air, noted for its thinnest design ever and support for standalone e-SIM functionality, has ignited discussions within China's smartphone industry about the future of e-SIM technology
China's top silicon wafer maker, National Silicon Industry Group (NSIG), has unveiled a major restructuring, taking full control of three loss-making 12-inch wafer subsidiaries. The buyout, valued at CNY7.04 billion (approx. US$967 million), will be paired with a new fundraising plan capped at CNY2.105 billion
