Huawei Cloud is tying its next phase of cloud growth to Agentic AI, domestic computing power, and industry-specific deployment, launching a new infrastructure framework at its 2026 Huawei Cloud Inspire conference in Shanghai as it seeks a larger role in enterprise AI and smart driving
BOE Technology Group's push into glass-based packaging substrates remains short of mass production, even as the Chinese display maker expands into new materials and advanced display technologies to build growth beyond conventional panels
As artificial intelligence drives an insatiable demand for computing power, China is beginning to look beyond terrestrial data centers and edge computing toward a new frontier: space
DRAM prices are climbing as Samsung Electronics, SK Hynix, and Micron Technology prioritize high-bandwidth memory, or HBM, for AI applications, tightening supply of mainstream DDR5 and DDR4 products used in PCs, servers, and other electronics, according to Nikkei
