Cybersecurity solutions provider SailPoint recently released a report, "The Horizons of Identity Security, 2025-2026," revealing the current state of identity security among global enterprises. The Asia-Pacific (APAC) region shows a polarized development pattern: over half of the surveyed companies are still in early stages while the proportion of highly mature firms surpasses Europe and matches North America
On November 24, 2025, the Chinese Academy of Sciences (CAS) officially launched the "Burning Plasma" international scientific program at the "Future Big Science City" in Hefei, Anhui. The CAS also presented the Burning Plasma Experimental Superconducting Tokamak (BEST) research plan to the global fusion research community
Samsung Electronics is reportedly preparing to convert portions of its NAND flash production lines in Pyeongtaek and Hwaseong into DRAM facilities as the company races to meet surging demand for general-purpose DRAM used in AI servers and data centers
The turmoil surrounding Nexperia persists as Wingtech, the Chinese parent company of Nexperia, has formally lodged a complaint with the Dutch government, demanding the withdrawal of its control over Nexperia Netherlands. This follows the Dutch government's recent announcement suspending the takeover execution amid negotiations with China's Ministry of Commerce (MOFCOM), while not revoking the original court ruling that authorized the takeover
China's electric vehicle (EV) makers are shifting more of their R&D toward humanoid robots, betting the next phase of AI competition will centre on physical-world applications rather than in-car systems. As US-China tech tensions rise, automakers including Xpeng, Chery, Nio, BYD, GAC, and Seres are using their EV engineering and autonomous-driving AI to develop robots with autonomous mobility and semantic understanding, positioning embodied intelligence as their next strategic arena
Nvidia is reportedly adopting low-power DDR (LPDDR) memory in its servers to enhance power efficiency, marking a major shift in memory architecture. Industry analysts suggest this move could elevate LPDDR to become a core semiconductor in the AI era, following the prominence of high-bandwidth memory (HBM)
Japan's Ministry of Economy, Trade and Industry plans to invest JPY100 billion (US$671 million) in Rapidus in fiscal 2025, securing a controlling stake as the government accelerates its push to rebuild domestic advanced chip manufacturing. The funding will be executed through the Information-Technology Promotion Agency, and Rapidus aims to reach break-even around 2030 and pursue an initial public offering in 2031
Toshiba's sudden move from its long-standing partnership with Rohm Semiconductor to a brief collaboration with China's Sicc unsettled Japan's power semiconductor sector. Toshiba reversed course after METI intervened, but uncertainty still surrounds the future of its relationship with Rohm
The memory shortage is rippling through the PC supply chain, prompting vendors to scramble for DRAM allocations at upstream suppliers. Industry sources say senior Asus executives have joined MediaTek in making direct trips to Samsung Electronics in a bid to secure inventory
South Korean battery maker SK On has restructured its investment portfolio by exchanging shares with Chinese battery firm EVE Energy, resulting in SK On acquiring full ownership of its Jiangsu-based joint venture SKOJ and divesting its entire stake in the Guangdong-based EUE factory. This move aims to enhance operational efficiency amid challenges in the EV market
Japanese ceramics firm NGK Insulators has announced plans to triple its production capacity of support wafers by fiscal year 2027 (April 2027-March 2028). More specifically, these refer to double-sided polished alumina ceramic HICERAM Carriers used in chiplet packaging
Doosan Electronic Business Group (Doosan Electro-Materials) is on track to become the exclusive supplier of copper-clad laminate (CCL) for Nvidia's next-generation AI chip, Rubin, following Taiwan competitor Elite Material Co. (EMC)'s failure to pass quality certification for the Nvidia Blackwell GB300 compute tray
SK Hynix is reportedly preparing a major ramp-up of its next-generation 1c DRAM production, with plans to increase capacity eightfold in 2026 to meet rising demand for high-performance general-purpose memory in server and accelerator systems. The chipmaker is expected to boost output of GDDR7 and SOCAMM2 modules built on the 1c platform to support growing orders from Nvidia and global cloud service providers
The 2025 Intel Technology Innovation and Industry Ecosystem Conference was held from November 19 to 21, 2025, in Chongqing, China. At the event, Intel CEO Lip-Bu Tan and newly appointed chairman of Intel China Alan Wang both made their first public appearances in China following their appointments. They took office in March and September 2025, respectively. In contrast to former CEO Pat Gelsinger, their remarks focused heavily on AI
