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Friday 23 October 2026
Commentary: How long can the humanoid robot bubble last? Unitree's valuation correction puts physical AI to the test
Concerns over a potential AI bubble are intensifying. From large language models (LLMs) and AI data centers to humanoid robots, investors are increasingly questioning when massive capital investments will translate into corresponding revenue and profits.
LATEST STORIES
Friday 23 October 2026
Semco's 61-week MLCC lead times give suppliers upper hand in AI supply chain
Samsung Electro-Mechanics (Semco) is gaining pricing power as AI server demand extends multilayer ceramic capacitor (MLCC) lead times beyond a year. Shortages now span consumer, automotive and industrial products, prompting customers to secure 2027 supplies.
Friday 23 October 2026
First chip-level device on the list: US FCC bans two devices with Huawei HiSilicon chips under new rule
The US Federal Communications Commission (FCC) has banned two electronic devices from entering the US market because both contain surveillance chips made by Huawei's HiSilicon. The move marks the first time the FCC has used a new rule targeting devices whose chipmakers are deemed national security risks.
Friday 23 October 2026
Rapidus courts US AI customers ahead of planned 2H27 2nm mass production
Rapidus chairman Tetsuro Higashi said the Japanese chipmaker remains broadly on track to begin mass production of 2nm chips in the second half of 2027. Winning customers remains a key challenge, and initial demand is expected to come mainly from the United States, where demand related to artificial intelligence is strong.
Friday 23 October 2026
China's weak car market squeezes automakers, suppliers and dealers
China's weakening car market is challenging automakers, parts suppliers, and dealers as exports rise but domestic demand contracts. For global industry watchers, the downturn is a test of electric-vehicle resilience, subsidy dependence, and manufacturing overcapacity. Over time, planned capacity controls and corporate consolidation could reshape competition and supply chains worldwide.
Friday 23 October 2026
JCET's AI profit surge sets up US$2.73 billion advanced packaging expansion
JCET Group lifted third-quarter revenue 13.53% year-over-year to CNY11.43 billion (approx. US$1.71 billion) and net profit attributable to shareholders 59.99% to CNY773 million. For the first nine months of 2026, revenue rose 7.96% to CNY30.95 billion, while net profit climbed 69.58% to CNY1.62 billion. Profit excluding non-recurring gains and losses increased 99.17% to CNY1.56 billion.
Friday 23 October 2026
Mounting R&D and memory costs push Huawei to borrow US$2.3B from six Chinese banks
Huawei Technologies has secured a seven-year, CNY15 billion (approx. US$2.3 billion) offshore yuan loan from six Chinese banks, as rising research spending and memory costs weigh on its cash flow. The financing, arranged by domestic lenders, is Huawei's first offshore syndicated borrowing since 2020, Bloomberg reported, citing a person familiar with the matter.
Friday 23 October 2026
SK Hynix halts Solidigm IPO review in face of broader AI and market volatility
Solidigm, the US-based subsidiary established by SK Hynix, has officially halted its review of potential pre-IPO and IPO options.
Friday 23 October 2026
Apple's foldable iPhone Duo launches in China with delivery stretching into 2027
Apple Inc.'s first foldable iPhone, the iPhone Duo, went on sale in China on October 23, with limited initial supplies pushing some preorder delivery dates to late January 2027. The launch, just ahead of China's Single's Day shopping season, has become a key indicator for the country's smartphone market.
Friday 23 October 2026
From robot hands to shipyard trials, South Korea tests humanoid readiness
South Korean robot makers are taking different routes into industrial humanoids: Tesollo is building dexterous hands, AeiROBOT is preparing bipedal systems for shipyards and construction sites, and HD Hyundai Robotics is developing a dual-arm platform that may eventually gain wheels and legs.
Friday 23 October 2026
LG home appliance chip volume tops 1 million; spins off startup PADO to target GPU compute leasing
LG Electronics is expanding its artificial intelligence (AI) footprint on two fronts: in-house appliance chips and GPU compute services. On one hand, the company is scaling up the deployment of custom AI chips in its home appliances to boost product differentiation. On the other hand, PADO, a startup incubated and spun off by LG NOVA (LG's North American Innovation Center), is entering the GPU compute leasing and brokerage market to explore data center opportunities.
Friday 23 October 2026
Oppo targets premium smartphone growth with global Find X10 launch
Oppo unveiled the international version of its Find X10 smartphone series in Spain on October 22 (Taiwan Standard Time), following the line's China launch in late September. The move marked the company's latest effort to strengthen premium smartphone shipments as competition intensifies and overall demand remains under pressure.
Friday 23 October 2026
SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production

SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a reduction of more than 30% in thermal resistance. The initiative aims to address mounting heat dissipation challenges in HBM and strengthen the company's competitiveness in AI memory.

Friday 23 October 2026
AMEC ships first Primo Domingo selective etching system, targeting critical gaps in China's advanced 3D chipmaking
China's Advanced Micro-Fabrication Equipment (AMEC) has shipped the first unit of its Primo Domingo high-selectivity vapor-phase etching system to a major domestic semiconductor research and manufacturing customer, marking a step forward in China's efforts to develop indigenous equipment for next-generation 3D chips.
Thursday 22 October 2026
Samsung reportedly overhauls DRAM, NAND R&D incentives to retain talent and accelerate next-gen memory chips
Samsung Electronics is reportedly restructuring its semiconductor research operations and performance-based compensation system to accelerate next-generation DRAM and NAND flash development, bringing researchers and production teams closer together while addressing concerns over incentives and talent retention.
Thursday 22 October 2026
China's L3 autonomous driving adoption tipped to top 35% by 2030, raising stakes for automakers
Level 3 (L3) autonomous driving penetration in China is forecast to exceed 35% by 2030, supported by falling sensor costs, advances in AI models, and tighter safety regulations. The forecast comes as the country expands autonomous driving trials and prepares for wider commercial deployment.