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Tuesday 5 May 2026
South Korea eyes memory-led AI order against Nvidia
As AI shifts from training to inference and from single-task use to multi-agent collaboration, South Korea's semiconductor industry is seeking to recast the market around memory rather than GPUs. South Korean academia and industry figures say the AI era will be defined by memory architectures, with the country aiming to build its own framework and challenge an order long dominated by Nvidia
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Tuesday 5 May 2026
AMI capacity sold out through 2028 as CCL makers race for high-end tools

The PCB industry is entering a new phase of transformation in the AI era, as rising demand for high-frequency and high-speed applications accelerates upgrades in upstream copper-clad laminate (CCL) materials. Among the beneficiaries is impregnation equipment maker Asia Metal Industries (AMI)

Tuesday 5 May 2026
Samsung reportedly eyes SiC foundry reboot, targets 2028 mass production
Samsung Electronics is reportedly restarting its silicon carbide (SiC) wafer foundry business, aiming to tap into the fast-growing next-generation power semiconductor market, reinforce its market position, and improve utilization rates at its existing 8-inch foundry lines. Industry estimates suggest Samsung could enter mass production of SiC chips by 2028
Tuesday 5 May 2026
Kioxia, SanDisk to unveil 3D flash architecture targeting 1,000-layer milestone
Kioxia and SanDisk are set to present a new 3D flash memory architecture aimed at extending NAND scaling beyond 1,000 stacked layers, as memory makers seek ways to overcome the physical and electrical limits of conventional layer increases
Monday 4 May 2026
ADT lands US AI chip deal using Samsung 4nm
ADTechnology said it has signed a KRW40 billion (US$27.1 million) turnkey contract with a US-based AI fabless company to develop and supply HPC SoC chiplets for AI data-center applications using Samsung Foundry's 4nm process
Monday 4 May 2026
Samsung strike exposes AI-era pay divide, raises HBM supply risks

A looming strike at Samsung Electronics is exposing deeper fractures than a typical labor dispute, with widening pay gaps, divisional tensions, and a controversial bonus structure converging into a broader test of how AI-era profits are distributed inside one of the world's most critical semiconductor suppliers

Monday 4 May 2026
DIGITIMES Chair: South Korea's 260,000 GPU plan relies heavily on Taiwanese production, highlights need for collaboration in AI era
As global demand for AI infrastructure accelerates, the collaboration between Taiwan and South Korea—the core pillars of the global semiconductor supply chain—is critical to winning the new tech race. Colley Hwang, chairman of DIGITIMES and IC Broadcasting, said South Korea's plan to deploy 260,000 Nvidia GPUs remains heavily reliant on Taiwan's manufacturing capabilities
Monday 4 May 2026
Samsung reshuffles TV leadership amid Chinese rivalry and service pivot
Samsung Electronics has replaced the head of its Visual Display (VD) business in a rare mid-cycle reshuffle, responding to weakening demand and intensifying global competition in the television market
Monday 4 May 2026
Samsung pulls ahead of SK Hynix as commodity DRAM prices surge

Samsung Electronics and SK Hynix are both riding a historic memory upcycle, but a profit gap of about KRW15 trillion (approx. US$10 billion) has opened between the two Korean chipmakers, driven largely by commodity DRAM rather than high-bandwidth memory (HBM), according to Sedaily

Monday 4 May 2026
China curbs memory speculation; DDR4 spot slides, contract prices surge

Spot memory prices surged in early 2026, triggering stockpiling and speculative buying across distribution channels, before reversing from a March peak. DDR4 DRAM spot prices have since corrected by more than 20% quarter-over-quarter, yet lower prices have failed to revive demand. With holidays approaching, buyers remain on the sidelines, while contract memory prices continue to climb

Monday 4 May 2026
China's auto sector pushes standards and exports while disposable-car concept gains traction
The 2026 Beijing Auto Show signaled a significant shift in China's new energy vehicle sector as automakers accelerated adoption of ultra-fast charging, intelligent powertrains, and embodied AI as standard features, and promoted faster moves toward higher-level autonomous driving, according to a J.P. Morgan research note and supply-chain sources. The show, held in Beijing in 2026, highlighted how scale, speed, and globalization have become central to domestic strategy and are shaping product, sales, and export priorities
Monday 4 May 2026
China automakers adopt disposable-car subscriptions to accelerate tech turnover
China's auto industry has begun rolling out a disposable-car model combining subscription plans and modular hardware to accelerate technology refresh cycles and cut the buildup of older vehicles, according to supply-chain observations and foreign media reporting from the 2026 Beijing Auto Show
Monday 4 May 2026
Research Insight: Beijing auto show signals shift from vehicle launches to AI-driven supply chains
The 2026 Beijing Auto Show has emerged as a platform where the balance of competition is shifting from sheer vehicle counts to advanced self-driving systems, AI-powered cockpits, and integrated supply chain collaborations, DIGITIMES Research observed. The event showcased both domestic and foreign manufacturers alongside key automotive intelligence suppliers
Monday 4 May 2026
AI chip demand ignites embedded substrate race among Samsung, Ibiden, Unimicron
Samsung Electro-Mechanics (Semco) has moved early to commercialize embedded semiconductor substrates, but the window is rapidly closing as Japan's Ibiden and Taiwan's Unimicron prepare to enter the field, setting up a new competitive front in advanced packaging
Monday 4 May 2026
China AI chip designer VeriSilicon books US$1.1bn orders, revenue doubles
China-based chip design service provider VeriSilicon Microelectronics (Shanghai) Co. is seeing a sharp acceleration in AI-driven demand, with record orders and surging revenue in the first quarter of 2026 — even as heavy R&D spending continues to weigh on profitability
Sunday 3 May 2026
Profile: MIT physicist Yichen Shen leads photonics chipmaker to Hong Kong IPO

On the morning of April 28, 2026, 37-year-old Yichen Shen stood at the Hong Kong Stock Exchange, striking the IPO gong with a wooden mallet