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Friday 17 July 2026
Japan's ACSL eyes Taiwan drone supply chain expansion, commits to TADTE 2027
Japanese industrial drone maker ACSL is open to expanding procurement from Taiwan as it strengthens its international supply chain strategy, with the company accepting an invitation to participate in the 2027 Taipei Aerospace & Defense Technology Exhibition (TADTE) during a visit by Taiwan External Trade Development Council (TAITRA) Chairman James C.F. Huang to ACSL's R&D headquarters on July 15.
Friday 17 July 2026
Taiwan drone sector expands Japanese tie-ups

Taiwan's drone industry has grown rapidly in recent years, with output surging from about NT$5 billion (US$154.87 million) in 2024 to NT$12.9 billion in 2025, while export value jumped from NT$140 million to NT$2.9 billion. Still, compared with semiconductors and electronics assembly, the drone sector remains small, making it critical for the industry to expand technology cooperation and secure government subsidies.

Friday 17 July 2026
China unveils first official commercial space roster, backing established players and the NTN ecosystem

An organization under China's State Administration of Science, Technology and Industry for National Defense (SASTIND) released the membership list of the National Commercial Space Alliance's Commercial Space Entrepreneurship Consortium on July 1, offering a rare look at 271 officially recognized space-related organizations. Covering everything from launch services and satellite development to ground infrastructure and financial services, the list signals Beijing's increasingly institutionalized approach to identifying and supporting established commercial space companies.

Friday 17 July 2026
Taiwan-Japan AI tech forum seeks closer partnerships

A Taiwan-Japan AI technology forum held at Taiwan Expo Japan brought together government, industry, academia and research representatives to discuss AI applications, semiconductor supply chains, smart manufacturing and innovation. Terry Tsao, SEMI's global marketing chief and head of the organization's operations in Taiwan, told DIGITIMES before the event that IBM has already demonstrated 2nm chip manufacturing capability in the lab, but the biggest challenge for its licensed partner, Japanese chipmaker Rapidus, to achieve mass production in Hokkaido will be yield.

Friday 17 July 2026
WAIC 2026 puts China's AI race on supernodes, domestic chips, and real-world deployment

China's AI industry is shifting from model scale to the infrastructure needed to train, deploy and commercialize AI, with supernodes, high-speed interconnects, and computing efficiency dominating WAIC 2026.

Friday 17 July 2026
China moves to institutionalize its vision for global AI governance as Xi launches cooperation body
China used the opening of the 2026 World Artificial Intelligence Conference (WAIC) in Shanghai to institutionalize its bid to shape global governance of artificial intelligence (AI), with President Xi Jinping unveiling a package of measures aimed at the developing world and endorsing a new Shanghai-based intergovernmental body. The push positions Beijing as a self-styled champion of the "Global South" on AI at a moment of intensifying rivalry with the US over who writes the rules for the technology.
Friday 17 July 2026
Hygon forecasts higher first-half 2026 revenue and profit
Hygon Information Technology said its first-half 2026 results are expected to rise sharply, signaling continued demand for domestic high-end chips as AI, cloud computing, and localization trends reshape technology supply chains for global customers, investors, and competitors. The company said the forecast is preliminary and unaudited.
Friday 17 July 2026
Japan steps up sovereign AI ambitions as Noetra launches multimodal AI project, plans infrastructure of 27,500 Nvidia Rubin GPUs
Noetra has launched full-scale R&D for a Japan-developed multimodal foundation model, a move that could shape the future of AI robots, industrial automation, and so-called physical AI worldwide. The project highlights Japan's push for sovereign AI, with implications for how countries build and control advanced AI infrastructure and data.
Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
Friday 17 July 2026
Moonshot's free Kimi K3 matches Anthropic's Opus 4.8, closing the gap between open and proprietary AI
Chinese AI developer Moonshot AI released Kimi K3 on July 16, a 2.8-trillion-parameter model the company bills as the first open model in the roughly 3-trillion-parameter class, pushing the distance between freely downloadable systems and the industry's top proprietary models to its narrowest point yet. Moonshot said it will publish the full model weights by July 27.
Friday 17 July 2026
China auto sales slump deepens as exports face rising trade scrutiny
China's passenger vehicle market posted its sharpest slowdown in years in the first half of 2026, with private passenger car sales falling 20% year on year, according to the China Passenger Car Association. The slide has pushed exports from a growth driver to the main support for automakers, while also exposing the sector to growing geopolitical risk.
Friday 17 July 2026
Australia strips voting rights from China-linked holdouts in rare-earths miner, curbing Beijing's mineral leverage

Australia has escalated a two-year campaign to force Chinese investors out of Northern Minerals Ltd., barring three China-linked shareholders that defied divestment orders from voting or exercising other rights in the heavy rare-earths developer — a signal that Canberra now intends to police foreign ownership on an ongoing basis, not just at the point of a transaction.

Friday 17 July 2026
South Korean bill could let SK Hynix bring in outside investors for new fabs

A South Korean lawmaker has introduced a bill that would allow a second-tier subsidiary of a general holding company to retain a stake of at least 50% in a jointly funded semiconductor venture, rather than the 100% currently required under the country's holding-company rules.

Friday 17 July 2026
China's AI chips hit three walls — and bet on 3D memory to break through
China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.
Thursday 16 July 2026
TSMC says 2nm has four times as many tape-outs as 3nm at the same stage
Customer tape-outs for TSMC's N2 process have reached four times the number recorded by its 3nm technology at the same stage, showing faster design activity as the foundry ramps production of its first 2nm process.