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Wednesday 2 September 2026
Deep Dive: CXMT challenges Pentagon as Trump-Xi meeting nears
ChangXin Memory Technologies (CXMT) has escalated its defense against the US government, shifting from supply-chain and technological competition into a full-scale courtroom battle. On August 28, 2026, the Chinese memory leader disclosed a stellar first-half financial report following its IPO and announced on the same day that it was suing the US Department of Defense (DoD).
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Thursday 3 September 2026
CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade

Chinese DRAM maker CXMT has launched its 2027 global recruitment campaign, opening roles across circuit design, R&D, mass-production technology, manufacturing operations, information technology and artificial intelligence. Positions are based in Hefei, Beijing, Shanghai, Xi'an and overseas markets including Japan.

Thursday 3 September 2026
SK Hynix weighs Kioxia production tie-up in Japan
SK Group chairman Chey Tae-won has raised the possibility of jointly producing semiconductors with Japan's Kioxia, taking SK Hynix's exploration of a Japanese manufacturing base a step further by publicly identifying its NAND rival as a potential production partner.
Thursday 3 September 2026
China packaging specialist SJSemi reaches 3.3-reticle 2.5D scale for AI, HBM integration
Chinese advanced packaging provider SJ Semiconductor (SJSemi) has expanded its silicon-interposer-based 2.5D packaging platform to 3.3 times the standard reticle size, enabling denser integration of multiple dies and high-bandwidth memory for AI chips and high-performance computing (HPC).
Thursday 3 September 2026
UniVista expands China EDA stack with AI agents, native 3DIC tools
Shanghai UniVista Industrial Software Group has launched an Agentic EDA framework, a native 3DIC physical-design tool and an advanced-process closure platform, expanding China's domestic toolchain for chip verification, 3D integration and digital back-end design.
Thursday 3 September 2026
ChangXin Memory's 'Hefei Project' exposed in Samsung DRAM theft case
South Korean prosecutors allege that Chinese memory maker ChangXin Memory Technologies (CXMT) set up an internal "Hefei Project" in 2016 to obtain Samsung Electronics' core DRAM technology and recruit its engineers, with phased goals laid out in advance.
Thursday 3 September 2026
BYD Semiconductor scales 4D radar chip for L2-L4 driving, deepening its in-house automotive sensing stack
BYD Semiconductor has begun mass production of a new automotive-grade 4D millimetre-wave radar chip built around its Xuanji A3 intelligent-driving architecture, expanding its in-house sensing stack for L2 to L4 driving functions.
Thursday 3 September 2026
China optical module makers ride AI boom as 800G, 1.6T orders stretch into 2027
AI infrastructure expansion is accelerating demand for 800G and 1.6T optical modules, lifting first-half 2026 results across major Chinese suppliers and extending order visibility into 2027.
Thursday 3 September 2026
Samsung Electro-Mechanics eyes 30% MLCC price hikes, ABF up too
Samsung Electro-Mechanics (SEMCO) is set to expand the scope of its price increases, with market reports saying the company will raise direct-supply prices for multilayer ceramic capacitors (MLCCs) sold to OEMs and ODMs in the fourth quarter of 2026, while ABF substrate prices are also climbing. With supply constrained and demand for AI servers strong, further price increases are likely in the near term.
Thursday 3 September 2026
MiniMax, Z.ai revenues surge on API demand but adjusted losses widen
Two of China's first listed foundation-model developers are showing that demand for their technology can translate into rapidly growing revenue. Turning that demand into profit remains a much harder problem.
Thursday 3 September 2026
TIME AI 100 spotlights China's new AI guard, from Moonshot, Z.ai to AgiBot, Manus
TIME recently unveiled its 2026 list of the 100 most influential people in AI. Alongside leaders of major technology companies, the list includes a new generation of Chinese entrepreneurs spanning AI models, humanoid robots, and AI agents, highlighting how China's AI industry is expanding beyond large language models into a broader range of technologies and applications.
Wednesday 2 September 2026
China's Galactic Energy puts PALLAS-1 in orbit, raising stakes in reusable rocket race
Chinese private launch company Galactic Energy Space Technology Co. has successfully flown PALLAS-1, its medium-to-large reusable liquid-fuel rocket, marking its expansion into a dual solid- and liquid-fuel portfolio.
Wednesday 2 September 2026
Meta reportedly taps SeeYA for Phoenix OLEDoS panels as BOE fails to qualify

Meta has reportedly tapped Chinese microdisplay maker SeeYA Technology to supply OLED-on-silicon (OLEDoS) panels for its next-generation lightweight mixed-reality headset, codenamed Phoenix, while rival BOE failed to obtain supplier qualification, according to South Korea's The Elec.

Wednesday 2 September 2026
Manus resumes independent operations after Meta deal collapses
Manus has resumed independent operations under its founding team, closing a turbulent chapter that began with Meta Platforms' multibillion-dollar acquisition of the AI agent startup and ended after Chinese regulators ordered the transaction canceled.
Wednesday 2 September 2026
China moves to curb overseas price wars as automakers accelerate global expansion

China has introduced new guidelines aimed at steering its automotive industry toward more orderly competition overseas as domestic automakers and suppliers expand rapidly into international markets.

Wednesday 2 September 2026
Panasonic reportedly raises CCL and PP prices again as IC substrate costs jump 30%
Japan's Panasonic has raised PCB material prices for the second time in 2026, broadening the increases to copper-clad laminate (CCL), pre-preg (PP) and other products, including IC substrate materials. Some items will rise by as much as 30%, with the new pricing taking effect on shipments starting September 1.