
MediaTek's new Dimensity 9600 Pro puts agentic AI at the center of its flagship smartphone strategy, supporting on-device mixture-of-experts (MoE) models with up to 30 billion parameters. Vivo, among the first Chinese handset makers to adopt the platform, has followed with an expanded AI software stack spanning BlueLM, BlueLM Copilot, and a system-level BlueLM Harness.
Copper-clad laminate (CCL) manufacturer Ventec International Group has approved an expansion budget of NT$1.5 billion (approx. US$47.11 million) to lease and convert an idle factory in Kunshan, Jiangsu Province, China, as it moves to capture spillover demand for artificial intelligence (AI) and high-density interconnect (HDI) materials. The expansion budget is to be invested in three phases. Depending on future growth demand, the company will proceed with further capacity expansion investments in the second and third phases.
Solidigm, the US NAND flash subsidiary of SK Hynix, is considering building its first NAND manufacturing plant in the US, with upstate New York emerging as a leading candidate.
AI is reshaping the global memory industry, tightening supply while creating an opening for China's domestic suppliers. With Samsung Electronics, SK Hynix, and Micron prioritizing high-bandwidth memory (HBM) and high-end server memory, ChangXin Memory Technologies (CXMT) and Yangtze Memory Technologies (YMTC) are gaining ground in conventional DRAM, mobile memory, and NAND Flash.
The Chinese smart glasses sector is rapidly consolidating around the principle that "subtraction is king." Rather than rushing unproven hardware to market, ByteDance is adopting a deliberate, supply-chain-first strategy.
Gallium nitride (GaN) is emerging as a key power semiconductor for AI data centers, where rising rack power and the shift toward higher-voltage architectures are forcing suppliers to improve efficiency and power density. But despite rapidly expanding orders and falling costs, industry researchers say GaN remains at an early stage of adoption and is unlikely to displace silicon broadly for another two to three years.