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Thursday 26 March 2026
SK Hynix reportedly weighing TSMC 3nm for HBM4E logic die
SK Hynix is actively evaluating whether to adopt TSMC's 3nm process for the logic die of its seventh-generation high-bandwidth memory (HBM4E), aiming to close Samsung Electronics' performance advantage. However, industry analysts warn that production timing and cost challenges pose significant risks to SK Hynix's 3nm ambitions
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Friday 27 March 2026
Mitsubishi Electric, Toshiba, Rohm open power semiconductor merger talks

Japan's power semiconductor sector is moving toward consolidation, with Rohm, Toshiba, and Mitsubishi Electric entering negotiations to integrate their power chip businesses, according to Yomiuri Shimbun and Nikkei. The talks target scale in electric vehicles, AI data centers, and power infrastructure, where demand for power control semiconductors is rising

Friday 27 March 2026
SK Hynix targets KRW100 trillion net cash as AI demand surges, eyes US listing

SK Hynix plans to build more than KRW100 trillion (approx. US$66 billion) in net cash to support long-term investment in artificial intelligence (AI) infrastructure, as surging demand reshapes the memory industry and drives a new round of capital spending

Friday 27 March 2026
South Korea's M.AX Alliance warns against funding China's robotics
Facing rapid advances in automation and AI from China's manufacturing sector, South Korea is accelerating its manufacturing AI transformation (AX) through the government-led Manufacturing AI (M.AX) Alliance. Established by the Ministry of Trade, Industry and Energy (MOTIE) just six months ago, the alliance has already attracted over 1,300 companies across 11 specialized fields, including robotics, autonomous vehicles, shipbuilding, and biomedicine
Friday 27 March 2026
Eikei targets automotive and AI markets, establishes Slovakia subsidiary
Automotive printed circuit board (PCB) manufacturer Eikei Group announced plans to establish a subsidiary in Slovakia, aiming to diversify geopolitical risks across its three major markets in Europe, the Americas, and Asia in 2026. Company chairman Shih-lin Liu added that the rapid growth momentum of artificial intelligence (AI) servers is expected to drive profitability higher
Friday 27 March 2026
SK Hynix keeps HBM shipments steady, targets HBM4E sample this year

SK Hynix expects stable growth in its high-bandwidth memory (HBM) business this year and plans to keep shipments in line with initial projections as it advances its next-generation roadmap amid evolving market conditions

Friday 27 March 2026
Japanese automakers diverge: EV retreat vs. hydrogen ambition

Sony Honda Mobility, the joint venture between Sony and Honda, has scrapped the two "Afeela"-branded electric vehicles it had been developing, citing Honda's recent strategic shift that canceled three planned US EVs—moves that could cost the automaker nearly US$16 billion. The decision leaves the joint venture's hundreds of employees in Tokyo and California facing uncertainty, as the companies evaluate the venture's future

Friday 27 March 2026
Samsung and SK Hynix expand microscope procurement to boost HBM yield
As AI compute demand surges, the rising need for high-bandwidth memory (HBM) testing and failure analysis is reshaping semiconductor inspection equipment markets, affecting chipmakers, foundries, and equipment suppliers worldwide. Demand for integrated microscopy platforms and localised service hubs is increasing to control yield, reduce costly iterations, and secure AI supply-chain positions
Thursday 26 March 2026
South Korea freezes 2Q26 electricity rates, amplifying stress on pricing mechanism and future bills
South Korea will keep electricity rates unchanged for the second quarter of 2026 amid geopolitical tensions in the Middle East, which are pushing global energy prices higher, a decision intended to stabilize household costs in the short term. The move, however, exposes mounting contradictions between the country's electricity pricing mechanism and broader energy policy objectives
Thursday 26 March 2026
China's H3C expands server exports to ASEAN and Central Asia as global AI compute demand rises
As countries tighten controls on advanced chips and AI computing demand surges, how China secures compute resources matters globally. DIGITIMES Research reports H3C, a top Chinese server maker, has expanded exports into ASEAN and Central Asia since 2023, reshaping supply chains and offering alternative routes around US trade pressures
Wednesday 25 March 2026
Denso proposes acquisition of Rohm to strengthen automotive and power control
Automotive parts giant Denso, closely linked with Toyota Motor, has officially submitted a proposal to acquire shares in Rohm Semiconductor, signaling its clear intent to pursue a takeover. This move appears to show Denso's intention to strengthen its position in the automotive semiconductor and power control sectors
Wednesday 25 March 2026
With Hua Hong partnership, STMicro builds 'China for China' supply chain
STMicroelectronics said this week that its STM32 microcontrollers, produced in partnership with Hua Hong Semiconductor, have entered volume production in China and are now being shipped to local customers, marking a significant step in the company's "China for China" strategy
Wednesday 25 March 2026
'China Speed': the new benchmark in global auto competition
Through highly centralized supply chains, a software-first development philosophy, and extensive state subsidies, Chinese automakers have compressed traditional vehicle development cycles from five to seven years to less than two. In some cases, development timelines have shrunk to just a few months
Wednesday 25 March 2026
China-South Korea panel war escalates: USPTO rejects Tianma patent challenge
The US Patent and Trademark Office has rejected an attempt by Tianma Microelectronics to challenge a patent held by LG Display, citing concerns that the Chinese company may be under the influence of a foreign government
Wednesday 25 March 2026
SoftBank-backed SAIMEMORY plans post-HBM shift with vertical memory tech
SAIMEMORY, a Japanese startup backed by SoftBank, is positioning its proprietary Z-Angle Memory (ZAM) as a potential successor to high-bandwidth memory (HBM) as physical limits begin to constrain current AI architectures, according to Nikkei and PC Watch
Wednesday 25 March 2026
Samsung reportedly set to begin GaN foundry production, prepare SiC samples
Samsung Electronics is reportedly set to begin mass production at its gallium nitride (GaN) power semiconductor foundry line as early as the second quarter, while also preparing silicon carbide (SiC) samples for production later this year, according to reports from The Elec and ZDNet