High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production costs, and long-term agreements lock up an increasing share of global DRAM capacity, according to memory industry sources.
BOE Technology expects first-half 2026 net profit to rise sharply as China's largest display panel maker benefits from a stronger LCD cycle, higher-end AMOLED shipments, and the start of mass production at its 8.6-generation OLED line for medium-sized panels.
When the 2026 World Artificial Intelligence Conference (WAIC) opens on July 17, its exhibition halls will double as a statement: China now fields a domestic AI stack running from silicon to agentic devices, at a moment when US export controls are tightening around the country's access to the most advanced foreign chips and models.
Mitsubishi Chemical and Japan Steel Works are preparing a fresh capacity expansion in gallium nitride (GaN) substrates, aiming to capture growing demand from next-generation power semiconductors used in EVs, inverters and data center power systems.
Xiaomi Auto has unveiled a new brand aimed at long-range SUVs, a move that could broaden its appeal beyond China and intensify competition in a global electric-vehicle market still shaped by range, charging access, and family-use demand. The startup also reported another month of strong deliveries, while continuing to expand production capacity in Beijing to support growth.
China's AI model race is moving beyond parameter size, benchmark rankings and user buzz. Investors are now asking which companies can turn model spending into durable revenue, pricing power and enterprise workflows.
CXMT has launched a CNY29.5 billion (approx. US$4.1 billion) STAR Market IPO, giving China's top DRAM maker fresh capital to upgrade 17nm production, expand DDR5, and develop HBM for AI servers and high-performance computing.
CXMT's STAR Market IPO suggests China's largest DRAM maker is prioritizing commodity memory over an aggressive near-term push into high-bandwidth memory (HBM). This eases concerns that Chinese suppliers are about to challenge the dominance of Samsung Electronics, SK Hynix, and Micron in AI memory.
SK Group chairman Tae-Won Chey is reportedly set to travel to the US for SK Hynix's American depositary receipt (ADR) listing on Nasdaq, where he will personally attend the celebration in New York. The move is being seen as more than a capital market event, as it marks an important moment in SK Hynix's effort to reposition itself from a traditional memory maker into a core company in AI infrastructure.
China's AI compute race is shifting to supernodes, as cloud providers and model developers seek domestic infrastructure capable of handling surging large-model training and inference demand.
Chinese companies are shifting more AI accelerator spending away from Nvidia and toward domestic suppliers, a sign that US-China technology tensions are no longer just reshaping chip exports, but the buildout of China's AI infrastructure itself.
