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Friday 16 January 2026
Huawei matches Nvidia in China's AI chip market, 2026 power shift in play
Soaring demand for high-end computing power, combined with geopolitical pressure and supply-chain constraints, is reshaping China's AI chip market at a structural level. Bernstein estimates that Huawei's share of China's AI chip market rose from about one-third of Nvidia's level in 2024 to reach parity with Nvidia in 2025. The shift marks a new phase in which domestic suppliers are taking the lead
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Friday 16 January 2026
Biwin Storage profit jumps 427% as memory cycle turns
China's domestic memory module maker Biwin Storage Technology has released the A-share market's first major 2025 profit outlook, signalling a sharp earnings rebound as memory prices recover and AI-driven demand reshapes the sector's supply dynamics
Friday 16 January 2026
China's solar braces for 2Q26 shakeout as export tax rebate ends
China's solar industry is heading into a volatile period as an impending export tax policy change exposes structural strains across the supply chain, increasing the risk of a market shakeout in the second quarter of 2026
Friday 16 January 2026
China expedites photoresist localization to reduce Japan reliance
With China and Japan launching successive anti-dumping probes and export controls on rare earths and key semiconductor materials, the risk of China's advanced-process supply chain being "choked" by critical material shortages is rising
Friday 16 January 2026
South Korea seeks matching US tariff breaks after Taiwan's chip pact agreement

South Korean industry and government officials are monitoring a new trade agreement between the US and Taiwan that links semiconductor investment to import duty exemptions, with officials in Seoul saying that any future US-South Korea talks should not leave Korea worse off than Taiwan. Officials view the terms as a potential benchmark for future US-South Korea trade negotiations

Friday 16 January 2026
US drops China drone proposal; Taiwan suppliers press ahead
The US Department of Commerce has withdrawn a previously proposed plan to restrict imports of Chinese-made drones, a move that some observers view as a goodwill signal ahead of an expected meeting between US President Donald Trump and Chinese President Xi Jinping
Thursday 15 January 2026
China takes cautious stance on US H200 chip export, prioritizes local chipmakers
The US government confirmed this week the conditions for exporting the H200 AI chip to China, reportedly including third-party lab testing before shipment to ensure compliance with AI technology standards. Additionally, the number of AI chips sold to Chinese customers cannot exceed 50% of those sold to US customers. Chinese buyers must also prove they have implemented sufficient security measures and that the chips will not be used for military purposes
Thursday 15 January 2026
Chinese AI startup Z.ai unveils first multimodal model trained on Huawei Ascend chips
Chinese artificial intelligence startup Z.ai, formerly known as Zhipu AI, has unveiled GLM-Image, a multimodal AI model trained entirely on Huawei's Ascend chip platform, marking a notable milestone in China's push to build a self-reliant AI computing stack. The company said GLM-Image was developed using Huawei's Ascend 800T A2 servers and the MindSpore AI framework, making it the first publicly disclosed multimodal model trained on this domestic hardware platform
Thursday 15 January 2026
South Korea's memory chip giants pivot back to capacity expansion

As the global memory market enters a prolonged upcycle, South Korea's two leading memory chipmakers, Samsung Electronics and SK Hynix, are expected to post record operating profits in 2026. Combined operating profit could exceed KRW300 trillion (approx. US$210 billion), roughly double the level recorded in 2025

Thursday 15 January 2026
Maxscend's first annual loss exposes fab-lite strain and legal risks
Maxscend Microelectronics is heading for its first annual loss since going public, marking a sharp reversal for one of China's leading RF chipmakers as it struggles with a costly business transition, intensifying competition, and mounting legal pressure from Japan's Murata Manufacturing
Thursday 15 January 2026
Hanmi Semiconductor leans into EMI shielding as satellite and 6G demand grows
Hanmi Semiconductor has drawn industry attention in recent years for its thermal compression bonding equipment used in high-bandwidth memory production. As low-earth-orbit satellite deployments expand and the industry moves toward 6G, the company's electromagnetic interference shielding equipment is also gaining importance
Thursday 15 January 2026
Samsung reportedly files new HBM trademarks as HBM4 advances
Samsung Electronics has reportedly filed a series of new trademarks related to high bandwidth memory as it advances preparations for its sixth-generation HBM4 products
Thursday 15 January 2026
Trump invokes Section 232 to levy 25% tariff on Nvidia H200, AMD MI325X chips
On January 14, US President Donald Trump signed a proclamation invoking Section 232 of the Trade Expansion Act of 1962 to impose an immediate 25% tariff on a narrow category of advanced semiconductors, citing national security risks from heavy US reliance on foreign chip supply chains
Thursday 15 January 2026
Rapidus forecasts 2nm supply shortfall by 2030, flags talent gap versus TSMC

As global governments accelerate investments in the semiconductor sector, Japan's Rapidus is moving forward with its goal of mass-producing 2nm AI chips. The company maintains that its primary concern is not a potential surplus of capacity, but rather structural constraints, specifically a significant shortage of skilled professionals

Thursday 15 January 2026
Japan fortifies rare-earth supply chain against China risk
China has tightened export controls on rare earths and other dual-use materials bound for Japan, prompting Tokyo to formalise a rare-earth stockpiling policy and work with G7 partners to accelerate efforts to reduce supply-chain dependence on China
Thursday 15 January 2026
China's WUS to build US$300m optical-electrical PCB hub for AI systems
WUS Printed Circuit (Kunshan) Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at supporting next-generation packaging and interconnect requirements for AI servers, high-performance computing (HPC), and advanced networking systems