Chinese baijiu (white liquor) producer Wuliangye, or "Five Grain Liquid," is moving into battery materials by turning distillers' grains, a liquor-production by-product, into biomass porous carbon for silicon-carbon anodes.
S&P Global Mobility senior research analyst for connected cars and user experience in Asia-Pacific Quan Zhang shared the latest forecasts for the cockpit display and head-up display (HUD) markets.
The 2026 China International Optoelectronic Exposition (CIOE) closed with 800G and 1.6T optical modules still dominating the show floor, while near-packaged optics (NPO), co-packaged optics (CPO), and eXtra-dense Pluggable Optics (XPO) gained a visibly larger presence.
After months of tight supply and sharp price increases in 2026, the global memory market is expected to see its supply-demand gap narrow significantly in 2027 as DRAM capacity expands and demand patterns shift, according to Beijing-based Sigmaintell Consulting. The consultancy expects the memory and broader semiconductor markets to continue growing through 2028, but forecasts a potential pullback in 2029 as evolving AI applications reshape demand.
China's leading DRAM maker, CXMT Corporation (CXMT), formerly known as ChangXin Memory Technologies, is reaping a windfall from price gains in general-purpose memory as the AI boom reshapes the market. In the second quarter of 2026, CXMT posted an operating margin of about 82% on an EBIT basis, ranking near the top among major memory vendors and underscoring how Samsung Electronics, SK Hynix, and Micron's shift of more resources into HBM has made CXMT one of the biggest beneficiaries of the current price surge.
Samsung Electronics and SK Hynix have rejected a proposal to prepay KRW25 trillion (approx. US$18.7 billion) in electricity bills, highlighting the financing challenge facing South Korea as it accelerates semiconductor expansion and the power infrastructure needed to support it.
Chinese artificial intelligence developer Z.ai (formerly Zhipu AI) plans to raise about US$5 billion through a Hong Kong share placement and convertible bond sale, which would give the company fresh capital for next-generation model development, computing infrastructure and business expansion.
