Chinese AI chip developer Enflame said at the World Artificial Intelligence Conference (WAIC) 2026 that it had jointly showcased an AI chip sample with Shanghai Xianfeng Technology using glass-based Chip-on-Panel-on-Substrate (CoPoS) panel-level advanced packaging.
Chinese GPU developer Biren Technology unveiled a next-generation near-packaged optics (NPO) super node at the World Artificial Intelligence Conference (WAIC) 2026, targeting the growing computing demands of large language models and AI agents.
China is considering tighter export controls on artificial intelligence and semiconductor technologies amid intensifying competition with the US in frontier AI. The proposed measures, reported by Financial Times, would also target overseas acquisitions of advanced technology startups and could appear in the next revision of Beijing's export control catalogue.
Ishihara Sangyo Kaisha plans to double production capacity for high-purity titanium dioxide used to make dielectric materials for multilayer ceramic capacitors, as rising AI server power requirements increase demand for the components.
China's exports of rare-earth permanent magnets reached record levels in the first half of 2026, yet the same customs data reveal a market increasingly shaped less by demand than by Beijing's discretion — flowing freely to most of the world, throttled to the US, and, since January, newly restricted to Japan.
Samsung Electronics, SK Hynix and Micron Technology are reportedly scaling back or shelving plans to commercialize internally developed Compute Express Link (CXL) controller chips, shifting more controller work to specialist fabless suppliers while continuing to develop CXL-based memory products.
Chinese AI developer Z.ai has completed a giant data center running exclusively on domestically made chips, a milestone in Beijing's drive to replace restricted Nvidia silicon for future AI development.
South Korean semiconductor materials and parts supplier CMTX has developed a roughly 590mm single-crystal silicon ground ring for chip-etching equipment and plans to begin customer validation as it scales production of the 600mm-class ingots used to make oversized chamber components.
China's AI hardware race is shifting from individual accelerators to supernodes, optical interconnects, advanced packaging and cloud-scale systems.
A powerful rally in memory-chip stocks has stalled as investors reconsider whether record spending on AI data centers could eventually push the DRAM market back into oversupply.
