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Friday 2 January 2026
China's CXMT moves toward IPO with global DRAM share nearing 4%
China's leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to surpass the 4% threshold in the near term, according to its IPO prospectus and market estimates. The move comes as the company accelerates capacity expansion and technology upgrades to close the gap with industry leaders Samsung Electronics, SK Hynix, and Micron Technology in a market dominated by a handful of suppliers
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Friday 2 January 2026
Global auto market faces turning point in 2026 as competition in China intensifies
The global automotive market reached a critical turning point in 2025 amid unprecedented pressures from tariffs, policies, and inflation, triggering preemptive buying before expected downturns. In China, domestic sales are estimated to have hit 27 million units in 2025, nearing the historic peak of 2017
Friday 2 January 2026
CXMT logs first annual profit on DRAM price rebound

ChangXin Memory Technologies (CXMT) returned to profitability in 2025, recording its first full year of net income after a rebound in global DRAM prices and a sharp increase in the value of its chip inventory reversed years of losses. The turnaround followed an extended period of heavy capital spending and came as accelerating demand for artificial intelligence infrastructure tightened global memory supply

Friday 2 January 2026
Samsung aims for 2026 HBM4 mass production after customer validation
Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant seeks to reclaim its lead in the competitive artificial intelligence hardware market
Friday 2 January 2026
South Korea's semiconductor bill risks weakening competitiveness as rivals roll out cash subsidies
South Korea's ruling and opposition parties have reached a preliminary consensus on the Semiconductor Special Act, though its passage may be delayed until 2026, and the law faces criticism for offering comparatively weak support measures against competing countries
Friday 2 January 2026
China demand pushes Nvidia to seek more H200 capacity from TSMC
Nvidia is in talks with TSMC to expand production of its H200 artificial intelligence chips as Chinese technology companies move to secure large orders for 2026, according to Reuters. The negotiations signal that Chinese demand continues to strain global supply chains even as the company faces a complex and unresolved regulatory environment in both Washington and Beijing
Friday 2 January 2026
China sees 2025 chip IPO surge as domestic AI and tech ambitions accelerate
Chinese semiconductor companies are returning to the initial public offering (IPO, including additional and rights offering) market in force, raising funds that are critical for the nation's push toward technological self-reliance and leadership in artificial intelligence
Friday 2 January 2026
Samsung raises 2025 bonuses for DS division amid memory boom
Samsung Electronics' Device Solutions (DS) division is set for a strong 2025, driven by robust performance in general-purpose DRAM and high-bandwidth memory (HBM)
Thursday 1 January 2026
China capacity expansion and weakening end-market demand prompt cost reductions for 28nm process
The 28-nanometer process has become the most popular node among mature processes. It boasts the highest utilization rates and the strongest price support. However, market conditions are changing. Demand for many chips using the 28nm process has weakened, and some chips are beginning to migrate to more advanced process nodes
Thursday 1 January 2026
Samsung reportedly explores side-by-side chip packaging for next-gen Exynos

Samsung Electronics is reportedly developing a new mobile chip packaging method aimed at improving thermal efficiency in its Exynos processors, as the company works to strengthen the competitiveness of its proprietary mobile silicon. The South Korea-based company is exploring a side-by-side packaging technology, internally dubbed SbS, that places the application processor and memory chips adjacent to one another rather than stacking them vertically

Wednesday 31 December 2025
Samsung reportedly poised to clear KRW20 trillion profit mark in 4Q25

Samsung Electronics is reportedly on track to post sharply higher operating profit in the fourth quarter of 2025 as demand tied to artificial intelligence infrastructure lifts memory chip prices. The reports, compiled by South Korean outlets including Korea Economic Daily and EBN and citing industry sources, said Samsung's preliminary fourth-quarter operating profit is expected to exceed KRW20 trillion, a level that would mark the first time a South Korean company has crossed that threshold in a single quarter

Wednesday 31 December 2025
China trade-in subsidies reshape auto market as domestic surge accelerates global export push
China's expanded vehicle trade-in program is set to reinforce its rise as the world's largest auto market, supporting domestic demand while intensifying export pressure overseas. As sales overtake Japan's for the first time, the policy highlights how Beijing is linking consumption stimulus with industrial and geopolitical ambitions
Wednesday 31 December 2025
Z.ai illustrates how open-source AI models are influencing commercial adoption
On December 30, Chinese AI company Z.ai launched a share sale to raise HK$4.35 billion (approx. US$560 million), aiming to become the first large language model (LLM) developer listed in Hong Kong amid a tech IPO surge, with a scheduled listing for January 8, 2026. Meanwhile, Z.ai has recently launched its latest open-source model, GLM-4.7, signaling a shift toward enterprise-focused AI and broader global adoption. As the company prepares for a 2026 IPO, the release highlights the growing influence of independent developers in a market increasingly shaped by hyperscale competitors and ecosystem distribution
Wednesday 31 December 2025
China's CXMT eyes US$4.2B Shanghai IPO to fuel memory chip expansion

China's leading domestic DRAM maker, ChangXin Memory Technologies (CXMT), is seeking to raise CNY29.5 billion (approx. US$4.2 billion) through an IPO in Shanghai, as it looks to upgrade production lines and expand development of advanced memory technologies

Wednesday 31 December 2025
GigaDevice Semiconductor seeks up to HK$4.68B in Hong Kong listing

Chinese chip designer GigaDevice Semiconductor is pressing ahead with plans to list its shares in Hong Kong, seeking to raise as much as HK$4.68 billion (approx. US$601.4 million) in what would be one of the latest semiconductor offerings amid a renewed IPO push by Chinese technology firms

Wednesday 31 December 2025
Geopolitics reshapes tech landscape as Southeast Asia emerges as data center, manufacturing, and AI hub
In 2025, rising geopolitical tensions reshaped global technology and manufacturing, boosting Southeast Asia as a key hub for data centers, advanced manufacturing, and AI. The Johor-Singapore Economic Zone enhanced cross-border integration, strengthening Singapore's "Singapore+1" strategy, while Johor emerged as a major data center cluster amid sustainability concerns