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Thursday 4 June 2026
HBM4 supply in focus as SK's Chey meets TSMC's Wei
SK Group chairman Chey Tae-won met TSMC chairman C.C. Wei in Taiwan on June 3, as SK Hynix and TSMC map out future cooperation in HBM4 base dies, advanced logic processes, and custom AI memory
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Thursday 4 June 2026
Foxconn, SK Group eye deeper AI infrastructure ties in Asia

Foxconn chairman Young Liu met SK Group chairman Chey Tae-won on June 3, as the two companies explore broader cooperation in AI servers, data centers, and energy solutions

Thursday 4 June 2026
Nvidia's Jensen Huang courts Korean giants in robotics expansion

Nvidia CEO Jensen Huang is visiting South Korea this week as the company seeks to expand its partnerships with major Korean conglomerates beyond semiconductors and into robotics, autonomous driving, and industrial automation, ETNews reported

Thursday 4 June 2026
LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples to SK Hynix as it tries to move deeper into high-end semiconductor substrates, according to ZDNet Korea

Thursday 4 June 2026
Huawei's MineHarmony OS links 935 mining devices in China's smart mining push
Huawei's MineHarmony (Mine Harmony OS), a mining-focused industrial Internet of Things operating system jointly developed with China Energy Group, has surpassed 200 ecosystem partners and 935 certified devices, highlighting the growing adoption of domestically developed industrial software in China's mining sector
Thursday 4 June 2026
Japan's robotics legacy faces a new challenge: commercial success
At the close of his keynote address at the Humanoids Summit in Tokyo, Hiroshi Ishiguro — one of the pioneers of humanoid robotics — offered a candid assessment of the industry's progress: despite decades of investment and research, Japan has yet to produce a truly transformative, mass-market application for robotics
Thursday 4 June 2026
Chip test equipment makers hit by FPGA, CPU supply crunch

Semiconductor test equipment makers are facing severe shortages of key components, with lead times for FPGAs, CPUs, GPUs, and driver ICs stretching sharply as AI and data center demand strain the broader chip supply chain, according to The Elec

Thursday 4 June 2026
Kioxia weighs new NAND fab as AI demand drives long-term expansion plans
Kioxia is evaluating the construction of a new NAND flash manufacturing facility at its Kitakami site in Iwate Prefecture, aiming for production to begin after 2029-2030 as the company prepares for sustained growth in AI-driven storage demand
Thursday 4 June 2026
Huawei's Tau Law exposes China's EDA gap; Empyrean advances memory chip design tools
Huawei's recently proposed Tau Law has drawn attention across the semiconductor industry, with the company arguing that chip performance can be improved by reducing the internal signal transmission time constant, known as τ, through multi-layer optimization across devices, circuits, architectures, systems, and algorithms
Wednesday 3 June 2026
Micron's HBM4 push signals bigger Nvidia supply role
Micron Technology may supply more HBM4 memory for Nvidia's next-generation Vera Rubin platform than the market currently expects, as the US memory maker ramps up equipment investment for the new technology, according to sources in South Korea's memory equipment industry
Wednesday 3 June 2026
SK Group weighs pausing SK Siltron sale as AI chip demand lifts wafer strategy
SK Group is reportedly placing AI and semiconductors at the center of its next round of business restructuring, prompting a fresh internal review of the strategic value of SK Siltron, a major global silicon wafer maker. The planned sale of SK Siltron, once seen as a move to improve SK Group's financial structure, now faces uncertainty as the group reconsiders whether to push ahead with the deal
Wednesday 3 June 2026
NAND market hits record as YMTC closes in on global rivals
The global NAND flash memory market reached a record US$46 billion in revenue in the first quarter of 2026, driven by AI infrastructure demand, higher enterprise SSD shipments, and rising NAND prices, according to Counterpoint Research
Wednesday 3 June 2026
Naura pushes into AI chip packaging with first 600mm PLP descum tool
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level packaging into panel-level packaging, according to ICviews and ICsmart
Wednesday 3 June 2026
BYD is building its own chips and looking abroad to make them

China's electric vehicle (EV) makers are increasingly designing their own artificial-intelligence (AI) chips. Manufacturing them, however, remains a more complicated challenge

Wednesday 3 June 2026
Samsung Foundry eyes Anthropic as OpenAI chip project reportedly stalls

Samsung Electronics is seeking to secure major artificial intelligence (AI) logic-chip customers as its reported preliminary work on a custom SoC for OpenAI slows, while Anthropic emerges as another potential opportunity for Samsung Foundry

Wednesday 3 June 2026
Commentary: China shifts exports toward higher-value tech as US trade pressure reshapes supply chains
China moved toward higher-value exports in response to escalating US trade and technology restrictions, reshaping global supply chains and forcing manufacturers to absorb higher costs, executives and research findings showed. The shift, visible in early 2026 trade patterns, came after rounds of US containment measures that began with 2018 tariffs and intensified following the 2025 policy expansion, according to a report commissioned by the Mainland Affairs Council