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Mobile components
  • Passive components in increasingly tight supply
    Taiwan suppliers of passive components and their downstream clients have shown divided views over when the lingering supply shortfalls and price hikes would ease. Though downstream customers expect a significant improvement to come in the next two quarters, suppliers opine that the situations may last...
  • Apple is expected to procure a total of 250-270 million flat panels for the production of iPhone devices in 2018, accord to sources from Taiwan's panel industry.
  • Metal-alloy chassis maker Catcher Technology has announced plans to subscribe to new shares of PCB firm Career Technology for NT$38 (US$1.30) each or a total of about NT$1.13 billion.
  • ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, returned to profitability in the fourth quarter of 2017. EPS for the year came to NT$1.05 (US$0.04), hitting a record low, however.
  • Smartphone-use lens module maker Largan Precision has plans to recruit about 4,500 new employees, with about 1,000 of them to be hired in 2018, according to industry sources.
  • MediaTek's recently-introduced Helio P60 mobile SoC that comes with AI capabilities has been adopted by Oppo and Meizu for their upcoming smartphone models, according to a report from Taiwan's TechNews.
  • With Apple set to launch its in-house designed wireless charging pad AirPower by the end of March, Taiwan suppliers of glass passivated package (GPP) bridge rectifiers needed to support the device expect their shipments to double in the first quarter of 2018 from a quarter earlier and rise further...
  • Mobile SoC specialist MediaTek has reported consolidated revenues of NT$12.71 billion (US$434.2 million) for February 2018, down 24.5% sequentially and about 25% on year.
  • iphone x
    Most Android smartphone vendors, particularly those in China, are still reluctant to adopt 3D sensing technology for their new models to be launched in 2018 due to the persistent high prices of 3D sensing modules, according to sources from Taiwan-based IC-design houses.
  • IEAS
    India Electronics & Semiconductor Association (IESA) held its annual event IESA Vision Summit at the Leela Palace in India's high-tech center Bengaluru at the end of February. Taking place at the Leela Palace - one of India's best hotels featuring Indo-Islamic architectural grandeur, the event...
  • TL Lee, head of MediaTek's wireless communication product business unit
    MediaTek has introduced its new solution to bring artificial intelligence (AI) capabilities to smartphones, and is gearing up for competition in the AI smartphone field.
  • MediaTek president Joe Chen
    There were major management changes at MediaTek last year, showing the IC deisgner's intention to regain its growth momentum. The changes included the appointment of Joe Chen as MediaTek president late in the year.
  • Smartphone-use lens module maker Largan Precision has reported consolidated revenues of NT$2.217 billion (US$75.5 million) for February, the lowest monthly level since February 2016. The sum represents decreases of 36.82% sequentially and 35.37% on year.
  • Taiwan suppliers of compound semiconductor devices are poised to gain significant growth momentum from the increasing market demand for radio frequency (RF) and power amplifier (PA) components along with the efforts of chipmakers to roll out related solutions to support 5G devices such as smartphones,...
  • The low-end market segment offers huge business opporunties
    The Indian handset market has experienced drastic changes in the past two years. Xiaomi has dethroned Samsung, whose six-year development in India ha allowed it to remain the only non-China brand among the top five vendors there. The third, fourth and fifth largest vendors are respectively Lenovo,...
  • The adoption of all-screen displays for smartphones will extend from flagship models to mid-tier and even entry-level models in 2018, pushing the ratio of all-screen models to over 40% of global handset panels shipments in the year, according China-based market research firm All View Cloud (AVC).
  • India's Ministry of Electronic and Information Technology
    With steady market growth and increasing economies of scale, India is an important alternative to China for countries that seek balanced industrial developments and try to avoid overdependence on the China market. Businesses from Taiwan and other countries have been keen to expand into India. Many...
  • The worldwide PCB industry output value grew 11.7% to US$65 billion in 2017, according to data compiled by Taiwan Printed Circuit Association (TPCA). The on-year growth was the highest in nearly 10 years.
  • Micron Technology has announced three new 64-layer, second-generation 3D NAND storage products, which support the high-speed Universal Flash Storage (UFS) 2.1 standard. Micron's new mobile 3D NAND products are available in 256GB, 128GB and 64GB capacities.
  • Himax Technologies has presented Android smartphone samples equipped with the company's 3D sensing total solution at the 2018 Mobile World Congress in Barcelona. The solution is ready for mass production.
  • Merry CFO Huang Chao-feng
    Headset maker Merry Electronics has announced new investments, foraying into the hearing aid device and smart audio solution segments.
  • Smartphone-use lens module maker Largan Precision has released its 2017 financial report, recording consolidated revenues of NT$53.128 billion (US$1.76 billion), growing 9.88% on year; gross margin of 69.37%, up 2.32pp; net operating profit of NT$32.093 billion, up 14.97%; net profit of NT$25.976 billion,...
  • Shipments of smartphone-use application processors in China are expected to decline 18.2% sequentially in the first quarter of 2018, according to Digitimes Research.
  • MediaTek has unveiled its Helio P60 system-on-chip (SoC), the first SoC platform featuring a multi-core AI processing unit (mobile APU) and the firm's NeuroPilot AI technology. The vendor said its Arm Cortex A73 and A53 processor mix delivers up to a 70% CPU performance boost over the Helio P23 and...
  • MediaTek has announced it joined the "China Mobile 5G Device Forerunner Initiative" at GTI summit 2018. The collaboration of MediaTek and China Mobile will encompass applications for 5G device form factors, technical solutions, testing and verification, and product research and development. The joint...

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