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Monday 7 September 2026
Silicon Valley goes physical: how San Jose is building an energy-rich, tariff-mitigated capital for physical AI
As the artificial intelligence revolution outgrows the digital cloud and demands physical form, a major structural transition is quietly reshaping Silicon Valley. While the region has long been celebrated as the world's epicenter for software and venture capital, the massive compute, cooling, and mechanical requirements of robotics and physical AI are pulling tech's center of gravity back to heavy industrial hardware.
Monday 7 September 2026
STMicroelectronics says humanoid robots must clear a trio of hurdles
STMicroelectronics said humanoid robots are still most likely to enter manufacturing first, as the industry works through key hurdles in hand dexterity, edge AI decision-making, and total system cost. The chipmaker made the remarks at a recent press event in Taiwan focused on sustainability, AI data centers, and robotics.
Monday 7 September 2026
Largan expects higher September output after sixth land acquisition
As the countdown to Apple's latest iPhone launch enters its final stretch, market attention is zeroing in on Taiwanese optical component suppliers. Leading lens maker Largan Precision reported its latest operating metrics on September 5, disclosing August revenue of NT$5.012 billion (approx. US$158.2 million)—up 3% month-over-month but down 16% year-over-year—marking a four-month high.
Monday 7 September 2026
Exclusive: Infineon COO says chip shortage recovery will take longer
Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at Semicon Taiwan 2026 that the current global chip shortage is unlike the one during Covid-19 and will take longer to resolve. He also discussed progress on Infineon's new Dresden plant, in-house manufacturing, outsourcing, and the company's global footprint.
Monday 7 September 2026
NEC reportedly ends quantum computer hardware development, shifts focus to annealing
Japan's NEC has halted development of gate-based quantum-computer hardware, marking a strategic retreat from a field the company helped pioneer, while continuing to invest in quantum annealing and quantum-inspired computing services.
Monday 7 September 2026
India says it cannot build electronics without China and has started easing the rules to prove it
India is selling its semiconductor build-out abroad as a hedge against an over-concentrated supply chain. The officials running it are unusually candid that the hedge cannot be built without the country it hedges against. Asked at a media briefing in Taipei on 4 September how New Delhi views the role of Chinese companies in India's chip and electronics supply chain, S. Krishnan, secretary of India's Ministry of Electronics and Information Technology, opened with a line that would be politically awkward in most capitals: "We need to be realistic."
Monday 7 September 2026
Anthropic IPO set to put AI governance under public-market scrutiny
Anthropic is moving toward a potential blockbuster stock-market debut this fall, but the company's unusual governance structure could become an important issue for investors alongside its growth prospects.
Monday 7 September 2026
Chicony Power's August revenue dips as AI server and satellite demand strengthens
Chicony Power Technology Co. said its August revenue slipped as a memory shortage hit demand for notebook power supplies. Still, stronger orders for AI server and satellite communications power signaled broader growth opportunities for global technology supply chains and future data center investment.
Monday 7 September 2026
Foxconn revenue climbs on AI server demand, outlook improves
Foxconn said August sales rose sharply from a year earlier as demand for AI servers and related hardware continued to lift its cloud and networking business. The latest update suggests the global electronics supply chain remains supported, even as investors closely watch shifts in trade, policy, and consumer demand.
Monday 7 September 2026
Machine builders flood SEMICON 2026 to grow local chip tools
Taiwan's machinery industry is pushing to turn its semiconductor advantage into a domestic equipment supply chain, as more than 100 member companies join SEMICON Taiwan 2026 and the Taiwan Association of Machinery Industry (TAMI) calls for broader industry upgrading. The association voiced that appeal at a forum on September 3, saying Taiwan should leverage its semiconductor strength to lift traditional industries and continue nurturing a homegrown semiconductor equipment supply chain without relying on overseas sources.
Monday 7 September 2026
India roundup: India expands chip ambitions with full Semicon 2.0 notification

India's technology sector is gaining momentum across semiconductors, connectivity, AI payments, PCs, tablets and refurbished smartphones, as policy support and local manufacturing attract investment. However, supply-chain diversification, margin pressure, cautious demand and VinFast's manufacturing pause highlight challenges facing India's broader technology ambitions.

Monday 7 September 2026
Acer hedges memory price shock with local AI, diversification
Acer Chairman and CEO Jason Chen said Taiwan is not only a global hub for AI hardware manufacturing and technology, but also an important source of capital, as many firms issue bonds to raise funds. He said Acer has already issued bonds worth NT$20 billion (US$630.7 million), adding that "Taiwan's money" is not only benefiting the local market but is spreading around the world.
Sunday 6 September 2026
Tongtai doubles semiconductor orders on AI data-center demand
Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent years. The group is extending its traditional machine tool expertise into hard and brittle material processing, advanced packaging, and smart manufacturing production-line solutions required for semiconductor fabrication.
Saturday 5 September 2026
Interview: Agility Robotics CTO discusses the future of collaborative humanoid robotics
Excitement is growing among investors and the public over the rising capabilities of humanoid robots. Yet as robot makers seek to turn their lab-built innovations into real-world commercial tools, one key bottleneck has emerged: safety.
Saturday 5 September 2026
SiPh, optical lens demand ignite laser race
Silicon photonics (SiPh) is emerging as a core theme at SEMICON Taiwan 2026, and while the sector is still in an early, fast-growing stage, production-line investments are already under way. As optical makers move into co-packaged optics (CPO), the source and capability of laser equipment are becoming critical to whether they can secure market share.
Saturday 5 September 2026
Google TPU splits training, inference as CPU becomes next focus
As AI model training, inference, and AI agent workloads continue to grow, AI accelerators are increasingly being optimized for different tasks. Amin Vahdat, Google's senior vice president and chief technologist for AI and infrastructure, said at SEMICON Taiwan 2026 that if a specific workload reaches sufficient scale and investment in custom chips is economically viable, Google could develop additional dedicated chips for different computing needs.
Saturday 5 September 2026
Adata expands AI business with TRUSTA, Industrial brands
ADATA Technology said it will integrate the products, technologies and solutions of its TRUSTA and ADATA Industrial brands to target enterprise servers, edge computing, system integration, smart homes, mobile devices and wearables. This comes as AI infrastructure, edge computing and smart systems accelerate. The memory module maker aims to expand AI and intelligent application opportunities by focusing on business use cases.
Friday 4 September 2026
The 'Copper Wall': inside the physical bottlenecks threatening to melt AI supercomputing boom
A decade ago, when Nvidia CEO Jensen Huang was developing the world's first NVLink-enabled deep learning system, the DGX-1, the tech industry was deeply skeptical about the future of artificial intelligence (AI).
Friday 4 September 2026
Lite-On makes US$170 million strategic investment in DCX for AI cooling push
Lite-On Technology announced a strategic investment in Polish liquid cooling solutions provider DCX Polska, also known as DCX Liquid Cooling Systems. The deal will give Lite-On approximately a 25% stake in DCX upon completion, with a total transaction value of roughly US$176 million.
Friday 4 September 2026
Ennostar accelerates AI optical communications with micro LED
Ennostar is pushing into AI high-speed optical communications and says Taiwan's full supply-chain ecosystem could bring micro LED into commercial use sooner than expected. Andrew Tsai, associate vice president of the company's Advanced R&D Center, said micro LED's short-distance optical transmission advantages have already been proven, with mass production now the main hurdle.
Friday 4 September 2026
China Motor unit Greentrans launches Taiwan-made quadruped robots
China Motor Corp. subsidiary Greentrans unveiled its next-generation quadruped robots, GT5X and GT3X, at SEMICON Taiwan 2026 amid growing demand for AI applications, smart semiconductor fabs and unmanned operations. The company said the two models are designed to build Taiwan's core robotics technologies and advance local production across the supply chain.
Friday 4 September 2026
Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab
The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners to dismantle organizational silos or face crippling inefficiencies, top industry executives said at SEMICON Taiwan 2026.
Thursday 3 September 2026
Niching validates 500-ton press for large heat spreaders
Niching Industrial is expanding its heat-spreader capacity as AI and high-performance computing demand pushes up orders across the global semiconductor supply chain. The company said larger stamping equipment, tighter plating control, and future liquid-cooling technologies are being developed to support chips that generate more heat in data centers worldwide.
Thursday 3 September 2026
Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools
Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift is increasing the need for metrology, inspection, and failure analysis, and Zeiss is planning a semiconductor innovation center in northern Taiwan to support validation and application development.
Thursday 3 September 2026
Win Semiconductors unveils 0.1μm GaN for AI, satellite links
Taiwanese compound semiconductor maker WIN Semiconductors said on September 1, 2026, that compound semiconductors are the backbone of AI and satellite communications, as it unveiled 0.1μm GaN technology aimed at higher-speed transmission. Senior associate vice president Chuck Huang made the remarks at the NExT Forum.