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May 20, 17:56
Intel has unveiled its new Xeon scalable processors.
IN THE NEWS
Tuesday 29 March 2022
Immersion liquid cooling solutions to increasingly penetrate datacenters
Immersion liquid cooling solutions are poised to gain ground in datacenter applications as major international datacenter operators and server processor vendors are all aggressively...
Thursday 23 September 2021
Intel to hold groundbreaking ceremony for new fabs on September 24
Intel is scheduled to hold a groundbreaking ceremony for the construction of two new fabs in Arizona on September 24. Company CEO Pat Gelsinger and local government officials will...
Wednesday 30 June 2021
Fierce competition among HPC chip suppliers to benefit TSMC
Foundry market leader TSMC has been pinpointed as a major beneficiary of the increasingly fierce competition among HPC chip providers, according to market sources.
Tuesday 27 April 2021
Server ODMs expect double-digit shipment growth in 2Q21
ODMs including Quanta Computer and Wiwynn will see their shipments for servers register double-digit sequential increases in the second quarter of 2021, according to industry sourc...
Tuesday 27 April 2021
PCB supply chain eyeing replacement demand stoked by new server CPUs
Taiwan's PCB supply chain players are optimistic that they will receive a boost from the upcoming server replacement demand to be driven by rollouts of new processors by Intel, according...
Tuesday 27 April 2021
Intel to defend market share with new 10nm server chips
Intel with its new-generation 10nm server chips will be striving to defend its market dominance.
Friday 9 April 2021
Server industry sees component supply growing tighter in 2Q21
Server components including ICs, passive components, cables and chassis have seen supply growing tighter in the second quarter, according to sources from the server supply chain.
Thursday 8 April 2021
Microsoft unveils liquid cooling solution for datacenters
Microsoft has announced to begin implementing a two-phase immersion liquid cooling solution that is co-developed with Wiwynn, to its datacenter in the state of Washington for testi...
Friday 26 March 2021
Samsung develops HKMG-based DDR5 memory
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module based on high-K metal gate (HKMG) process technology, according to the company.
Wednesday 27 January 2021
Cooling module makers expect shipments for new-gen servers to boost ASPs
Cooling module makers expect shipments for new-generation servers based on Intel's 10nm Ice Lake processors to push up their product ASPs.
Wednesday 13 January 2021
Server makers turn optimistic about 2021 on Intel new processors
With Intel ramping up its 10nm Ice Lake Xeon server processor output, Taiwan's server makers have turned optimistic about their shipment prospects for 2021 and may embrace the strongest-ever...
Monday 24 August 2020
Six pillars bolstering Moore's Law: Q&A with Intel chief architect Raja Koduri
At the inaugural Architecture Day held in late 2018, a new technical group headed by Intel senior vice president and chief architect Raja Koduri first came up with six strategic pillars...
Monday 20 January 2020
PC market still full of opportunities: Q&A with Frank Soqui, VP of Client Computing Group and GM of Gaming Division at Intel
Intel currently still holds an 80% share in the global PC market, but the growth of the CPU giant's PC platform business has weakened, thanks to prolonged shortages of its processors...
Wednesday 8 January 2020
Intel showcases AI tech at CES 2020
Intel has demonstrated breakthroughs in artificial intelligence (AI) that pave the way for autonomous driving and a new era of mobile computing innovation at CES 2020, showcasing...
Tuesday 19 November 2019
Intel unveils new GPU architecture and oneAPI software stack
Intel, addressing the increasing use of heterogeneous architectures in high-performance computing, has announced a new category of discrete general-purpose GPUs optimized for AI and...
Friday 9 August 2019
Intel Xeon Platinum 9200 server CPU
Intel has announced its next-generation Intel Xeon Scalable processor family (codename Cooper Lake) will offer customers up to 56 processor cores per socket and built-in AI training acceleration in standard socketed Intel Xeon Scalable processor offerings with availability starting in the first half of 2020. The breakthrough platform performance delivered within the high-core-count Cooper Lake processors will leverage the capabilities built into the Intel Xeon Platinum 9200 series.
Thursday 6 June 2019
Apple Mac Pro workstation
The Apple Mac Pro features Xeon processors up to 28 cores, with 64 PCI Express lanes for performance and bandwidth. It provides over 300W of power. The Mac Pro features a six-channel memory architecture, 12 physical DIMM slots for up to 1.5TB of memory. It is also equipped with a graphics card with up to 56 teraflops of graphics performance in a single system. Its graphics expansion architecture, the Apple MPX Module, features Thunderbolt integration and over 500W of power. The Mac Pro's graphics options start with the Radeon Pro 580X and can be upgraded to two Vega II Duos for a 56 teraflops of graphics performance and 128GB of video memory.
Thursday 22 February 2018
Intel Xeon D-2100 processor
Intel has introduced the new Intel Xeon D-2100 processor, a system-on-chip (SoC) processor architected to address the needs of edge applications and other data center or network applications constrained by space and power. The Intel Xeon D-2100 processor extends the Xeon Scalable platform from the heart of the data center to the network edge and web tier, where network operators and cloud service providers face the need to continuously grow performance and capacity without increasing power consumption, said the vendor. Intel Xeon D-2100 processors will enable greater performance and hardware-enhanced security to the network edge in support of the growing number of workloads that demand more compute, analytics and data protection closer to endpoint devices. For example, the new processors will help communications service providers CoSPs offer multi-access edge computing (MEC), which allows software applications to tap into local content and real-time information about local-access network conditions, reducing mobile core network of network congestion. This can enable uses cases ranging from 5G-connected cars, smart stadiums, and retail and medical solutions, said Intel.
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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