Semiconductor giant Broadcom has introduced the third generation of its co-packaged optics (CPO) technology, significantly advancing the capabilities of high-speed data transmission critical to artificial intelligence (AI) infrastructure. The new solution doubles the transmission speed to 200 Gbps per lane, while dramatically improving energy efficiency and cost.
The global surge in DRAM prices, combined with the increasing momentum of artificial intelligence (AI) development in the Middle East, positions South Korea's memory chip giants—Samsung Electronics and SK Hynix—to benefit significantly from the renewed growth in the semiconductor sector. With both companies at the forefront of this market shift, they are set to capitalize on the rising demand for advanced memory solutions driven by AI innovations and broader technological trends.
For the past two years, the AI revolution has resembled a software arms race: the bigger the model, the better the odds of winning. But in 2025, the race is shifting from code to concrete. The new battleground is physical, industrial, and strategic—the rise of the AI factory.
As Apple expands in India and Trump pushes for US production, a global tug-of-war over manufacturing and supply chains underscores the shifting dynamics between India, China, and the US.
Display driver IC design company Ilitek has officially launched the integration of MediaTek's TCON business, a strategic acquisition that is expected to contribute immediately to revenue and gradually transform its product portfolio and market positioning.
