CONNECT WITH US
Global supply chain: Key components
Key components news coverage
IN THE NEWS
Monday 29 January 2018
MCU firm Nuvoton sees profits climb to 7-year high
Taiwan-based Nuvoton Technology, a logic IC subsidiary of Winbond Electronics specializing in MCU and PC peripherals, saw its net profits for 2017 climb to a seven-year high of NT$688...
Monday 29 January 2018
Globalfoundries 45nm RF SOI offering ready for volume production
Globalfoundries' 45nm RF SOI (45RFSOI) technology platform has been qualified and is ready for volume production, according to the pure-play foundry. Several customers are currently...
Monday 29 January 2018
MediaTek likely to land Wi-Fi ASIC orders for HomePad, says paper
MediaTek is expected to land Wi-Fi ASIC orders for the next-generation HomePad devices to be launched by Apple in 2019, according to a Chinese-language Economic Daily News (EDN)...
Monday 29 January 2018
Qualcomm to pay Taiwan antitrust fines in installments
Taiwan's Fair Trade Commission (FTC) has approved Qualcomm's application to pay a NT$23.4 billion (US$803.09 million) antitrust fine in 60 installments in five years.
Monday 29 January 2018
Lite-On Semi ramping up GPP bridge rectifier shipments
Lite-On Semiconductor, a maker of discrete and analog IC components, is expected to see multifold increases in its shipments of glass passivated package (GPP) bridge rectifiers for...
Monday 29 January 2018
Samsung, Apple remain top semiconductor customers
Samsung Electronics and Apple remained the top two semiconductor chip buyers in 2017, representing 19.5% of the total worldwide market, according to Gartner. Samsung and Apple together...
Friday 26 January 2018
Andes Technology sees CPUs immune to security bugs
Taiwan-based processor IP provider Andes Technology has stressed that following a thorough review, none of its CPU products are affected by either Meltdown or Spectre bugs, according...
Friday 26 January 2018
Qualcomm signs purchase MoU with 4 China smartphone vendors
Qualcomm has signed memoranda of understanding (MoU) with four China-based smartphone vendors: Lenovo, Oppo, Vivo and Xiaomi for the purchase of Qualcomm's RF front-end (RFFE) components...
Friday 26 January 2018
China-based HKC to invest in 11G LCD line
HKC is planning to invest CNY40 billion (US$6.36 billion) to build an 11G LCD panel production line in Henan, China, according to industry sources. The China-based HKC's move comes...
Friday 26 January 2018
Elan gearing up for AI
Fabless IC firm Elan Microelectronics has been involved in the development of artificial intelligence (AI) chips with plans to assign a team of over 100 engineers to enhance further...
Friday 26 January 2018
Taiwan IC designers expected to post substantial revenue growth in January
Taiwan-based IC design houses are expected to post substantial sequential growth in January revenues thanks to a pull-in of orders from China, according to industry sources.
Friday 26 January 2018
Toppan installs advanced photomask equipment at Shanghai plant
Toppan Photomasks has announced that additional investment will be made in new, leading-edge equipment for mass production of advanced photomasks at Toppan Photomasks Company Shanghai...
Friday 26 January 2018
North American semi equipment industry posts strong December billings
North America-based manufacturers of semiconductor equipment posted US$2.39 billion in billings worldwide in December 2017 (three-month average basis), according to SEMI. The billings...
Friday 26 January 2018
Semiconductor shipments to exceed 1 trillion devices in 2018, says IC Insights
Annual semiconductor unit shipments (integrated circuits and opto-sensor-discretes, or O-S-D, devices) are expected to grow 9% in 2018 and top one trillion units for the first time,...
Thursday 25 January 2018
Smaller foundry houses upbeat about MOSFET-driven revenues in 2018
Second-tier wafer foundry houses including Episil Technologies, Mosel Vitelic and Hejian Technology are all optimistic about their revenue prospects for 2018 as they have enjoyed...