CONNECT WITH US
Global supply chain: Emerging tech, businesses
Emerging tech, businesses news coverage
IN THE NEWS
Monday 20 July 2026
Jensen Huang's week in Tokyo: what Nvidia's Japan trip reveals about future partners
Nvidia founder and CEO Jensen Huang spent last week in Tokyo meeting government officials, robotics makers and dozens of supply chain executives, as the company deepens its push into...
Monday 20 July 2026
China pushes AI agent interoperability and space computing at WAIC 2026

China unveiled two major AI initiatives at the 2026 World AI Conference (WAIC) in Shanghai, highlighting efforts to standardize AI agent...

Monday 20 July 2026
Nvidia grappling with internal compute needs amid GPU shortages
TSMC recently posted strong earnings, helped in large part by Nvidia orders, but both companies are grappling with chips inside their own operations: TSMC says they are too expensive,...
Monday 20 July 2026
Alibaba pitches Qwen3.8 Max as 'second only to Fable 5' — without the benchmarks to prove it
Alibaba's decision to rank its newest flagship directly against a single American system — describing Qwen3.8 Max as "second only to" Anthropic's Claude Fable 5 — underscores...
Monday 20 July 2026
Moonshot reportedly eyes IPO after Kimi K3 success forces cap on new users
Moonshot AI's latest model launch is rapidly reshaping perceptions of China's artificial intelligence (AI) industry, with overwhelming demand forcing the company to suspend new consumer...
Monday 20 July 2026
BYD targets Japan's Kei-car stronghold with low-cost EV challenge
BYD is pressing ahead with plans to enter Japan's all-electric kei-car market, stepping up promotional activity and appointing a brand ambassador in a sign of growing confidence about...
Monday 20 July 2026
Beyond Taipower: AI, semiconductors, and overseas grids reshape Taiwan's electromechanical supply chain
Taiwan's heavy-electrical and electromechanical industry is entering a new growth phase as demand expands beyond its long-standing reliance on Taiwan Power (Taipower). While Taipower's...
Monday 20 July 2026
Hotai Leasing plans August listing as mobility business expands
Hotai Leasing Co., Ltd. plans to list its shares in early August 2026 as the Taiwan-based vehicle leasing provider expands its mobility and used-car businesses.
Monday 20 July 2026
MiTAC packs 96 AMD GPUs into 52U liquid-cooled rack
MiTAC Computing Technology, a subsidiary of MiTAC Holdings, showcased its server lineup and high-density liquid-cooled rack solutions at the 2026 World Artificial Intelligence Conference...
Sunday 19 July 2026
Three-tier humanoid robot architecture shift opens edge AI opportunities
The humanoid robot industry is converging on a "big brain, small brain" architecture, with AI compute shifting from the cloud to the edge, and even to hands, feet, and other endpoints...
Sunday 19 July 2026
Memory must adopt foundry model to fix AI inference bottleneck, says Korean scholar

AI development is driving larger data transfers and higher GPU efficiency demands, pushing memory toward customization and prompting...

Sunday 19 July 2026
The AI investment race is building its own bust, BIS paper warns
The competitive race to dominate artificial intelligence is driving technology giants to over-build computing capacity by roughly half again more than is economically efficient —...
Saturday 18 July 2026
China positions AI weather-warning system MAZU as a public good for the Global South, targeting 30 countries in five years
China used the 2026 World Artificial Intelligence Conference (WAIC) in Shanghai to reframe its AI-driven weather early-warning system, MAZU, from a domestic meteorological tool into...
Saturday 18 July 2026
As AI expands nanotech, Samsung fortifies ecosystem and LG pivots to chip equipment
Nanotechnology is increasingly seen as a key enabler in the AI era, with competition broadening from semiconductors, manufacturing to home appliances. At Nano Korea 2026 held in Goyang,...
Saturday 18 July 2026
JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift
As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...