Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module based on high-K metal gate (HKMG) process technology. Delivering more than twice the performance of DDR4 at up to 7,200Mbps, the new DDR5 will be capable of orchestrating the most extreme compute-hungry, high-bandwidth workloads in supercomputing, artificial intelligence (AI) and machine learning (ML), as well as data analytics applications. Samsung indicated the new DDR5 utilizes highly advanced HKMG technology that has been traditionally used in logic semiconductors. With continued scaling down of DRAM structures, the insulation layer has thinned, leading to a higher leakage current. By replacing the insulator with HKMG material, Samsung's DDR5 will be able to reduce the leakage and reach new heights in performance. This new memory will also use approximately 13% less power, making it especially suitable for datacenters where energy efficiency is becoming increasingly critical. Leveraging through-silicon via (TSV) technology, Samsung's DDR5 stacks eight layers of 16Gb DRAM chips to offer the largest capacity of 512GB. TSV was first utilized in DRAM in 2014 when Samsung introduced server modules with capacities up to 256GB.

Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The GeForce RTX 3090, 3080 and 3070 GPUs offer up to 2x the performance and 1.9x the power efficiency over the previous Turing-based generation. The GPUs take advantage of the second-generation Nvidia RTX PC gaming platform to provide real-time ray tracing and AI gaming. The RTX 30 series was unveiled during a virtual launch event by Nvidia founder and CEO Jensen Huang, who also announced that Fortnite is turning on RTX real-time ray tracing, adding four ray-traced features for a more immersive gaming experience, including reflections, shadows, global illumination and ambient occlusion.

Intel has announced its next-generation Intel Xeon Scalable processor family (codename Cooper Lake) will offer customers up to 56 processor cores per socket and built-in AI training acceleration in standard socketed Intel Xeon Scalable processor offerings with availability starting in the first half of 2020. The breakthrough platform performance delivered within the high-core-count Cooper Lake processors will leverage the capabilities built into the Intel Xeon Platinum 9200 series.