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NEWS TAGGED 18-INCH WAFER
Friday 24 February 2017
Transition to 18-inch wafers remains years away, says Applied
It is unlikely to see 450mm (18-inch) wafer fabrication technology become mature over the next three years, according to Applied Materials CEO Gary Dickerson. The chipmaking industry's...
Thursday 28 August 2014
EPA passes initial environmental impact assessment for TSMC planned 18-inch fab
A special panel of the Environmental Protection Administration (EPA) has approved the environmental impact assessment for a piece of land designated for construction of an 18-inch...
Thursday 12 June 2014
18-inch wafer foundry process likely to delay to 2018
The arrival of the era of 18-inch wafer foundry processes may not come until 2018 as Intel reportedly has slowed down the development of 18-inch wafers, while semiconductor equipment...
Wednesday 11 September 2013
ASML lands rising EUV equipment orders; looking to expand capacity
ASML's new EUV system, the NXE:3300B, has obtained 18 orders. In order to meet customer demand, the lithography tool vendor is looking to boost its production capacity for EUV tool...
Thursday 4 July 2013
Nikon lands 450mm immersion scanner order
Nikon has announced that the company will provide the Research Foundation for the State University of New York with a 450mm wafer ArF immersion scanner, with shipment scheduled in...
Friday 10 May 2013
TSMC reiterates plans for 18-inch wafer manufacturing
Taiwan Semiconductor Manufacturing Company (TSMC) has reiterated plans to build its first 450mm (18-inch) pilot production lines, which will offer FinFET transistor technology at...
Friday 11 January 2013
Equipment maker Gudeng posts 24.6% sales growth in 2012
IC front-end tool supplier Gudeng Precision Industrial has reported revenues of NT$930 million (US$32.1 million) for 2012, up 24.55% on year.
Wednesday 12 December 2012
ASML CEO to attend annual TSMC supply chain forum
Foundry chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) will hold its annual supply chain management forum for 2012 on December 14. Participants will include Eric Meurice,...
Wednesday 5 December 2012
Intel progressing in development of 14nm technology, says CTO
Intel CTO Justin Rattner on December 4 said that Intel's development of 14nm technology is on schedule with volume production to kick off in one to two years and development of 18-inch...
Thursday 1 November 2012
Semiconductor equipment maker Gudeng to post another record sales quarter
Revenues at IC front-end tool supplier Gudeng Precision Industrial are likely to register another sequential increase in the fourth quarter of 2012, after climbing to record high...
Wednesday 24 October 2012
TSMC to build pilot line for development of 18-inch wafer and 7nm process, says paper
Taiwan Semiconductor Manufacturing Company (TSMC) has bought a land lot of 14.32 hectares in the Chunan base of Hsinchu Science Park (HSP) for NT$3.2 billion (US$109.1 million), and...
Wednesday 5 September 2012
TSMC looks to build pilot 18-inch wafer line in 2016-2017
Taiwan Semiconductor Manufacturing Company (TSMC) is on track in the development of 18-inch (450mm) wafers with the possibility to build a pilot line in 2016-2017 followed by mass...
Tuesday 28 August 2012
Mass production of 18-inch wafers may extend to 2018
Despite having investment from Intel, TSMC and Samsung Electronics, the 18-inch wafer generation anticipated by ASML may be delayed from 2016 to 2018. In addition, non-ASML equipment...
Monday 6 August 2012
TSMC joins Intel to play part of ASML co-investment program
TSMC on August 5 announced that the firm has joined ASML's customer co-investment program, aimed at accelerating the development and industrialization of key next-generation semiconductor...
Tuesday 12 June 2012
Taiwan government to buy land for TSMC 18-inch plant, says paper
Taiwan's Council for Economic Planning and Development (CEPD) has approved a project to assist Taiwan Semiconductor Manufacturing Company (TSMC) to construct an 18-inch wafer fab...