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    AI infrastructure faces four hurdles: Power, construction, technology, funding
    17min ago
    Intel Foundry targets optical communications with 12-inch InP technology
    6h 26min ago
    China’s RISC-V targets servers as XuanTie chip shipments exceed 6 billion
    6h 26min ago
    DAMO Academy expands into autonomous driving and robotics with XuanTie processors
    6h 26min ago
    Samsung Electro-Mechanics expands long-term contracts to package substrates
    6h 26min ago
    SDC advances MPO and inkjet-printed OLED in parallel
    6h 26min ago
    NEWS TAGGED LASER
    Monday 19 October 2026
    MKS' Atotech and ESI to Showcase Advanced PCB Solutions at TPCA 2026

    MKS Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands Atotech, offering process chemicals,...

    Wednesday 14 October 2026
    Wiwynn unveils CPO compute system with GUC and Ayar Labs
    Wiwynn Corporation, CPO solutions provider Ayar Labs and Global Unichip Corp. (GUC) will stage the first live demonstration of an integrated compute system with real-time telemetry...
    Monday 12 October 2026
    Lumentum says AI laser capacity is sold out into 2029 as hyperscalers help fund expansion
    The shortage of indium phosphide (InP) lasers that feed AI data center optics is lengthening, not easing. Lumentum now says its capacity is spoken for into early 2029, and its largest...
    Friday 2 October 2026
    Inside Volantis's photonic bid to break AI's memory wall after US$88 million raise
    Semiconductor startup Volantis has raised US$88 million in Series A funding to develop an AI inference architecture that uses photonic interconnect technology to address memory bottlenecks...
    Friday 2 October 2026
    A look at the startup winning Nvidia, Intel backing for AI scale-up optics
    Silicon Valley data center optical interconnect startup CScale emerged from stealth on September 30 after raising US$145 million in a Series C funding round backed by Nvidia and Intel...
    Monday 28 September 2026
    Beyond ASML: China rethinks EUV race with light-source strategy
    China is trying to broaden the definition of the extreme ultraviolet (EUV) race. Rather than focusing only on building a domestic equivalent to ASML's lithography platform, Chinese...
    Thursday 17 September 2026
    Trumpf eyes glass as AI demand drives packaging innovation
    At the China International Optoelectronic Expo (CIOE), representatives from German laser and plasma generator maker Trumpf offered a glimpse into the company's push to extend its laser...
    Tuesday 15 September 2026
    Sivers Semiconductors positions laser arrays as solution to copper's limits

    At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the...

    Tuesday 15 September 2026
    Inside CIOE: takeaways from China's biggest optoelectronics show
    Last week, from September 9 to 11, thousands of vendors gathered for an enormous trade show in the Chinese tech hub of Shenzhen. At the China International Optoelectronic Expo (CIOE),...
    Sunday 13 September 2026
    AI server tracker: Taiwan optics race beyond 1.6T

    Taiwan's optical communications supply chain is entering a more consequential phase of the AI infrastructure cycle. Demand is broadening...

    Tuesday 8 September 2026
    CIOE 2026: FIT wins Amphenol patent license, expands AI interconnect push
    Foxconn Interconnect Technology (FIT) announced on September 7, 2026, that it has secured a patent license from competitor Amphenol for high-speed backplane connector solutions. The...
    Monday 7 September 2026
    Taiwan-Netherlands silicon photonics team targets 1.6T DR8 in 2026, 3.2T optical links next
    AI data center demand is accelerating the shift to faster optical interconnects, putting transmission speed, power efficiency, and packaging integration at the center of next-generation...
    Saturday 5 September 2026
    SiPh, optical lens demand ignite laser race
    Silicon photonics (SiPh) is emerging as a core theme at SEMICON Taiwan 2026, and while the sector is still in an early, fast-growing stage, production-line investments are already...
    Friday 4 September 2026
    CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
    To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures,...
    Thursday 3 September 2026
    TRUMPF targets advanced packaging as AI chip makers chase higher density, better cooling
    As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in...
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    BIZ FOCUS
    Oct 20, 08:00
    CHT Leverages Hackathon to Cultivate AI Solutions for Urban Governance
    Tuesday 20 October 2026
    Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency
    Tuesday 20 October 2026
    CES 2027 Welcomes First-Ever Chilean Global Pavilion
    Monday 19 October 2026
    GMIF2026: AI Inference Drives Token Factory and System Memory Rethinking