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    South Korea updates AI safeguards as Microsoft sets shutdown rules
    17min ago
    BYD's 2027 triple play could rewrite the EV race
    24min ago
    China optical transceivers avoid US FCC curbs as NPO, CPO battle for high-speed interconnect supremacy
    26min ago
    NEWS TAGGED LASER
    Tuesday 15 September 2026
    Sivers Semiconductors positions laser arrays as solution to copper's limits

    At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the...

    Tuesday 15 September 2026
    Inside CIOE: takeaways from China's biggest optoelectronics show
    Last week, from September 9 to 11, thousands of vendors gathered for an enormous trade show in the Chinese tech hub of Shenzhen. At the China International Optoelectronic Expo (CIOE),...
    Sunday 13 September 2026
    AI server tracker: Taiwan optics race beyond 1.6T

    Taiwan's optical communications supply chain is entering a more consequential phase of the AI infrastructure cycle. Demand is broadening...

    Tuesday 8 September 2026
    CIOE 2026: FIT wins Amphenol patent license, expands AI interconnect push
    Foxconn Interconnect Technology (FIT) announced on September 7, 2026, that it has secured a patent license from competitor Amphenol for high-speed backplane connector solutions. The...
    Monday 7 September 2026
    Taiwan-Netherlands silicon photonics team targets 1.6T DR8 in 2026, 3.2T optical links next
    AI data center demand is accelerating the shift to faster optical interconnects, putting transmission speed, power efficiency, and packaging integration at the center of next-generation...
    Saturday 5 September 2026
    SiPh, optical lens demand ignite laser race
    Silicon photonics (SiPh) is emerging as a core theme at SEMICON Taiwan 2026, and while the sector is still in an early, fast-growing stage, production-line investments are already...
    Friday 4 September 2026
    CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
    To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures,...
    Thursday 3 September 2026
    TRUMPF targets advanced packaging as AI chip makers chase higher density, better cooling
    As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in...
    Wednesday 2 September 2026
    TCL CSOT bets on InP laser chips as supply tightens
    Indium phosphide (InP) is emerging as one of the tightest supply constraints in AI data-center optical interconnects. Lumentum CEO Michael Hurlston has said publicly that the supply-demand...
    Tuesday 1 September 2026
    Trymax lands multi-year AOI order as InP laser capacity race tightens
    Applied Optoelectronics (AOI) has placed a multi-year purchase order with Dutch equipment maker Trymax Semiconductor Equipment for plasma ashers and UV curing systems destined for...
    Tuesday 1 September 2026
    Taiwan's G2C+ Alliance members target global markets
    Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON

    Tescan will participate in SEMICON Taiwan 2026 from September 2 to 4 at Booth R8201, 4F, Taipei Nangang Exhibition Center Hall 2 (TaiNEX 2). Under the theme "Streamlined...

    Monday 31 August 2026
    Lightel posts record first-half revenue, profit as LEO satellite demand rises
    Lightel Technologies reported record first-half results for 2026, with consolidated revenue reaching NT$590 million (US$18.7 million), net profit at NT$107 million, and earnings per...
    Monday 31 August 2026
    USI advances optical interconnect push with ELSFP laser module
    Universal Scientific Industrial (USI), part of ASE Technology Holding, is expanding its optical interconnect footprint for AI data centers. EugenLight Technologies, in which USI holds...
    Monday 24 August 2026
    CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
    Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
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    GlobalExhibition
    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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