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REALTIME NEWS
Nanoimprint tools see a shift from round to square substrates
Tomorrow's Headlines
5h 37min ago
Taiwanese chipmakers step up visual sensing and motor drive for future robot market
Tomorrow's Headlines
5h 37min ago
Shenzhen Huacheng XinGuang sees microLED optical interconnect is viable for data centers
Tomorrow's Headlines
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Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans
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Analysis: Is China's ASML gambit worth the cost as rivals pull ahead on EUV?
Tomorrow's Headlines
5h 37min ago
NEWS TAGGED SEMICONDUCTOR
Wednesday 19 August 2026
BYD leverages in-house semiconductors to power next phase of automotive intelligence; smart driving chip roadmap moves towards 4nm SoC
Introduction
Thursday 6 August 2026
Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments
Introduction
Wednesday 5 August 2026
Taiwan, US, and China OSAT strategies diverge as industry shifts toward capacity expansion, supply chain restructuring, and next-generation packaging
Introduction
Friday 24 July 2026
TGV still faces technical barriers; CoPoS commercialization not likely until 2030
Introduction
Friday 3 July 2026
Megawatt AI Racks: Infrastructure Evolution & Wide-Bandgap Power Semiconductor Opportunities by 2030
Introduction
Friday 3 July 2026
Competing Paths in Data Center Optics: XPO Could Beat CPO to Mass Production in 2027
DIGITIMES notes that Arista Networks unveiled XPO at The Optical Fiber Communication Conference and Exhibition 2026 (OFC 2026). Unlike CPO, which is associated with more disruptive...
Friday 5 June 2026
Global top-3 memory maker status, 2Q 2026: Surging prices and AI demand lock in a strong memory seller's market
Introduction
Tuesday 2 June 2026
Display to semiconductor: Panel makers weaponize large glass substrates for FOPLP
Introduction
Monday 25 May 2026
Taiwan, China wafer foundry industry, 2Q 2026: Cross-strait revenues to surge over 25%
Introduction
Wednesday 13 May 2026
Global smartphone AP industry, 1Q 2026: Memory price hikes pressure smartphone AP market
Introduction
Monday 20 April 2026
Global wafer foundry industry and status, 2026: AI-driven growth and fierce competition
Introduction
Thursday 16 April 2026
Global Expansion of 2.5D/3D Packaging: Strategic Moves in the US, Asia, and Beyond
Introduction
Monday 30 March 2026
Taiwan wafer foundry industry, 1Q 2026 and 2026 forecast
Introduction
Friday 20 March 2026
Global top-3 memory maker status, 1Q 2026
Introduction
Monday 16 March 2026
Global smartphone AP industry, 4Q 2025
Introduction
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BIZ FOCUS
Sep 9, 08:00
IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
Tuesday 8 September 2026
Shining a Light on the Precision Behind AI and Data Infrastructure
Wednesday 2 September 2026
World Diamond Technology accelerates mass production of 300 mm diamond wafers
Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
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Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
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Nvidia Feynman pushes TSMC A16 and CPO ramp
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Taiwan Mobile moves into enterprise AI integration with Systex
Huawei orchestrates China's DUV lithography push to cut reliance on ASML
Apple yields to memory suppliers in historic strategy shift, with Kioxia tipped as NAND long-term agreement recipient
Update: US finalizes US$775 million in CHIPS quantum awards, with equity attached
ASML chooses Netherlands for major expansion after warning it could build abroad
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