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Wednesday 9 September 2026
Samsung-led EUR3B funding round nearly doubles Mistral's valuation
French AI startup Mistral has raised EUR3 billion (US$3.5 billion) in a funding round led by Samsung Electronics, nearly doubling its valuation as the company seeks to strengthen its...
Wednesday 9 September 2026
Arm expands push for agentic AI infrastructure with new Neoverse chip design
Arm is stepping up its role in AI infrastructure as cloud providers, original equipment makers, and software partners build systems for agentic AI, a shift that could affect data centers...
Wednesday 9 September 2026
Qualcomm to build custom AI inference chips for AWS
Qualcomm's multi-generation agreement to build customized AI inference silicon and optical interconnects for Amazon gives the company something its data center roadmap has lacked since...
Wednesday 9 September 2026
CSPs expand Malaysia AI server hubs as Southeast Asia grows
According to the latest DIGITIMES Intelligence report, US-based cloud service providers (CSPs) are expanding their footprint in Malaysia, with Microsoft and Google driving the next...
Wednesday 9 September 2026
Taiwan Mobile moves into enterprise AI integration with Systex
Taiwan Mobile kicked off its fourth annual Tech Day, "D.E.E.P. Tech Day 2026," on September 8. This year's event centered on Agentic AI, exploring enterprise strategy, platform technologies,...
Wednesday 9 September 2026
OpenAI taps Firmus for Malaysia data center capacity
OpenAI has signed a multi-year agreement with Australian AI infrastructure developer Firmus for dedicated computing capacity at two data center sites in Malaysia, becoming an anchor...
Wednesday 9 September 2026
Tesla's Cybercab hits the road, but regulation may become autonomy's next scaling bottleneck
Tesla has finally put its purpose-built Cybercab onto public streets, marking a critical step in Elon Musk's years-long ambition to transform the EV maker into an autonomous mobility...
Tuesday 8 September 2026
Renewable power shortage puts Taiwan's chip cluster under scrutiny
As semiconductor and AI infrastructure expansions elevate Taiwan's strategic profile on the global stage, mandates for a "green chip" supply chain are intensifying pressure on major...
Tuesday 8 September 2026
CIOE 2026 opens in Shenzhen: 5,000 exhibitors chase the AI-driven optics boom
The 27th China International Optoelectronic Exposition (CIOE 2026) will run September 9-11 in Shenzhen, bringing together more than 5,000 exhibitors from over 30 countries and regions...
Tuesday 8 September 2026
Sercomm revenue surges past 3Q25 on North America upgrades
Sercomm Corporation reported August revenue of NT$7.044 billion on the 7th, up 45% year-over-year, extending its run of monthly sales above NT$7 billion(US$222.1 million) to a third...
Tuesday 8 September 2026
Analysis: Imec's EUV edge raises question over how far Taiwan should replicate research fab model
If Taiwan's government is determined enough, finding funding and land for the Industrial Technology Research Institute (ITRI) or the National Institutes of Applied Research (NIAR)...
Tuesday 8 September 2026
Adata, Team Group post record August revenue as memory module makers build inventory for 2027
Major Taiwanese memory module manufacturers saw revenue remain at high levels in August 2026, as memory prices continued to rise. Adata Technology and Team Group both posted record-high...
Tuesday 8 September 2026
Shining a Light on the Precision Behind AI and Data Infrastructure

Discussion around advances in AI will often focus on model performance, chip launches, and compute scale. In practice, however, progress increasingly depends on something...

Tuesday 8 September 2026
SK Hynix weighs Gwangju investment as Yongin buildout continues
SK Hynix is considering accelerating investment in South Korea's planned Gwangju semiconductor cluster so that development proceeds alongside its ongoing Yongin buildout, rather than...
Tuesday 8 September 2026
Corning targets AI bottlenecks with glass substrates, optics for high-speed data transmission
As AI processors advance toward higher compute density, larger package footprints, and increased bandwidth demands, advanced packaging and high-speed data transmission have emerged...