News tagged copper foil at DIGITIMES

NEWS TAGGED COPPER FOIL

Monday 12 October 2026

Aurona Industries posts 19% September growth as Taiwan plant targets 2027 trial run

Aurona Industries reported September revenue of NT$137 million (US$4.3 million), up 19.29% from a year earlier, as pre-holiday inventory building in China strengthened customer orders...

Monday 12 October 2026

ICT inflation impact limited as supply shock falls short

Prices for electronic components such as memory, advanced copper foil, glass fiber cloth, and ABF substrates have been rising for some time as makers pass on costs amid tight supply...

Friday 18 September 2026

Nan Ya accelerates AI materials shift with major capacity expansion

Nan Ya Plastics is speeding up its transformation in electronic materials as cloud service providers expand capex at a rapid pace, making...

Wednesday 9 September 2026

Lotte Energy Materials pivots from EV weakness to AI, ESS copper foil

Cooling electric vehicle demand is forcing South Korean copper foil makers to rethink capital and capacity. Lotte Energy Materials has sold a 90% stake in its architectural exterior...

Tuesday 1 September 2026

South Korea CCL exports surge 42% on AI demand

South Korea's copper-clad laminate, or CCL, exports jumped sharply in the first seven months of 2026 as AI infrastructure investment and larger semiconductor packaging lifted demand,...

Monday 31 August 2026

Kingboard Laminates raises prices again as CCL shortages deepen

Kingboard Laminates, a leading Chinese copper-clad laminate (CCL) maker, has issued another price increase notice as shortages of core materials such as fiberglass cloth and copper...

Monday 6 July 2026

Kingboard raises CCL prices again as AI demand tightens PCB material supply

Rising demand for AI servers and high-performance computing (HPC) continues to drive price increases across the upstream PCB materials supply chain.

Thursday 11 June 2026

Nvidia takes PCB material competition upstream as HVLP4 copper foil gap widens

AI infrastructure demand is lifting high-end PCB orders, but fresh bottlenecks are emerging in the upstream copper-clad laminate (CCL) supply chain. T-glass glass fiber cloth remains...

Wednesday 10 June 2026

HVLP4 copper foil battle heats up as Nvidia courts Co-Tech

Co-Tech said on June 8, 2026, that Nvidia has directly approached it to discuss long-term capacity planning for high-end HVLP4 copper foil, as AI GPU and ASIC demand accelerates and...

Sunday 31 May 2026

Nan Ya Plastics targets three new business pillars to lift electronic materials to 60% by 2026

Nan Ya Plastics announced at its May 29 shareholders meeting that it would pivot into three new business areas — medical materials, semiconductor materials, and comprehensive...

Wednesday 15 April 2026

CCL price hikes to extend through 2026 with rising glass fiber and copper foil costs

Surging demand for high-end PCBs driven by AI servers and switches is intensifying supply imbalances for upstream materials. Industry...

Thursday 9 April 2026

AI chip demand tightens ABF substrate supply, three-year upcycle in sight

As AI CPUs, GPUs, and application-specific integrated circuits (ASICs) advance to new generations, they are driving a sharp increase in both substrate size and layer counts. Simultaneously,...

Friday 27 March 2026

PCB material shortages intensify as CCL lead times hit 6 months, quota system imposed

The surge in AI applications driving PCB material upgrades is exacerbating upstream raw material supply shortages. Notably, besides ongoing price hikes, some IC substrate makers report...

Monday 29 December 2025

South Korea's PNT secures first China copper foil order, expands into battery materials

South Korean PNT has secured its first mass-production order for battery copper foil in China, marking a strategic expansion beyond its core battery equipment business into materials...

Tuesday 2 December 2025

Copper shock, AI PCB demand recasts global CCL pricing

Costs for copper foil and electronic-grade glass fibre cloth are climbing at the same time that AI infrastructure build-out is fuelling strong demand for high-frequency, high-speed...

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Oct 15, 08:00

Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI

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