中文網
繁體
简体
SUBSCRIBE
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
Middle East
RESEARCH
OPINIONS
Opinions Home
Interviews
Commentary
Research Insights
Column
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
CES
Electronica
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Apple
Huawei
Nvidia
AI Search
Scaling AI Glasses
Inference Era AI
Advanced Packaging
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
Himax launches eDP TDDI for smart cockpit displays
Displays
23min ago
Nanoimprint tools see a shift from round to square substrates
Tomorrow's Headlines
Sep 9, 18:45
Taiwanese chipmakers step up visual sensing and motor drive for future robot market
Tomorrow's Headlines
Sep 9, 18:45
Shenzhen Huacheng XinGuang sees microLED optical interconnect is viable for data centers
Tomorrow's Headlines
Sep 9, 18:45
Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans
Tomorrow's Headlines
Sep 9, 18:45
Analysis: Is China's ASML gambit worth the cost as rivals pull ahead on EUV?
Tomorrow's Headlines
Sep 9, 18:45
NEWS TAGGED VOLTRONIC POWER TECHNOLOGY
Tuesday 14 April 2020
Voltronic expects UPS to drive growth
UPS and PV inverter ODM Voltronic Power Technology expects UPS used in servers at data centers and in 5G telecom facilities to drive its business growth, according to the company.
BIZ FOCUS
Sep 9, 08:00
IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
Tuesday 8 September 2026
Shining a Light on the Precision Behind AI and Data Infrastructure
Wednesday 2 September 2026
World Diamond Technology accelerates mass production of 300 mm diamond wafers
Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
MOST-READ
7 DAYS NEWS
Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense
OCP APAC 2026: TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek
Nvidia Feynman pushes TSMC A16 and CPO ramp
Update: ABF substrate maker Unimicron searched in origin-labeling probe
Apple's first foldable lands at US$1,999, and the constraint is the panel
Apple bets on new sensors and S11 chip to differentiate its 2026 watches
Apple names a 2nm node for the first time since 2024 — and raises prices on every iPhone it still sells
Taiwan Mobile moves into enterprise AI integration with Systex
Huawei orchestrates China's DUV lithography push to cut reliance on ASML
Full list
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first