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Global EV sales and battery capacity
May 20, 17:56
NEWS TAGGED TONG HSING ELECTRONIC INDUSTRIES
Thursday 28 April 2022
Strong demand for automotive CIS to buoy Tong Hsing 2022 sales
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has enjoyed strong demand for automotive...
Thursday 7 April 2022
Automotive CIS emerging as new blue-ocean market for supply chain
It seems that CMOS image sensor (CIS) demand momentum for mainstream handset applications has become stagnant amid unclear market prospects, but the automotive CIS segment is emerging...
Wednesday 6 April 2022
OSATs to face uphill battle to bolster capacity utilization in 2H22
Taiwan's OSATs will find it a major task for them to prevent their capacity utilization rates from falling in the second half of 2022 though they are poised to experience steady business...
Monday 28 March 2022
IDMs, backend partners expanding automotive CIS capacity
International IDMs such as Onsemi and Sony are keenly expanding capacities for automotive CMOS image sensors (CIS) to meet ever-mounting demand for ADAS applications, and their backend...
Friday 25 March 2022
Mixed levels of price reduction pressure looming for diverse IC segments
Different IC segments will be experiencing mixed levels of price downward pressure at least in the first half of the year, according to industry sources.
Wednesday 23 March 2022
Tong Hsing expects promising demand for automotive CIS devices
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has expressed optimism that its strong shipments...
Monday 14 March 2022
GaN-on-SiC targets base stations in growing LEO satellite market
Amid the ongoing Russian-Ukraine war, SpaceX CEO Elon Musk responded to a public request from a Ukrainian politician to provide Starlink satellite internet services to Ukraine. Ukraine...
Wednesday 9 February 2022
Automotive CIS packaging capacity fully loaded
Automotive CMOS image sensor (CIS) packaging capacity at Taiwan-based OSATs such as Tong Hsing Electronic Industries and Xintec remains fully loaded, and they can easily carry out...
Friday 24 December 2021
Taiwan backend houses step up deployments for 3rd-gen semiconductors
GEM Services and Lingsen Precision Industries, which specialize in power component and module backend services, and RF component and module packagers Tong Hsing Electronic Industries...
Tuesday 7 December 2021
Taiwan semiconductor players brace for GaN RF demand boom
With GaN-on-SiC RF components set to gain ground in 5G, satellite communications and national defense applications, Taiwan-based III-V semiconductor players including foundries Win...
Monday 13 September 2021
IDMs, Foxconn, BYD deepening deployments in GaN, SiC devices
International IDMs, Taiwan's EMS leader Foxconn and China's semiconductor and EV vendor BYD Group are all keenly deepening their deployments in third-generation semiconductors GaN...
Friday 10 September 2021
Foxconn to make SiC components at 6-inch fab for EV, solar apps
Foxconn (Hon Hai) Technology Group has disclosed that at its newly-acquired 6-inch wafer fab in Hsinchu, northern Taiwan, the company will be making SiC components and IR MEMS sensors...
Tuesday 24 August 2021
Tong Hsing to open new plant in 2022 for processing car CIS, SiC chips
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has held a beam-raising ceremony for its...
Monday 23 August 2021
Taiwan suppliers bracing for new business opportunities from SpaceX
There is still quite some distance to commercialization of satellite communications, but Taiwan makers in the supply chain of Starlink, an Internet satellite project by SpaceX, are...
Tuesday 17 August 2021
Backend houses enjoy strong influx of orders for automotive CIS
Taiwan-based backend houses, including Tong Hsing Electronic Industries, King Yuan Electronics (KYEC), and Xintec, have seen orders from international IDMs continue ramping up for...
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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