Tong Hsing Electronic, a major backend services provider for CMOS image sensors (CIS), reported that while first-quarter operations saw a slight year-over-year decline, performance...
Tong Hsing Electronic, a semiconductor packaging service and substrate provider, has forecast a mid single-digit quarter-over-quarter decline in revenue for the first quarter of 2025...
The semiconductor packaging specialist and Yaego Group affiliate Tong Hsing Electronics reported that seasonal patterns in 2024 have differed from previous years, with revenue remaining...
CMOS image sensor (CIS) packaging house Tong Hsing Electronic expects modest sequential shipment growth in the fourth quarter of 2023, as communication module and car sales momentum...
Tong Hsing Electronic Industries, VisEra Technologies, and Xintec, all of whom are in the CMOS image sensor (CIS) backend sector, have expressed caution regarding their market prospects...
Tong Hsing Electronics, a major backend services provider for CMOS image sensors (CIS), expects the handset market to remain weak throughout 2023, with demand sliding faster than...
Taiwan-based CMOS imagery sensor (CIS) packaging giant Tong Hsing Electronics, an affiliate of the Yageo Group, has been working actively to make adjustments to its shareholding in...
Tong Hsing Electronic Industries has revised its automotive CIS business outlook from highly optimistic to just positive, according to the packaging house.
With its importance significantly highlighted during the Russia-Ukraine war, low-earth orbit (LEO) satellite communications will usher in enormous business opportunities for III-V...
CIS packaging and testing firm Tong Hsing Electronic is expected to see sales generated from the automotive applications register a high single-digit percentage growth in 2023.
China-based CMOS image sensor (CIS) supplier OmniVision Technologies continues the release of new products despite market downturns, focusing on handset, automotive and metaverse...
Lackluster handset sales have led to excess inventories of related CMOS image sensors (CIS), also dragging down wafer reconstitution (RW) demand, according to industry sources.
