Thursday 23 November 2023
CMOS packaging specialist Tong Hsing expects modest growth in 4Q23
CMOS image sensor (CIS) packaging house Tong Hsing Electronic expects modest sequential shipment growth in the fourth quarter of 2023, as communication module and car sales momentum...
Tuesday 15 August 2023
CIS backend houses express caution about 2H23
Tong Hsing Electronic Industries, VisEra Technologies, and Xintec, all of whom are in the CMOS image sensor (CIS) backend sector, have expressed caution regarding their market prospects...
Friday 21 April 2023
CIS packaging house Tong Hsing less optimistic about automotive demand
Tong Hsing Electronic Industries has revised its automotive CIS business outlook from highly optimistic to just positive, according to the packaging house.
Thursday 13 April 2023
III-V semiconductor suppliers & IC inspection labs poised to embrace LEO satellite business
With its importance significantly highlighted during the Russia-Ukraine war, low-earth orbit (LEO) satellite communications will usher in enormous business opportunities for III-V...
Monday 20 March 2023
CIS packagers enjoy stable demand for high-end auto applications
BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with...
Wednesday 28 September 2022
Handset CIS destocking slow
Lackluster handset sales have led to excess inventories of related CMOS image sensors (CIS), also dragging down wafer reconstitution (RW) demand, according to industry sources.
Wednesday 17 August 2022
Tong Hsing building new plant in Taiwan
CMOS image sensor (CIS) packaging service provider Tong Hsing Electronic Industries is constructing its fourth plant in northern Taiwan, with the facility to begin production in the...
Wednesday 13 July 2022
Taiwan CIS backend firms look to automotive for 2H22 growth
CMOS image sensor backend specialists including Tong Hsing Electronic Industries and Xintec are vying for more orders coming from the automotive sector to offset weakness in handset...
Thursday 23 June 2022
Automotive CIS backend may incorporate RW technology
Like handset CMOS image sensors, automotive CIS will likely be built based on the backend wafer reconstruction technology for a shorter verification cycle, according to industry so...
Thursday 9 June 2022
Tong Hsing grows revenues from automotive, satellite applications
CMOS image sensor (CIS) packaging specialist Tong Hsing Electronic Industries is poised to see revenue contribution ratio for automotive applications climb to over 45% in 2022, and...
Thursday 28 April 2022
Strong demand for automotive CIS to buoy Tong Hsing 2022 sales
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has enjoyed strong demand for automotive...
Thursday 7 April 2022
Automotive CIS emerging as new blue-ocean market for supply chain
It seems that CMOS image sensor (CIS) demand momentum for mainstream handset applications has become stagnant amid unclear market prospects, but the automotive CIS segment is emerging...
Wednesday 6 April 2022
OSATs to face uphill battle to bolster capacity utilization in 2H22
Taiwan's OSATs will find it a major task for them to prevent their capacity utilization rates from falling in the second half of 2022 though they are poised to experience steady business...
Monday 28 March 2022
IDMs, backend partners expanding automotive CIS capacity
International IDMs such as Onsemi and Sony are keenly expanding capacities for automotive CMOS image sensors (CIS) to meet ever-mounting demand for ADAS applications, and their backend...
Friday 25 March 2022
Mixed levels of price reduction pressure looming for diverse IC segments
Different IC segments will be experiencing mixed levels of price downward pressure at least in the first half of the year, according to industry sources.
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