Huawei has recently launched its Pura 70 series smartphones featuring its in-house developed Kirin 9010 application processors made using SMIC's 7nm N+2 manufacturing process.
The AI boom is driving chipmaking advancements, with Co-Packaged Optics (CPO) promising to stake a claim as a favored semiconductor packaging technology along with CoWoS.
The US will triple its domestic semiconductor manufacturing capacity from 2022—when the CHIPS and Science Act (CHIPS) was enacted—to 2032. The projected 203% growth is...
Taiwan-Asia Semiconductor Corporation (TASC), in its transition from optoelectronic sensing, reported a post-tax loss of NT$38 million in the first quarter of 2024.
Tata Electronics reportedly shipped packaged chip samples to potential customers in several countries. It is in the final stages of tape-out for chips in 28-65nm, indicating the progress...
Taiwan's prowess in semiconductors cannot be underestimated, exceeding even that of Intel, and the 10-year NT$300 billion Taiwan Chip-driven Industrial Innovation Program (TCIIP)...
Penang state boasts Malaysia's most comprehensive semiconductor ecosystem, and the state government remains committed to collaborating with the federal government to attract investments...
