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Thursday 3 September 2026
Huawei, Xiaomi to launch new foldable smartphones ahead of Apple
Samsung Electronics launched its new Galaxy Z series foldable smartphones, including its first wide-folding model, kicking off this year's foldable smartphone battle. With attention...
Thursday 3 September 2026
Solomon leverages AI vision and optical tech to tap semiconductor inspection market
Solomon Technology, a Taiwanese artificial intelligence (AI) 3D vision company, is showcasing two key inspection applications that integrate its core AI vision and optical technologies...
Thursday 3 September 2026
Analysis: India's fast-growing FWA market may widen, but suppliers still face margin pressure
India's fixed wireless access (FWA) market is expanding quickly as 5G rollouts accelerate and policymakers push local manufacturing, but Taiwanese networking suppliers say the opportunity...
Thursday 3 September 2026
Samsung Electro-Mechanics eyes 30% MLCC price hikes, ABF up too
Samsung Electro-Mechanics (SEMCO) is set to expand the scope of its price increases, with market reports saying the company will raise direct-supply prices for multilayer ceramic capacitors...
Thursday 3 September 2026
Global smartphone outlook cut again as foldables shine
Global smartphone shipments are facing renewed downside pressure in 2026 as memory prices rise, handset makers pass on higher costs, and brands trim low-end models to protect margins...
Wednesday 2 September 2026
Nvidia and Micron top NT$4.4T in Taiwan investment
On the eve of the opening of SEMICON Taiwan 2026, the Ministry of Economic Affairs (MOEA) hosted the Semicon Network Summit, where President Ching-Te Lai said Nvidia invests and procures...
Wednesday 2 September 2026
Samsung, SK Hynix inventories surge as valuation reserves fall
Samsung Electronics and SK Hynix ended the first half of 2026 holding sharply more inventory than six months earlier, an unusual development in a memory market where demand continues...
Wednesday 2 September 2026
Semicon Taiwan 2026 to test cloud AI investment boom
Cloud AI capital expenditure continues to shatter market expectations, sparking growing concerns over whether the spending surge is overheating and heading toward a bubble. Semicon...
Wednesday 2 September 2026
Certain Micro targets AI test-interface demand with three Semicon products
As Semicon Taiwan 2026 gets underway, semiconductor test-interface structural parts maker Certain Micro Application Technology (CMAT) announced three core product lines aimed at rising...
Wednesday 2 September 2026
MediaTek pushes advanced packaging and supply chain to keep pace with AI
Speaking at the 3DIC Global Summit at SEMICON Taiwan 2026, MediaTek general manager T.Y. Lau revealed the publicly disclosed cost structure of the B200 accelerator, saying that after...
Wednesday 2 September 2026
Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center
Marvell SVP and chief technology officer Radha Nagarajan offered a clearer timeline for the commercialisation of co-packaged optics, or CPO, during a media briefing at SEMICON Taiwan...
Wednesday 2 September 2026
TCL CSOT bets on InP laser chips as supply tightens
Indium phosphide (InP) is emerging as one of the tightest supply constraints in AI data-center optical interconnects. Lumentum CEO Michael Hurlston has said publicly that the supply-demand...
Wednesday 2 September 2026
MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments
Sonix Technology expects consumer IC and MCU sales to keep growing in the second half of 2026, but memory shortages could slow imaging-product shipments. AI-driven demand is also squeezing...
Wednesday 2 September 2026
Gemtek deepens partnership with India's Dixon Technologies to expand optical transceiver, connectivity footprint
Gemtek Technology announced that it is deepening its strategic cooperation with India's Dixon Technologies through their joint venture in India, expanding the manufacturing and market...
Wednesday 2 September 2026
Innolux targets advanced packaging with debut of Chip Last tech
Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous...