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Wednesday 22 April 2026
Flagship smartphone SoCs upgrade to 2nm drives cost surge and brand procurement shifts
Starting in the second half of 2026, all flagship smartphone SoCs will transition to the 2nm process node. While this promises enhanced performance for flagship devices, it also triggers...
Wednesday 22 April 2026
ASM International reports 16% growth in 1Q26 revenue driven by booming AI market
ASM International reported a high revenue in the first quarter of 2026, driven by surging AI demand and its need for advanced...
Wednesday 22 April 2026
Huawei's wide foldable move sets stage for Apple, Samsung three-way race

Huawei's Pura X Max launch marks a shift in the foldable smartphone market, with competition moving from a Samsung-Huawei duopoly toward...

Wednesday 22 April 2026
China pledges to stabilize memory chip supply as industrial growth and AI-driven manufacturing expand
China's industrial economy posted steady first-quarter 2026 growth, driven by strong performance in high-tech manufacturing and broad sectoral expansion, according to Ministry of Industry...
Wednesday 22 April 2026
Allbirds outlines AI pivot backed by US$50 million financing, draws mixed reaction
Struggling footwear brand Allbirds has announced plans to pivot to artificial intelligence (AI) infrastructure, supported by a US$50 million convertible financing facility, as it exits...
Wednesday 22 April 2026
Commentary: Apple CEO change sounds alarm for China suppliers
Apple has named hardware engineering chief John Ternus as chief executive, replacing Tim Cook after 15 years — a move that signals a strategic shift. While succession talk had...
Wednesday 22 April 2026
Apple's US$4 trillion leadership transition: will decision-making return to engineers?
Apple officially announced on April 21, 2026, that Senior Vice President of Hardware Engineering John Ternus will take over as CEO starting September 1 this year, while current CEO...
Wednesday 22 April 2026
MiTAC expands production across US, Vietnam and Taiwan as units gear up for growth
MiTAC Holdings' simultaneous expansion of production across the US, Vietnam, and Taiwan is designed to reassure global customers amid mounting geopolitical and supply uncertainties...
Wednesday 22 April 2026
US FCC router rules rattle industry, but Taiwan vendors see silver lining
A new US regulatory push to scrutinize foreign-made consumer routers on national security grounds is raising questions across the global networking industry. Yet for Taiwan's key equipment...
Wednesday 22 April 2026
CXMT fills LPDDR4X gap as non-China CSPs seek capacity
Memory giant ChangXin Memory Technologies (CXMT) is stepping in to fill the consumer market shortfall left by Samsung Electronics' planned phase-out of LPDDR4X production. With memory...
Wednesday 22 April 2026
BYD seeks role in Europe's auto lobby as Chinese carmakers gain ground
On April 20, BYD formally applied to join the European Automobile Manufacturers' Association (ACEA) and has begun discussions with the group, according to foreign media reports. If...
Wednesday 22 April 2026
Analysis: Tesla's chip ambitions drive a wedge between Samsung and Intel
Tesla's Terafab project is accelerating, with the company targeting substantial in-house chip production to support autonomous driving, robotaxis, humanoid robots, and AI infrastructure...
Tuesday 21 April 2026
BYD reassesses Malaysia factory project as talks stall with the government

In August 2025, the Chinese electric vehicle (EV) maker BYD announced plans to build a completely knocked-down (CKD) assembly plant at the...

Tuesday 21 April 2026
BOE loses momentum as Samsung Display supplies nearly 60% of iPhone panels
According to The Korea Economic Daily, market research firm Omdia statistics show that in the 2025 iPhone display market, Samsung Display (SDC) ranked first with a 56.8% supply...
Tuesday 21 April 2026
Beijing acts on memory price surge, AI demand reshapes device costs

China's Ministry of Industry and Information Technology (MIIT) is stepping in to steady the memory supply chain after a sharp rise in DRAM...