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Thursday 12 November 2026
Tekscend's cost strategy and global edge
As global foundry capacity expands and market dynamics shift, competitive pressures have intensified significantly across major manufacturing regions, particularly in mature process...
Thursday 12 November 2026
AUO and Innolux target 2028 commercial breakthrough in semiconductor packaging
Faced with sluggish end-user demand, chronic overcapacity, and intensifying market competition, global display manufacturers are under pressure to reinvent themselves. In Taiwan, leading...
Thursday 12 November 2026
TSMC sees surging AI chip demand, highlights advanced packaging and physical AI opportunities
TSMC is facing unprecedented demand for its advanced chips as artificial intelligence (AI) infrastructure investment accelerates, with advanced packaging and emerging physical AI applications...
Thursday 12 November 2026
Lite-On eyes CPO expansion as advanced optocouplers drive 2027 growth

Despite soaring costs and intense competition capping overall LED market growth at a modest 3% to 4%, Lite-On Technology's Optoelectronics Business...

Thursday 12 November 2026
Wolfspeed returns to GaN as CEO touts vertical integration
US silicon carbide (SiC) giant Wolfspeed will re-enter the gallium nitride (GaN) market through a vertically integrated model and expand into the GaN-on-silicon (GaN-on-Si) power device...
Thursday 12 November 2026
SoftBank takes JPY768 billion AI hit, rethinks equipment strategy
SoftBank Group (SBG) posted a JPY768 billion (approximately US$4.85 billion) net loss for the first half of fiscal 2026, from April to September 2026, its first loss in nearly two...
Thursday 12 November 2026
HKC’s Mianyang Gen 6 OLED investment faces delays
China’s HKC has again stalled its OLED expansion, with equipment orders for its Gen 6 OLED line in Mianyang, Sichuan, yet to be placed despite plans for deposition equipment...
Wednesday 11 November 2026
Intel targets agentic AI with GPUs, Xeon
Intel is expanding its CPU and GPU portfolio with the Intel GPU D-series, code-named Crescent Island, and next-generation Xeon processors, code-named Diamond Rapids, targeting large-model...
Wednesday 11 November 2026
TSMC unlikely to enter 3D DRAM; CXMT expansion a bigger threat
Charles Kau, chairman of IEMC, said TSMC "cannot make 3D DRAM," dismissing reports that the foundry is evaluating entry into the next-generation memory market at Nvidia's request....
Wednesday 11 November 2026
Advantech's Korea business grows 67% in first three quarters, says incoming CEO
Advantech's South Korean business grew 67% in the first three quarters of 2026, as industrial equipment, networking and cloud infrastructure, and healthcare remained its largest local...
Wednesday 11 November 2026
Global regulators tighten smart glasses rules, testing Meta, Amazon
As smart glasses move from technology showcases into the consumer market, their resemblance to ordinary eyewear and ability to record images or audio without others' knowledge are...
Wednesday 11 November 2026
Powerlogic revenue falls 39% as AI chip shortages hit gaming
Powerlogic said the rapid growth of global AI applications has diverted chips and key components toward the AI market, disrupting gaming hardware supply chains and customer purchasing...
Wednesday 11 November 2026
Anthropic expands its business suite amid its IPO filing and launch of Fable 5.2 and Mythos 5.2
Anthropic is taking direct aim at the enterprise productivity market dominated by Microsoft and Alphabet's Google. Beyond its core strength in software engineering, the company is...
Wednesday 11 November 2026
SynPower and AblePrint to co-develop equipment to curb substrate warpage
SynPower has signed a strategic cooperation agreement with AblePrint Technology (APT) to jointly develop substrate equipment with warpage suppression annealing system (WSAS) functions,...