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Thursday 20 August 2026
OpenAI signals IPO could wait until 2027 as Anthropic weighs listing

OpenAI told employees it could go public in 2027, though an earlier listing remains possible if operating conditions improve. According...

Thursday 20 August 2026
Chinese SiC substrate maker SICC hits record Q2; 8-inch wafers top 50% of core revenue

SICC reported stronger first-half 2026 revenue and margins as its 8-inch silicon carbide substrate business gained scale, highlighting...

Thursday 20 August 2026
Taiwan chip designers see automotive demand rebound
Major European and US companies and Taiwan-based IC design firms are seeing a notable recovery in automotive chip demand so far in 2026, spanning smart cockpit platforms, advanced...
Thursday 20 August 2026
Beyond Starlink: the LEO satellite market enters a multi-constellation race
For years, SpaceX's Starlink has defined the commercial low-Earth-orbit (LEO) satellite market, transforming satellite connectivity from a niche communications technology into a global...
Thursday 20 August 2026
AI server market CAGR nears 40%; rack power density surging 100-fold poses grid strain
Speaking at the 2026 Taiwan AI Academy Annual Conference held on August 18 at Academia Sinica's Social Sciences building, Neo Yao, CEO of Foxconn's Visionbay.ai, and Huang-Jen Chiu,...
Thursday 20 August 2026
YMTC parent advances IPO as NAND share hits 14% and AI storage scales
Yangtze Memory Technologies Holding, the parent of Chinese NAND flash maker YMTC, has completed a key stage of its pre-IPO process just as the memory maker gains global market share,...
Thursday 20 August 2026
Gamers pivot to high-margin peripherals as PC price pressures drive double-digit growth in gaming monitors

High PC hardware prices are pushing gamers to delay full-system replacements and redirect their budgets toward targeted upgrades, driving...

Thursday 20 August 2026
Sunplus expects automotive orders to rise in 3Q26 as memory costs threaten demand

Taiwanese IC design house Sunplus Technology expects its automotive orders to strengthen further in the third quarter of 2026, but warned...

Thursday 20 August 2026
AI chip strategies echo StarCraft factions as memory bottleneck reshapes the race

The global semiconductor ecosystem is facing an unprecedented shortage of memory chips, with hardware growth increasingly constrained...

Thursday 20 August 2026
Chroma's Proprietary ASIC Technology Reshapes the Semiconductor Test Landscape

As demand for AI servers, high performance computing (HPC), and data center infrastructure accelerates, the semiconductor and power electronics test equipment market...

Wednesday 19 August 2026
SK hynix Accelerates 40 Trillion won Share Repurchase and Cancellation

SK hynix Inc. (or "the company", www.skhynix.com) announced today that its Board of Directors has approved a resolution to repurchase and fully cancel 40 trillion won...

Wednesday 19 August 2026
Taiwan seeks shift from drone supplier to strategic partner in entering US market
Industry figures and analysts from Taiwan and the United States gathered on August 19 at an international unmanned aerial vehicles (UAVs) forum to discuss how Taiwan can move beyond...
Wednesday 19 August 2026
Taiwan Mobile sees Systex deal as AI-driven expansion play, targets 14% ICT market share
Taiwan Mobile (TWM) recently announced a tender offer for Systex, setting a goal of doubling its share of Taiwan's information services market from 7% to 14% within six years. TWM...
Wednesday 19 August 2026
Tatung to complete self-built AI data center PoC by September, secures edge AI order
Taiwan's Tatung held an earnings call on August 18, during which company president Sung-pin Chang stated that the group's self-built artificial intelligence (AI) data center proof...
Wednesday 19 August 2026
PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips
As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...