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Global EV sales and battery capacity
May 20, 17:56
NEWS TAGGED NOR
Tuesday 3 May 2022
Specialty memory vendor ESMT remains upbeat about 2022 sales
Taiwan's specialty memory IC design house Elite Semiconductor Memory Technology (ESMT) is still striving to rake in record revenues for 2022 despite posting lackluster business results...
Wednesday 27 April 2022
Macronix to kick off production at new 12-inch fab at end-2022
Macronix International, a maker of mask ROM and NOR flash memory, expects to kick off production in small volume at its new 12-inch fab at the end of 2022.
Wednesday 20 April 2022
GigaDevice posts profit hike in 1Q22
China's GigaDevice, which specializes in NOR flash memory, has reported net profits surged 126.1% on year to CNY681 million (US$106.5 million) in the first quarter of 2022.
Wednesday 23 March 2022
NOR flash supply stays tight
The supply of NOR flash memory particularly high-density chips remains tight, but suppliers are only capable of raising prices for part of their high-end products, according to industry...
Wednesday 23 February 2022
Macronix, Winbond gaining market share
Macronix International and Winbond Electronics, with their combined share of the global NOR flash market exceeding 55% in the second half of 2021, are both looking to gain more market...
Monday 14 February 2022
Winbond to boost 20nm chip output at new fab in southern Taiwan
Specialty DRAM and flash memory chipmaker Winbond Electronics expects to ramp up monthly output at its new 12-inch fab in Kaohsiung, southern Taiwan to 10,000 wafers by the fourth...
Thursday 10 February 2022
Taiwan memory chipmakers to enjoy strong 1Q22
With their January revenues all registering on-year increases greater than 20%, Taiwan's memory chipmakers Nanya Technology, Macronix International, and Winbond Electronics are poised...
Thursday 20 January 2022
Backend firms see influx of short lead-time orders from Micron
Taiwan-based backend houses, such as ChipMOS Technology, have recently landed an influx of short lead-time orders for DRAM memory from Micron Technology, according to industry sour...
Thursday 13 January 2022
ESMT sees bullish NOR flash prices
NOR flash contract prices are poised to stay flat sequentially in the first quarter of 2022 and will rise through the third quarter, according to MC Chang, president for memory IC...
Wednesday 12 January 2022
Global NOR flash supply to remain tight in 2022
NOR flash bit demand will continue to rise in 2022 while growth on the supply side remains limited, with tight supply of the memory to continue this year, according to industry sou...
Tuesday 11 January 2022
Taiwan fabless chipmakers see limited impact from power outage at Hua Hong fabs
A recent power outage at Hua Hong Semiconductor's wafer fabs located at the Zhangjiang Hi-Tech Park, Shanghai has so far had a limited impact on Taiwan-based fabless chipmakers' deliveries,...
Friday 7 January 2022
NOR flash suppliers scaling up output for AirPods
Apple has stepped up its chip purchases for the AirPods as sales of the wireless earbuds turned out to be strong at the end of 2021, according to industry sources. Apple is also gearing...
Wednesday 15 December 2021
GigaDevice expects NOR flash demand to remain robust through 2022
China's GigaDevice, which specializes in NOR flash memory, has said it remains optimistic about market conditions in the fourth quarter of 2021 and next year.
Tuesday 14 December 2021
China memory startup gains support from Big Fund
China's National Semiconductor Industry Investment Fund (aka the Big Fund) has made about CNY99.5 million (US$15.64 million) worth of investment in Dosilicon, which specializes in...
Thursday 9 December 2021
Macronix, Winbond remain upbeat about market outlook
Despite a recent slowdown in customer demand, both Macronix International and Winbond Electronics remain upbeat about end-market demand next year.
Monday 11 June 2018
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.
Thursday 29 June 2017
Winbond NOR flash for IoT
Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of its lowest-voltage SpiFlash memories to date. At 1.2 and 1.5V, and in 8-pin packages, these newest members of the SpiFlash family provide designers with serial flash memories for audio, wearable, IoT and other demanding applications that call for low power in small packages. The 1.2V products cover an operating voltage range from 1.14V to 1.3V, which is ideal for very-low-power designs, Winbond said. The 1.5V devices have a wider operating voltage range, from 1.14V through 1.6V. The first product in the family, the W25Q80NE at 8Mb density at 1.2V is available in samples and will be available in production in the beginning of 2018, according to Winbond. The rest of the family of products ranging from 1Mb through 128Mb density at 1.2V, and wide range from 1.5V to 1.2V will follow.
Wednesday 30 March 2016
Winbond SpiStack memories
Winbond Electronics has announced an expansion of its flash product portfolio with the introduction of a family of stackable SpiFlash memory devices. The new SpiStack W25M Series is Winbond's first to allow the "stacking" of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and/or data storage, while providing designers with the flash solutions most appropriate for their design requirements. The Winbond SpiStack W25M series provides a wide range of densities in the well-established 8-pin package to which designers are accustomed. Additionally, W25M memories feature the popular, multi-IO SpiFlash interface and command set. SpiStack homogeneous memories are achieved by stacking SpiFlash dies. For example, two 256Mb dies combining to form a single SpiFlash 512Mb NOR memory in the industry-standard 8-pin 8x6mm WSON package. Winbond's stacked product, W25M512JV, is also available in the widely used 16-pin SOIC or 24-pad BGA packages and is sampling now. SpiStack heterogeneous memories call for the stacking of a NOR memory with a NAND die, such as a 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die, which gives designers the flexibility to store code in the NOR die and data in the NAND memory. Winbond's SpiFlash memory devices are manufactured at the company's 12-inch wafer fabrication facility in Taichung, Taiwan.
May 19, 12:09
Computex Focus: DataVan to showcase new retail solutions for new normal
Thursday 19 May 2022
STAr Technologies unveils one-touch memory test probe card
Wednesday 18 May 2022
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Datacenters to become biggest consumer of NAND flash in 2023-2024
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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