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Wednesday 14 June 2023
SPIL cuts into Marvell supply chain, sources say
Siliconware Precision Industries (SPIL) with its 2.5D and fan-out packaging technology has cut into the supply chain of network processor vendor Marvell, according to industry sour...
Wednesday 14 June 2023
TSMC CoWoS attracts orders from major HPC and network processor vendors
AMD, Broadcom, Marvell, and Nvidia are among the largest consumers of TSMC's CoWoS (Chip-on-Wafer-on-Substrate) backend technology,
Friday 18 October 2019
MCU maker Holtek releases AI chip solution
Taiwan-based Holtek Semiconductor has developed its first AI chip solution to tap smart living application opportunities and has also launched a spate of new MCU products for automotive,...
Thursday 19 July 2018
AI-based xPUs proliferating as new growth driver for IC supply chains
With the advent of the 5G era, artificial intelligence (AI) applications will be in full swing, prompting chipmakers to develop multiple xPU chips beyond Intel's CPU and Nvidia's...
Thursday 23 March 2017
Samsung, eSilicon tape out 14nm network processor with Rambus 28G SerDes solution
Samsung Electronics has announced a successful network processor tape-out based on Samsung's 14LPP (Low-Power Plus) process technology in collaboration with eSilicon and Rambus. This...
Saturday 28 April 2012
Broadcom launches first 100Gbps full duplex network processor
Broadcom recently announced the industry's first 100Gbps full duplex network processor unit (NPU). Targeting the next wave of 100GbE switches and routers for service provider networks,...
CPC
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research