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NEWS TAGGED MOBINNOVA
Thursday 29 October 2009
FIH to consolidate handset R&D units within Foxconn Group
Foxconn International Holdings (FIH) plans to consolidate a total of eight handset R&D units belonging to member companies within the Foxconn Group, including Foxconn Electronics,...
Thursday 24 September 2009
Nvidia showcases Tegra-based smartbook made by Foxconn
Nvidia has showcased a Tegra-based 8.9-inch smartbook designed by Mobinnova and manufactured by Foxconn Electronics (Hon Hai Precision Industry). The smartbook has already received...
Monday 3 August 2009
Flood of ARM-based Snapdragon and Tegra smartbooks to hit market in 4Q09
An array of smartbooks built around ARM-based Snapdragon or Tegra processors from a mix of players, including Acer, Foxconn Electronics, Pegatron Technology, Compal Electronics and...
Monday 6 July 2009
Mobinnova shipping Android-powered handsets to Russia-based Vobis Computer, says paper
Taiwan-based handset maker Mobinnova, an affiliate company under the Foxconn Group, has converted its Windows Mobile-based smartphone, the Mobinnova Ice, to support the Android platform,...
Tuesday 23 December 2008
Sony Ericsson to swtich smartphone production partner from HTC to Mobinnova, says paper
Sony Ericsson plans to outsource its second Windows Mobile-based smartphone to Taiwan-based Mobinnova, a handset maker under Foxconn Electronics (Hon Hai Precision Industry), instead...
Mar 28, 10:03
ThroughTek to unveil latest cloud VMS at ISC West 2023
Tuesday 28 March 2023
Avalue announces ATX server board based on latest 4th generation Intel Xeon SP CPU
Thursday 16 March 2023
NeoGene unlocks direct-to-silicon liquid cooling technology by novel IC package approach
Thursday 9 March 2023
Fibocom collaborates with MediaTek to pioneer FWA market with fast-to-deploy 5G solution based on FG370 module at MWC 2023
Taiwan PCB makers moving production to Southeast Asia
Taiwan foundries see surge in orders transferred from China
Taiwanese, Korean chipmakers feel the heat of US capacity expansion ban against China
Technology leaders not taking sides in G2 tension by visiting China
Chipmakers to boost 300mm fab capacity to all-time high in 2026
India's Vedanta to make 28-65nm semiconductor chips for local demand
Taiwan OSATs quietly ramp up support for Chinese customers
Who's in control of SMIC technology advances?
TSMC 7nm process capacity utilization falling rapidly
More ban on semiconductor equipment to China accelerating tech decoupling
China vendors see smartphone shipments down on year in 4Q22 and 1Q23, says DIGITIMES Research
HPC applications most promising future outlet for IC designers in Taiwan
Exploring compound semiconductor applications: communication, fast charging, and energy applications
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