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    NEWS TAGGED MICRON
    Tuesday 10 June 2025
    YMTC sues Micron over 'spyware' allegations amid ongoing patent, IP battles
    Chinese memory chipmaker Yangtze Memory Technologies Co. (YMTC) has filed a federal lawsuit in Washington, DC, accusing US-based Micron Technology of launching a disinformation campaign...
    Tuesday 10 June 2025
    India approves Micron's investment plan in SEZ rule relaxation
    The Indian government has amended Special Economic Zone (SEZ) rules to support semiconductor and electronics component manufacturing, reducing the minimum land requirement from 50...
    Thursday 5 June 2025
    Hanmi Taiwan posts record growth as demand for maintenance services and component sales surge
    Hanmi Taiwan, the local subsidiary of South Korea's Hanmi Semiconductor, reported explosive growth in the first quarter of 2025, generating 76% of its entire 2024 revenue in just...
    Thursday 5 June 2025
    Micron takes lead in LPDDR5X race with early 1γ-based mobile memory shipment
    Micron Technology has begun mass production of its 1γ-based LPDDR5X memory, outpacing rivals Samsung Electronics and SK Hynix in the race to supply faster, low-power DRAM for...
    Wednesday 4 June 2025
    Samsung executives visit Nvidia headquarters to secure HBM supply deal
    Samsung Electronics memory division executives traveled to Nvidia's US headquarters in late May to advance large-scale high-bandwidth memory (HBM) supply arrangements, according to...
    Monday 26 May 2025
    Samsung edges toward Nvidia HBM3E approval, but SK Hynix remains dominant

    Samsung Electronics may clear Nvidia's certification for its 12-layer HBM3E memory, but industry sources say the achievement is unlikely...

    Friday 23 May 2025
    Samsung launches Dual-Site 1c DRAM expansion to bolster HBM4 leadership
    Samsung Electronics is doubling down on its leadership in advanced memory technology. Following its latest developments at the Pyeongtaek facility, industry sources report that Samsung...
    Friday 16 May 2025
    DDR4 market set for price war between Chinese and Taiwanese manufacturers after Samsung and SK Hynix exit
    According to New Daily, citing semiconductor industry sources, the DRAM giants Samsung Electronics, SK Hynix, and Micron plan to exit the DDR4 market by the first half of...
    Tuesday 13 May 2025
    CT Semiconductor expands Vietnam's first fully locally owned IC backend facility
    CT Semiconductor has begun the second phase of its chip packaging and testing plant in Vietnam, targeting 100 million chips annually by 2027. As the country's first fully locally...
    Friday 2 May 2025
    US$1 trillion AI rush: China's memory boom shakes global chip market
    China's rapid expansion of domestic memory chip production is creating market volatility and forcing established players to adjust their strategies amid already challenging geopolitical...
    Thursday 1 May 2025
    Samsung taps Llama 4 to close semiconductor gap with Hynix, Micron

    Samsung Electronics' Device Solutions (DS) division has begun deploying Meta's latest generative AI model, Llama 4, marking a strategic...

    Wednesday 30 April 2025
    Samsung reportedly exits HBM2E under Chinese price offensive, shifts focus to high-end market
    Samsung Electronics is cutting production of mature-node DDR4 memory and reportedly scaling back its third-generation high-bandwidth memory (HBM2E) business to focus resources on...
    Friday 25 April 2025
    Exclusive: Google considers HBM3E supplier change
    Samsung Electronics has recently intensified its deployment in advanced high bandwidth memory (HBM) processes. However, supply chain sources reveal that Samsung's HBM3E certification...
    Friday 25 April 2025
    JEDEC bends rules—Samsung, SK Hynix charge ahead in AI memory war
    JEDEC has relaxed the height specification for sixth-generation high bandwidth memory (HBM4), clearing a key obstacle for South Korean memory leaders Samsung Electronics and SK Hynix...
    Tuesday 22 April 2025
    Hanmi Semiconductor's tough stance against SK Hynix supported by large TC bonder order from Micron
    South Korean media outlets have reported that Hanmi Semiconductor has received additional orders for thermo-compression bonding (TCB) equipment from Micron Technology. Some industry...
    3/11 pages
    Research Report Database
    BIZ FOCUS
    Jul 9, 10:42
    TRI unveils new multi-camera AOI, TR7500 SIII Ultra
    Wednesday 9 July 2025
    How distribution is evolving in 2025
    Wednesday 9 July 2025
    AI apprentice available online; Profet AI facilitates manufacturing transformation and resolves industry challenges
    Monday 30 June 2025
    Why age verification online is facing more scrutiny in 2025
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES