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Tuesday 24 August 2021
Tong Hsing to open new plant in 2022 for processing car CIS, SiC chips
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has held a beam-raising ceremony for its...
Thursday 17 June 2021
Tong Hsing to expand packaging capacity for automotive CIS
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...
Monday 26 April 2021
Tong Hsing to raise quotes for ceramic substrates later in 2Q21
Taiwan's backend house Tong Hsing Electronic Industries is set to raise quotes for ceramic substrates later in the second quarter of the year in response to increasingly strong demand...
Wednesday 10 March 2021
Taiwan OSATs post revenue increases in February
Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...
Friday 6 November 2020
Taiwan backend houses see surging CIS orders from OmniVision
Taiwan's backend houses including Tong Hsing Electronic Industries, King Yuan Electronics (KYEC) and Xintec have seen orders from China-based CMOS image sensor (CIS) vendor OmniVision...
Wednesday 30 September 2020
CIS packager Tong Hsing to ramp up shipments for healthcare applications
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has been stepping up its deployment in the...
Friday 17 July 2020
CIS packager Tong Hsing breaks ground for new plant in Taiwan
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has broken ground for a new plant complex...
Friday 10 April 2020
Tong Hsing CIS, RF modules packaging business thriving on strong demand
Tong Hsing Electronic Industries, a specialist in wafer reconstruction, micro module assembly and backend services for CMOS image sensors and other niche ICs, continues to enjoy strong...
Tuesday 24 March 2020
CIS backend specialists expanding capacity
CMOS image sensor (CIS) backend specialists including Tong Hsing Electronic Industries and Xintec are expanding capacity seeking to satisfy growing demand for multi-lens camera pho...
Tuesday 10 March 2020
CIS backend firm Tong Hsing sees January-February revenues rise nearly 20%
Taiwan-based Tong Hsing Electronic Industries, dedicated to backend services for CMOS image sensors (CIS), saw its revenues rise 19.22% on year to NT$1.272 billion (US$ 42.34 million)...
Thursday 27 February 2020
CIS backend firm Tong Hsing to double capacity by end-2020
Taiwan-based Tong Hsing Electronic Industries, dedicated to backend services for CMOS image sensors (CIS), has disclosed plans to double monthly production capacity to 150,000-160,000...
Monday 30 December 2019
Tong Hsing, Kingpak to merge into heavyweight CIS packager in Taiwan
A heavyweight CMOS image sensor (CIS) packaging firm will be born in Taiwan soon, as Tong Hsing Electronic Industries, a handset CIS backend and wafer reconstruction specialist, has...
Friday 15 November 2019
Tong Hsing sees CIS packaging as major growth driver for 2020
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors and other niche ICs, expects its 2020 revenues to hit a new high on...
Friday 23 August 2019
Tong Hsing to see revenues rise through 4Q19
Tong Hsing Electronic Industries, which supplies ceramic substrates as well as packaging services for CMOS image sensors and other niche ICs, expects its revenues to pick up sequentially...
Monday 24 June 2019
Yageo chairman takes helm of Tong Hsing
Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...