Thursday 4 November 2021
MIH open ecosystem accelerates EV sector takeoff
From 5G wireless communications to electrical vehicles (EV), open architectures, such as open radio access network (O-RAN) and MIH open EV development platform, are serving as an...
Thursday 28 October 2021
Yageo sees mixed prospects for specialty, commodity passive components
Taiwan's leading passive components maker Yageo continues to enjoy strong demand for automotive and industrial applications, but its capacity utilization rate for commodity offerings...
Wednesday 27 October 2021
Software, semiconductor two major advantages for Taiwan to enter EV sector, says Foxconn chair
While EV is emerging as a new market arena for global automakers and tech players, Taiwan can take advantage of its strong prowess in software and semiconductor sectors to build a...
Wednesday 20 October 2021
Apple looking to diversify assemblers for Macs
Apple is looking to diversify its assemblers for the Mac series to include not only Taiwan-based Quanta Computer and Foxconn Technology but also a few China-based suppliers, according...
Tuesday 19 October 2021
Foxconn to promote localized EV production for regional markets
Foxconn Technology (Hon Hai) is well prepared to leverage its software and semiconductor prowess to turn out more EVs with high performance and intelligence in 2022/2023, and will...
Monday 18 October 2021
Foxconn unveils latest EV development achievements at HHTD21
Three new EV models, developed by Foxconn Technology under its MIH open platform over the past year, as well as related software and hardware solutions take center stage at the Hon...
Thursday 14 October 2021
Component suppliers see no cutback in orders for iPhone 13
Component suppliers for Apple's new iPhones have seen no cutback in orders thus far this year, in contrast to a media report indicating Apple may slash its projected iPhone 13 production...
Wednesday 15 September 2021
Apple to place orders for around 90 million units of iPhone 13 series for 2021
Apple will place orders for around 90 million units of the freshly launched iPhone 13 series with its upstream assemblers for 2021, Digitimes Research estimates.
Tuesday 7 September 2021
IDMs migrate to 8-inch wafer fabrication for 3rd-gen semiconductors
IDMs including Infineon, Rohm and STMicroelectronics are transitioning to 8-inch wafer fabrication for third-generation semiconductors such as GaN and SiC, according to industry so...
Friday 3 September 2021
New Apple Watch production to ramp up on schedule, sources say
Assemblers for the upcoming Apple Watch are scheduled to ramp up their output for the new model starting the end of September, according to industry sources.
Thursday 26 August 2021
Adlink expects revenue to top US$1 billion in 2025
Industrial computing device maker Adlink Technology expects its annual revenues grow steadily and top US$1 billion in 2025, with growth momentum mainly driven by the mounting penetration...
Friday 13 August 2021
ASE, ShunSin poised to embrace growing SiP demand
OSATs with SiP (system-in-package) technology, including ASE Technology and ShunSin Technology, are poised to gain from the ever-growing SiP demand for integrating heterogeneous chips...
Wednesday 28 July 2021
Foxconn installs advanced packaging equipment at China plant
Foxconn Technology (Hon Hai Precision Industry) has started installing equipment including lithography systems for high-end IC packaging at its chip plant in Qingdao, northeast China,...
Thursday 22 July 2021
Top chips makers reluctant to respond to India grants
In light of the global semiconductor demand surges and chip companies looking to avoid the risks from the trade war and supply chain storage, the India government has recently provided...
Wednesday 14 July 2021
Taiwan CIS backend firms to embrace strong 2H21
Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive...