CONNECT WITH US

CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough

, Taipei
0

Credit: DIGITIMES

To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures, raising the bar for hole positioning accuracy, micro-hole size,...

The article requires paid subscription. Subscribe Now