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Home Tech Semiconductors

TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity

Monica Chen

Monica Chen

, Hsinchu

Sep 15, 2026, 11:30 0

Credit: DIGITIMES

TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply models prompted the foundry to adjust its advanced capacity allocation...

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Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects

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