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Samsung Electro-Mechanics' glass-substrate rollout slows as TSMC evaluation drags on

, DIGITIMES, Taipei
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Samsung Electro-Mechanics facility in South Korea. Credit: Samsung Electro-Mechanics

Samsung Electro-Mechanics (Semco) is facing a slower glass-substrate rollout as a reliability evaluation of through-glass via (TGV) modules submitted to TSMC takes longer than expected, pushing back related equipment orders and adding pressure to a...

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