SEMICON

REALTIME NEWS

Marvell sees silicon photonics scaling from late 2027, with Taiwan and TSMC at the center

Manus resumes independent operations after Meta deal collapses

SDC to expand foldable iPhone OLED mass production in September

European chip ambitions hinge on more than subsidies, says TSMC

ByteDance-ZTE Nubia NaviX Ultra clears launch hurdle, takes agentic AI beyond smartphone assistants

Chinese foundry Hua Hong Grace adds 55,000-wpm Wuxi capacity in US$4.17 billion Phase III buildout

China's SeeYA wins Meta’s MR panel order as BOE misses certification

Tomorrow's Headlines

Qualcomm says HBC memory architecture offers better value than HBM as hyperscalers show interest

Tomorrow's Headlines

Huawei lifted R&D spending to push AI chips and semiconductor self-reliance

Tomorrow's Headlines

Innolux targets advanced packaging with debut of Chip Last tech

Rebecca Kuo

Rebecca Kuo

, Tainan

Sep 2, 2026, 08:24 0

Credit: DIGITIMES

Driven by the rapid growth of AI, high-performance computing (HPC), and automotive electronics, semiconductor architecture is shifting toward high-efficiency chiplets and heterogeneous integration...

The article requires paid subscription. Subscribe Now

LOGIN

Email address

Password

Keep me signed in

Keep me signed in

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

Enterprise first-time login?

Forgot your password?

Create your free account

Select premium stories & daily editor picks.
Leverage AI summaries for instant insights.
Receive tech briefings & newsletters.
Track financials & stock data of Taiwan tech.

No credit card required

Research_DB

World Diamond Technology accelerates mass production of 300 mm diamond wafers

reportAIglasses

MOST-READ
7 DAYS NEWS