marketing

REALTIME NEWS

IBM unveils dual-architecture mainframe chip to run Arm, z/OS, Linux workloads

Taiwanese suppliers expand China capacity with AI components in focus

Tomorrow's Headlines

Commentary: YMTC IPO highlights strong profits but three hurdles remain

Tomorrow's Headlines

Foxconn's China investment returns lead Taiwan peers on AI and HPC demand

Tomorrow's Headlines

Nvidia and SK Hynix diverge on CPO as 3D optics-centric design may arrive after 2030

Tomorrow's Headlines

Tactical drone market shifts as startups and incumbents compete and cooperate

Tomorrow's Headlines

Samsung pushes HBM toward logic as SK Hynix tackles packaging limits

Sherri Wang

Sherri Wang

, DIGITIMES, Taipei

Aug 25, 2026, 08:04 0

Credit: DIGITIMES

Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic and customer-specific functions into the HBM base die while SK Hynix...

The article requires paid subscription. Subscribe Now

LOGIN

Email address

Password

Keep me signed in

Keep me signed in

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Keep me signed in' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

Enterprise first-time login?

Forgot your password?

Create your free account

Select premium stories & daily editor picks.
Leverage AI summaries for instant insights.
Receive tech briefings & newsletters.
Track financials & stock data of Taiwan tech.

No credit card required

GlobalExhibition

STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility

reportAIglasses

MOST-READ
7 DAYS NEWS